Jetson AGX Orin module supports AI and robotics development

To help developers bring new AI and robotics applications to market, or to support existing projects, Nvidia has released the Jetson AGX Orin 32Byte production module.

Companies in the Nvidia Partner Network are offering commercially available products powered by the new module, which provides up to a six-fold performance improvement compared with the previous generation.

Developers can build and deploy Orin-powered systems with cameras, sensors, software and connectivity for edge AI, robotics, AIoT and embedded applications, proposed Nvidia.

The company envisaged applications in manufacturing, retail and construction to agriculture, logistics, healthcare, smart cities and last-mile delivery vehicles. Production-ready systems have options for peripherals to encourage creativity.

According to Nvidia’s Jetson partner ecosystem manager, Thejas Boggaram Shivashankar, the Jetson AGX Orion allows developers and engineers to handle multiple concurrent data streams for complex application environments without strict latency requirements, energy-efficiency constraints or issues with high-bandwidth wireless connectivity. 

The Jetson AGX Orin developer kit is capable of up to 275 trillion operations per second and supports multiple concurrent AI application pipelines with an Nvidia Ampere architecture GPU, together with deep learning and vision accelerators, high-speed I/O and fast memory bandwidth.

Using Jetson AGX Orin, he continued, customers can develop solutions using the largest and most complex AI models to solve problems such as natural language understanding, 3D perception and multi-sensor fusion.

The company announced four Jetson Orin-based production modules, with the Jetson AGX Orin 32Gbyte module available to purchase now, and the 64Gbyte version available in November, with two Orin NX production modules due later this year.

The production systems are supported by the Nvidia Jetson software stack to build and deploy fully accelerated AI.

The JetPack software development kit includes the Nvidia CUDA-X accelerated stack while Jetson Orin supports multiple Nvidia platforms and frameworks such as Isaac for robotics, DeepStream for computer vision, Riva for natural language understanding and TAO Toolkit to accelerate model development with pretrained models. There is also Metropolis, an application framework, set of developer tools and partner ecosystem that brings visual data and AI together to improve operational efficiency and safety across industries.

Carrier boards and full hardware systems options are available from Aaeon, Auvidea, Connect Tech, MiiVii, Plink-AI, Realtimes and TZTEK.

Over 350 camera and sensor options are available from Allied Vision, Appropho, Basler AG, e-Con Systems, Framos, Leopard Imaging, LIPS, Robosense, Shenzhen Sensing, Stereolabs, Thundersoft, Unicorecomm and Velodyne. These can support indoor/outdoor lighting conditions, as well as capabilities like lidars for mapping, localisation and navigation in robotics and autonomous machines.

Software support like device management, operating systems (Yocto and Realtime OS), AI software and toolkits, developers are available from Allxon, Cogniteam, Concurrent Realtime, Deci AI, DriveU, Novauto, RidgeRun, and Sequitur Labs.

Connectivity options, including WiFi 6/6E, LTE and 5G are offered by Telit, Quectel, Infineon and Silex.

http://www.nvidia.com

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750V SiC FETs in D2PAK extend Qorvo’s portfolio

Seven surface mount devices in the space saving D2PAK package have been added to Qorvo’s (formerly UnitedSiC) portfolio. The 750V SiC FETs are supplied in the surface mount D2PAK-7L package and are intended for onboard chargers, soft-switched DC/DC converters, battery charging (fast DC and industrial) and IT / server power supplies. According to Qorvo, they are suitable for high power applications that require maximum efficiency, low conduction losses and excellent cost effectiveness in a thermally enhanced package.

The Gen 4 UJ4/SC FETs are claimed to have the industry’s lowest RDS(on) of 9 mOhm at 650/750V. The 750V SiC FETs that make up the Gen 4 UJ4C/SC series are rated at 9.0, 11, 18, 23, 33, 44 and 60mOhm. According to Qorvo, this selection means that engineers have the flexibility to choose the device that can enable optimum cost/efficiency balance while maintaining generous design margins and circuit robustness. 

The latest additions use the cascode SiC FET technology introduced by UnitedSiC whereby a normally-on SiC JFET is co-packaged with a Si MOSFET to produce a normally-off SiC FET for low conduction losses in a small die.

Anup Bhalla, chief engineer at Qorvo, said, “The D2PAK-7L package reduces inductance from compact internal connection loops which ─ along with the included Kelvin source connection ─ results in low switching loss, enabling higher frequency operation and improved system power density. These devices also feature silver-sinter die attach, resulting in very low thermal resistance for maximum heat extraction on standard PCBs as well as IMS [insulated metal substrates] with liquid cooling.”

The 750V Gen 4 SiC FETs are available now in the D2PAK-7L package.

Qorvo provides radio frequency (RF) products, combining technology, systems-level expertise and global manufacturing to address complex technical challenges. Qorvo serves diverse market segments, including advanced wireless devices, wired and wireless networks and defence radar and communications. It also operates in the 5G networks, cloud computing, the IoT space and other emerging applications.

http://www.qorvo.com  

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Low capacitance diodes protect automotive data interfaces 

Robust ESD (electrostatic discharge) protection diodes have been added to Nexperia’s portfolio of low clamping and low capacitance ESD protection diodes. This portfolio is designed to protect high speed data lines such as USB 3.2, HDMI 2.0, LVDS, automotive A/V monitors, displays and cameras. It also aims to address the upcoming high speed video links and the OPEN Alliance MGbit Ethernet applications. 

The PESD5V0C1BLS-Q and PESD5V0C1ULS-Q are both two-pin single line devices supplied in compact DFN1006BD-2 packages. This is intended to optimise routing. The other new additions are the PESD5V0C2UM and PESD5V0C2UM-Q which are available as three-pin devices for both differential lines. They are supplied in a DFN1006-3 package which has side wettable flanks to enable automated optical inspection (AOI). 

All variants come in leadless packages to improve electrical performance and signal integrity.

ESD voltage clamping diodes protect data interfaces in automotive subsystems but developers have to be careful that they do not degrade data signal integrity or negatively impact the electromagnetic compatibility (EMC) performance of the systems. Nexperia claimed these diodes offer best-in-class signal integrity performance with capacitance as low as 0.3pF. 

These AEC-Q101 automotive-qualified devices exhibit deep snapback behaviour combined with a low resistance of 0.27 Ohm, for system level robustness and clamping performance in high speed data interfaces, said Nexperia.

Nexperia produces semiconductors: diodes, bipolar transistors, ESD protection devices, MOSFETs, GaN FETs and analogue and logic ICs. 

Headquartered in Nijmegen, the Netherlands, Nexperia meets the stringent standards set by the automotive industry. The company has employees across Asia, Europe and the USA. 

Nexperia is a subsidiary of Wingtech Technology and has an extensive IP portfolio and is certified to IATF 16949, ISO 9001, ISO 14001 and ISO 45001.

http://www.nexperia.com

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Synchronous boost converter raises efficiency in consumer devices

The AP72250 synchronous boost converter has been designed by Diodes for step-up conversion in consumer and industrial applications where small form factors are a priority. Target applications include battery-powered devices, USB power supply units, power banks, supercapacitor charging equipment and metering systems.

The AP72250 supports a 900kHz switching frequency with a 20 microA quiescent current (IQ). It covers a wide input voltage range between 0.6 and 5.5V, with a minimum 1.0V input start up. The output range is 1.7 to 5.5V. The device integrates  a 20 mOhm high side power MOSFET and a 26 mOhm low side power MOSFET.

Different operating modes can be selected and can be programmed according to users’ needs. Operating mode options are pulse frequency modulation (PFM), ultra-sonic mode (USM) and forced pulse width modulation (FPWM) mode. Engineers can therefore adjust operation under either heavy or light load conditions to maximise efficiency. According to Diodes, even when in light load situations, up to 89 per cent efficiency can be attained. The USM mode ensures that switching in the audible frequency range is prevented.

The AP72250 is claimed to deliver a seamless transition between boost and pass-through operation (in applications where this is required). The peak current mode control scheme allows it to handle a variety of input-to-output ratios. As a result, fewer external components are needed to support it than required by competing devices, said Diodes.

Under-voltage lockout, thermal shutdown, peak current limit, negative current limit, and output short circuit protection functions are also included.

The AP72250 is supplied in a WLCSP-12 package (measuring 1.75 x 1.35 x 0.45mm) and is available now.

Diodes provides semiconductors for companies in the consumer electronics, computing, communications, industrial, and automotive markets. Its portfolio includes discrete, analogue and mixed-signal products and packaging technology to meet customers’ needs. There are 32 sites worldwide, including engineering, testing, manufacturing, and customer service.

http://www.diodes.com

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