Multi-pixel driver supports CAN FD Light for automotive lighting

Linear current regulators from STMicroelectronics provide dynamic automotive lighting control using the CAN FD Light protocol. The driver is intended for use with OLED lamps for bright, homogeneous and high contrast lighting from a small surface area.

The L99LDLH32 has 32 regulated current sources, independently programmable from 1.0 to 15mA. The regulator can drive individual pixels in external and interior lighting applications. Global dimming is also provided, with eight-bit resolution. The driver is powered at the vehicle battery voltage and produces outputs of up to 35V to cover a wide emitter forward voltage spread.

The integrated CAN FD Light protocol handler and transceiver simplify connection to the vehicle’s communication infrastructure and controlling domain ECU (electronic control unit). CAN FD Light’s synchronised commander / responder communication is engineered for controlling simple devices such as lights and sensors. According to ST, this saves costly external components such as timing crystals. 

The data bandwidth of 1Mbit per second enables designers to create complex animated light patterns and permits smoothly modulated transitions and dimming.

On-chip memory cells allow programming of parameters, such as current level and PWM dimming for standalone operation, to provide a failsafe mode in the event of the communication bus or controller malfunction. 

The L99LDLH32’s features for functional safety include a fault-status pin, voltage and temperature monitors, a programmable timeout watchdog, short-circuit and open-load detection. In addition, frequency dithering minimises electromagnetic emissions.

Consequently, target applications include safety critical lighting such as taillights, stoplights, and turn indicators. 

The driver is monolithically integrated using ST’s BCD9sL process. It is AEC-Q100 qualified and packaged in a 7.0 x 7.0mm QFN48 device with wettable flanks and an exposed thermal pad to aid dissipation

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32-bit MCU offers functional safety, cybersecurity and AutoSAR compatibility

To support developers’ work to automate and connect end applications, Microchip has introduced the PIC32CM JH microcontroller. The 512kbyte flash, 5.0V, Dual CAN FD device delivers features typically only available on more expensive, higher performance devices, said Microchip. 

Automation and connectivity rely on industry standards related to functional safety and cybersecurity protection to ensure products operate safely and securely. To provide manufacturers with an MCU equipped with components that meet ISO 26262 functional safety and ISO/SAE 21434 cybersecurity engineering standards, the PIC32CM JH is the industry’s first MCU-based on the Arm Cortex-M0+ architecture with AutoSAR support, memory built-in self test (MBIST) and secure boot.

The PIC32CM JH is compatible with AutoSAR, an open software architecture, providing suppliers with the ability to change to lower-level hardware while keeping the original application code for ease of migration. AutoSAR-ready is designed to streamline the development process and reduce overall costs. When using AutoSAR, Microchip offers ASIL B microcontroller abstraction layers (MCALs) for functional safety applications, providing the lower-level hardware interface to the MCU. 

Automotive industry OEMs require both functional safety and cybersecurity protection for many in-vehicle applications including touch buttons and touch wheels, door controls and console controls, and body applications such as advanced driver assistance systems (ADAS). Pairing the PIC32CM JH with one of Microchip’s Trust Anchor TA100 CryptoAutomotive security ICs, complies to ISO/SAE 21434, the new Cybersecurity standard for automotive. The TA100 employs secure hardware-based cryptographic key storage and cryptographic counter measures to eliminate potential back doors linked to software weaknesses. 

Rod Drake vice president of Microchip Technology’s 32-bit MCU business unit, commented: “OEMs and other manufacturers now have the option to use an entry-level Arm Cortex-M0+ based MCU to meet compliance requirements previously only available on higher-end MCUs.”

The secure boot authenticates the code and prevents malicious code from being loaded onto the MCU. Other hardware features on the PIC32CM JH MCU are error correction code (ECC) with fault injection, loopbacks on the communications interfaces, system memory protection unit and MBIST. 

MBIST is the industry standard method of testing embedded memories and can quickly test the integrity of the SRAM to ensure it is functioning properly before the code is run to mitigate failures. To support developers with implementation, the PIC32CM JH has a safety manual, failure modes effects and diagnostic analysis (FMEDA) and diagnostic code targeting to ISO 26262 ASIL B. 

The PIC32CM JH also includes advanced touch with Driven Shield Plus, for noise and water tolerant operation. This feature is necessary for home appliances, industrial and automotive applications requiring touch operation in harsh environments.

Microchip also provides the PIC32CM JH01 Curiosity Pro development kit (Part number EV81X90A) to support the PIC32CM JH MCU.

The PIC32CM JH MCU and EV81X90A are available now.

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5G front end modules help improve 5G call quality and internet speed

Front end modules and pre-drivers developed by NXP are claimed to improve 5G network coverage and quality. The BTS7202 RX front end modules and BTS6403 / BTS6305 pre-drivers offer high output power, improved linearity and reduced noise.

The RX front end modules (FEM) and BTS6403 / BTS6305 pre-drivers for 5G MIMO (massive multiple-input multiple-output) going up to 20W per channel. The devices were developed and implemented in NXP’s SiGe (silicon germanium) process. They operate with modest current consumption, said NXP, designed to reduce operational costs for mobile network operators (MNOs). They are also claimed to offer improved linearity and reduced noise figure to support better 5G signal quality. 

The BTS7202 RX FEMs and BTS6403/6305 pre-drivers complement NXP’s power amplifier solutions for 32T32R radios. The BTS7202 RX FEMs feature a switch capable of handling up to 20W of power leaking from transmit line-ups, reducing system complexity. The BTS6305 pre-drivers also integrate a balun to reduce costs. 

As 5G networks are adopted, MNOs are increasingly leveraging 32T32R solutions to improve massive MIMO coverage in less dense urban and suburban areas. Utilising 32T32R solutions requires using higher power devices that increase the power level per channel in order to achieve the total power required to ensure strong coverage of the 5G signal. 

Doeco Terpstra, vice president and general manager, smart antenna solutions, radio power, NXP, said: “Our customers recognise that higher power solution offers a way for network operators to address the power needs of 32-antenna solutions without compromising network quality.”

NXP Semiconductors specialises in secure connectivity solutions for embedded applications, in the automotive, industrial and IoT, mobile, and communication infrastructure markets. 

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Image sensor is adaptive for all vehicle occupants

In-car safety and comfort in automotives is advanced with the VD/VB1940 DMS (driver monitoring system) sensor, a hybrid sensor for interior monitoring, announced by STMicroelectronics.

Leading automotive markets start to mandate driver monitoring systems (DMS) reported STMicroelectronics. While DMS promises greater road safety by assessing driver alertness, ST said that its next-generation dual image sensor monitors the full vehicle interior, i.e., the driver and all passengers. The sensor enables new applications such as passenger safety-belt checks, vital-sign monitoring, child-left detection, gesture recognition and high-quality video/picture recording.

The image sensor uses ST’s second-generation 3D-stacked back-side illuminated (BSI) wafer technology, which maximises the optical area and on-chip processing in relation to die size. This lets the sensor perform sophisticated algorithms locally for optimal performance in both colour and near-infra-red (NIR) imaging, saving power and relieving demand for an external co-processor.

Algorithms performed on-chip include Bayer conversion and HDR merging for optimal image-quality and frame rate. On-chip Bayerisation processing enables the user to reshuffle the colour pixels of the RGB NIR 4X4 pattern into RGGB format compatible with a range of SoCs. Local processing also handles independent colour and NIR pixel-exposure optimisation for optimum image quality in both modes, as well as smart upscaling to maximise NIR image resolution by capturing extra NIR information from RGB pixels.

The VD/VB1940 sensor combines the sensitivity and high resolution of infra red sensing with high dynamic range (HDR) colour imaging in a single component. It can capture frames alternatively in rolling-shutter and global-shutter modes. With 5.1Mpixels, it captures the high dynamic range (HDR) colour images needed for an occupant monitoring system (OMS) in addition to the high-quality NIR images typically captured by standard DMS sensors. DMS uses NIR imaging to analyse driver head and eye movements in all lighting conditions.

Offered in both bare wafers (VDB1940) and packaged in BGAs (VB1940), samples are available now and mass production is planned to meet model-year 2024 vehicles being designed now. 

Qualified to AEC-Q100, the VD/VB1940 is ISO 26262 compliant to facilitate use in functional-safety systems up to ASIL-B.

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