NXP packs wireless and wired connectivity into a single OrangeBox 

Wireless and wired connectivity within a vehicle, including V2X (vehicle to everything), secure car access, radio and Wi-Fi technologies, are integrated into a single connectivity domain controller.

The OrangeBox development platform simplifies access to integrated connectivity technologies through one software platform to reduce costs and streamline development, said NXP.

OrangeBox integrates a variety of NXP wireless technologies, from broadcast radio, Wi-Fi 6 and Bluetooth, to secure car access with Ultra-Wideband (UWB) and Bluetooth Low Energy (BLE) and 802.11p-based V2X. It is a single, security- enhanced, modular development platform that provides a unified interface between the vehicle’s gateway and its wired and wireless technologies for V2X communications.

OrangeBox unifies current and emerging external wireless interfaces, for infotainment to advanced safety features, for example, into a single, security-enhanced connectivity domain controller, which connects to the secure vehicle gateway through NXP high-speed Ethernet. It is designed to reduce effort for development teams, while optimising the movement of data across multiple communication interfaces. Importantly, it also enables consistent security protection to be applied to all data traffic entering the car and eases the deployment of V2X and cloud applications such as over-the-air (OTA) updates for software-defined vehicles.

Designed as a modular platform, OEMs and Tier 1s can use OrangeBox to adapt to regional requirements for cellular connectivity and V2X and enable in-field updates to keep up with changing technologies, said NXP.

“By consolidating automotive wireless technologies into a centralised domain controller with a high- speed connection to the vehicle gateway, we are creating a single pathway for the vehicle to seamlessly connect to the rest of the world,” said Dan Loop, vice president and general manager for automotive edge processing, NXP. “Not only can this help to reduce costs and streamline development, it addresses a critical piece of the puzzle for data-enriched vehicles that require centralised, secure connectivity,” he added.

The central processor of the OrangeBox is an i.MX 8XLite applications processor running a unified Linux-based software platform to manage the automotive wireless connectivity. There is an NXP Gbit Ethernet connection to the central vehicle gateway to allow other automotive systems to access integrated wireless connectivity.

The OrangeBox automotive development platform is expected to be available in the first half of 2023. 

http://www.nxp.com

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SoMs for Zynq UltraScale+ MPSoC serve lidar applications

SoMs (system on modules) for AMD’s Zynq UltraScale+ MPSoC series range from ZU4 to ZU19 variants for a variety of industries, including the industrial, military and defence sectors. The iWave Zynq MPSoC SoMs are scalable with logic density, I/O availability and high speed DDR design. A carrier board can cover multiple I/O ports for a wide range of end products, from ZU4 with 192K logic cells to ZU19 with up to 1.1M logic cells, said iWave.

The Zynq UltraScale+ MPSoC devices enable an adaptive SoC-based product design, which is extremely promising for lidar applications, explained iWave. Integrating both the processor and FPGA architecture into a single device allows rapid deployment of a flexible yet optimised SoM for any given domain, added the company.

Lidar is a remote sensing technology used for scientific and military applications. It provides high resolution and accurate measurements of 3D structures, and can easily convert the received data into 3D maps to interpret the surrounding. Importantly, it remains unaffected even in even in challenging weather and lighting conditions, said iWave. 

The programmability of FPGA provides flexibility in developing custom capabilities. They also have the potential to speed up processing by employing multi-level parallelism.

The Zynq UltraScale+ MPSoC series combines real time control with soft and hard engines for graphics, video, waveform and packet processing. MPSoC devices are powerful and flexible enough to deliver advanced capabilities for lidar sensors, explained iWave. They can also be used for signal processing, point cloud pre-processing and point cloud machine learning acceleration. Zynq MPSoC devices are power efficient, which is critical for lidar systems, said iWave.

Using a SoM approach for building lidar products offloads complexities involved in the design cycle allowing a product designer to focus on developing firmware and software stacks by eliminating the complex hardware part of the design, said iWave. This approach “significantly reduces time to market with reduced product development cost” said the company. 

SoMs also provide scalability and flexibility to a designer when migrating to a higher computing SoM without changing the design of a carrier card.

The Zynq UltraScale+ MPSoC SoM features the heterogeneous Arm + FPGA architecture and combines the processing system and programmable logic. The processing system contains a quad-core Arm Cortex-A53 processor operating at up to 1.5GHz and a real time processing unit equipped with Arm Cortex-R5 processors operating at up to 600MHz

The programmable logic based on 16nm UltraScale+ architecture contains up to 504K configurable logic block, block RAM and DSP elements. Other benefits include any-to-any interfacing, design toolchains, image processing capabilities, the ability to accelerate neural network, with safety and security features.

The Zynq UltraScale+ MPSoCs processing system and programmable logic support a variety of industry standard interfaces such as CAN, SPI, I2C, UART, and GigE. The programmable logic I/O flexibility allows for direct interfacing with MIPI, LVDS and GigaBit serial links, allowing for higher levels of protocol implementation within the programmable logic.

By providing the correct PHY in the hardware design, the programmable logic enables any interface to be implemented, providing any-to-any interfacing.

The Zynq UltraScale+ devices come with Vivado Design Suite to configure the processing system and programmable logic design. Vivado provides the complete programmable logic development experience, including the support for synthesis, place and route and simulation.

To develop software, Vitis supports Embedded Linux development using PetaLinux and real time operating systems such as FreeRTOS.

In addition to system development capabilities, Vitis supports kernel acceleration within the programmable logic using OpenCL.

Image processing is critical in lidae applications for navigation and monitoring. Typically, the algorithms used in these systems are created and modelled in high level frameworks such as OpenCV.

An H.264/H.265 video codec unit is included in the Zynq UltraScale+ MPSoC EV series to support image processing.

Viti AI provides Model Zoo, AI compiler, optimiser, quantiser and profiler to deploy the application onto the deep learning processing unit. 

The Advanced Encryption Standard (AES) is used to secure the configuration of Xilinx devices.

The Zynq UltraScale+ MPSoC devices further implement layered security solutions via configuration security unit (CSU) within the processing system. The CSU supports AES 256-GCM, 4096 RSA Multiplier, and SHA-384, providing confidentiality, authentication, and integrity functions.

Anti-tamper response through the inbuilt system monitor enables the customer to track device voltages and die temperatures of the SoM.

https://www.iwavesystems.com  

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Multi-protocol industrial Ethernet switch reduces system integration time

To address the connectivity needs of industrial and process automation, motion control, transportation, and energy automation, Analog Devices (ADI) has introduced  the ADIN2299. This is a multi-protocol industrial Ethernet switch designed to operate in a star, line, or ring topology. It supports ProfiNet, EtherCat, EtherNet/IP and Modbus TCP.

The ADIN2299 contains a communications controller, a two port 10/100Mbits per second Ethernet switch, memory, physical layer (PHY) and protocol stacks. The ADIN2299 hardware, coupled with its software and pre-certified industrial protocols, reduces system integration time while providing fast time to market, claimed ADI. 

Time to design and debug time is reduced through the provision of the protocol stack but also the RTOS, file system, drivers and TCP/IP. An application processor can connect to the switch platform via a UART, SPI or Ethernet interface. 

The ADIN2299 software enables the application processor to connect to a unified interface so that various industrial protocols can be used without requiring any changes to the application processor software. This eliminates the learning curve associated with incorporating additional protocols, said the company. Customers can now leverage a single field device hardware design to support multiple industrial protocols. 

For cybersecurity, the ADIN2299 has a secure boot and secure update feature which ensures that only verified code is executed to reduce possible disruptions from cyber attacks.  

An ADIN2299 evaluation kit is available for platform assessment and system development. An application example is provided to demonstrate end-to-end, host-to-network and interface-to controller communication. Once an application development board is connected via UART, SPI, or Ethernet interface with the ADIN2299 evaluation board, protocol communication can be evaluated using a PLC or controller simulator. This allows for a complete verification before integrating the ADIN2299 into a system, confirmed ADI.

 The small form factor ADIN2299 has supplied in a 194 CSPBGA package.

The ADIN2299 is in full production now.

Analog Devices provides a suite of analogue and mixed signal, power management, radio frequency (RF), and digital and sensor technologies, serving customers in the industrial, communications, automotive, and consumer markets. 

http://www.analog.com

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Taiwan Semiconductor offers alternative source for automotive-grade LDO regulators

Integrated AEC-Q100 qualified low dropout regulators (LDOs) require minimal external parts count and are offered in four configurations in heat-spreading SOP-8EP and TSSOP-14EP packages by Taiwan Semiconductor.

The TQL8xx family offers manufacturers a reliable alternative source for the critical linear regulators used in battery-driven automotive functions, including dashboard, cluster, climate control, fuel pump and advanced driver-assistance systems (ADAS). The regulators are suited for secondary supply applications where a regulated output is essential during very low-cranking voltage conditions. 

They are designed for stability in automotive battery-connect applications. They maintain two per cent accuracy over a wide range of input voltages and a full operating temperature range of -40 to +125 degrees C. They are offered in models with fixed outputs of 3.3V or 5.V and feature typical dropout voltages of 70 to 80mV at IO=100mA.  

The TQL8xx family’s four package configurations are the SOP-8EP package with ignition enable pin (only), the SOP-8EP-package with enable, reset and watchdog output; and reset threshold adjustment, the TSSOP-14EP package with enable, reset and watchdog output and reset threshold adjustment, finally there is the TSSOP-14EP package with enable, watchdog monitor input; watchdog output, reset threshold adjustment and program timing adjustment.

The AEC-qualifies devices are manufactured in-house and provide a viable alternate source for high-demand devices, commented Sam Wang, Taiwan Semiconductor’s vice president, products. 

Available design resources include comprehensive datasheets and spice models for each component in the series.

Taiwan Semiconductor’s expanded product portfolio includes trench Schottky’s, MOSFETs, power transistors, LED driver ICs, analogue ICs and ESD protection devices. Production facilities are located in China and Taiwan. They are fully compliant with current automotive and environmental standards such as IATF16949, ISO9001 and ISO14001.

Taiwan Semiconductor products are used in an array of applications in the electronics industry including automotive, computer, consumer, industrial, telecomms and photovoltaic. 

http://wwwtscus.com

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