InGaP HBT power amp provides 23.5dBm output power 

Designed for cellular applications requiring native linearity over temperature extremes, the GRF5521 is the latest InGaP HBT (heterojunction bipolar transistor) model in Guerilla RF’s 1/4W linear power amplifier family.

The GRF5521 is one of 10 1/4W linear power amplifiers (PAs) released as part of the company’s continued expansion into the cellular market. The InGaP HBT amplifiers were designed for 5G/4G wireless infrastructure applications requiring exceptional native linearity over temperature extremes of -40 to +85 degrees C.

Spanning a frequency range of 2.11 to 2.17GHz, the GRF5521 is tuned to operate within the n1, n65, and n66 5G new radio (NR) bands. It delivers 23.5dBm of linear power over the entire temperature range while maintaining ACLR levels of better than -45dBc, IMD3 levels less than -22dBm, EVM levels less than one per cent and PAE efficiencies above 20 per cent, said Guerilla RF and all without the aid of supplemental linearisation schemes like digital pre-distortion (DPD).

The ability to beat the -45dBc ACLR performance metric without DPD is critical for cellular applications like residential and commercial repeaters / boosters, femtocells, picocells and cable loss compensators associated with automotive ‘shark fin’ antennas, explained Guerilla RF. In each of these use cases, the sensitivity to cost, power and size constraints prohibits the use of elaborate linearisation techniques and designers must rely on the power amplifier’s native linearity to meet the stringent emissions mask requirements imposed by 5G and 4G standards.

Guerilla RF designed the GRF55xx series to be footprint-compatible, enabling customers to rapidly customise designs for a wide selection of cellular frequencies.

Ryan Pratt, CEO and founder of Guerrilla RF, said the company will offer production-released products covering every major cellular band between 660 and 4200MHz. These linear power amplifiers are popular with cellular booster / repeater and automotive customers, he said.

The GRF55xx family comes in pin-compatible 3.0 x 3.0mm, 16-pin QFN packages. Samples and evaluation boards are available for the GRF5521.

 https://www.guerrilla-rf.com 

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Infineon’s SaaS supports IoT developers improve offering

The next-generation SaaS (software as a service) release of Infineon’s Cirrent IoT Network Intelligence (INI) helps developers quickly and cost-effectively gather information about their products to increase reliability, improve product performance, and reduce support cost, claimed the company.

It can be used by product and development teams to identify, monitor and solve customer and product problems. Its Cirrent Agent embedded software can be deployed in new products or rolled out over-the-air to existing fleets for devices to report data into the Cirrent Cloud. Development teams can use the online console with new artificial intelligence and machine learning capabilities to analyse product data and get new insights into product performance in the field.

“Too many IoT product companies lack both the data and tools to look at the data,” said Rob Conant, vice president of software and ecosystem, Infineon. The Cirrent INI gives developers the ability to quickly gather data on products in the field with dashboards and tools that provide actionable insights to solve problems and help drive strategic product development, he said. He added that this is “just one example of Infineon’s digitalisation efforts to help our customers make better products”.

The Cirrent INI includes the Cirrent Agent embedded software, cloud data storage and analysis. It also includes an online web-based console to deliver data-driven product development to improve user experience, decrease returns and increase sales, said the company.

The INI service processes more than a billion data points per day and recently introduced new artificial intelligence and machine learning to accelerate data analysis and meaningful insights for problem verification and resolution.

Cirrent INI is pre-integrated with Infineon’s Airoc Wi-Fi chips, the Airoc Cloud Connectivity Manager and Cirrent Cloud ID. Modus Toolbox developers can integrate the Cirrent Agent embedded software with pre-integrated libraries and sample applications. Cirrent INI is delivered with 25 built-in events and attributes, extendable to custom events, attributes and measurements specifically tuned for the customer’s applications or environments.

Infineon’s Cirrent INI can be deployed on products using Wi-Fi, Ethernet or cellular connectivity and is available now.

http://www.infineon.com

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Smart STM32 wireless module increases productivity says ST

The STM32WB5MMGH6 wireless module by STMicroelectronics provides a subsystem for wireless communications for industrial applications using Bluetooth Low Energy, Zigbee and Thread standard and comes with free-to-use protocol stacks. Alternatively, developers can use other proprietary protocols.

At the heart of the module is STMicroelectronics’ STM32WB55 MCU which has an Arm Cortex-M4 core for application-level processing and a Cortex-M0+ dedicated to managing the integrated radio, which safeguards real-time performance in both domains, explained ST.

The MCU’s on-chip RAM is advantageous when running the Thread protocol, added the company. 

The module can be used in wireless communication and control of devices such as remote sensors, smart door locks, PC accessories including printers, and infrastructure equipment like network gateways and smart building controllers.

The module integrates the antenna and its matching circuitry, together with all the required passives and timing crystals. Pre-certifications for EMC, Bluetooth LE 5.3, Zigbee 3.0 and OpenThread simplify the mandatory testing and product-level approval processes for users, claimed ST, which saves development costs and accelerates time to market.

The STM32WB5MMGH6 module can be integrated into continuous monitoring systems to enhance the maintenance of industrial equipment and avoid unexpected failures and downtime. It has been used by prescriptive and predictive maintenance company, I-care, with its Wi-care sensors in a wireless and continuous asset monitoring system. When combined with I-see, the company’s cloud-based and AI-driven analytical platform, it provides a complete maintenance industry 4.0 solution, allowing users to visualise equipment status and plan maintenance schedules, said I-care.

“Choosing a wireless module instead of engineering a chip-down solution is the fastest way for developers to complete their projects,” said Hakim Jaafar, general manager – BLE/802.15.4 MCU, STMicroelectronics. 

The STM32WB5MMGH6 module is in production now and supported by ST’s 10-year product longevity commitment, which ensures long-term availability of parts for industrial applications.

Product designers working with the STM32WB5MMGH6 module can use the STM32 microcontroller development ecosystem that includes free tools, for example the STM32CubeMX configurator and software, such as the STM32CubeWB MCU package. This package provides essential embedded-development resources, including production-ready MISRA C and ISO/TS 16949-compliant hardware abstraction layer (HAL) and low-layer APIs, FatFS file system, FreeRTOS, communication-protocol stacks, and code examples.

http://www.st.com

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Latest PIC microcontrollers add Bluetooth LE connectivity

Adding wireless connectivity to a product can be hampered by the cost and complexity of system design since it is generally added as part of the larger application, said Microchip Technology. The company addresses this with the introduction of its first Arm Cortex-M4F-based PIC microcontroller family which integrates Bluetooth Low Energy (LE) functionality directly into one of a system’s most basic components, supported by one of the industry’s most comprehensive developer ecosystems.

The PIC32CX-BZ2 family includes SoC devices and regulatory-certified, RF-ready modules. There is Bluetooth Low Energy coupled with Zigbee stacks and over the air (OTA) update capabilities. There is also a 12-bit ADC, multiple timer / counters for control channels, an on-board encryption engine and a broad set of interfaces to touch, CAN, sensor, display and other peripherals. 

The 1Mbyte of flash memory supports large application codes, multi-protocol wireless stacks and OTA updates. The packages are AEC-Q100 Grade 1-certified with an operating temperature up to 125 degrees C.

For development support there is Microchip’s MPLab Harmony 32-bit embedded software development framework. MPLab Code Configurator integration enables developers to quickly begin prototyping with the PIC32CX-BZ2 development board using drag-and-drop auto code generation. There are application code examples hosted on GitHub and linked through MPLab Code Configurator and MPLab Discover. There are also reference design packages and wireless design check services. Customers with little to no RF expertise can benefit from Microchip’s WBZ451 modules, said the company. These are pre-certified and feature an optimised on-board RF design. 

In addition to the MPLab Code Configurator, the MPLab Harmony v3 framework includes an ecosystem of debuggers, programmers, virtual sniffer and compilers. 

The PIC32CX-ZB2 family is in-stock and available now. PIC32CX1012BZ25048-I and PIC32CX1012BZ25048-E SoCs ship in a 7.0 x 7.0mm 48 QFN package. The WBZ451PE-I and the WBZ451UE-I modules are supplied with an on-board PCB antenna and a U.FL connector.

http://www.microchip.com

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