ICs & Semiconductors Archives - Page 83 of 227

Multi-protocol industrial Ethernet switch reduces system integration time

Wed, Oct 12, 2022

To address the connectivity needs of industrial and process automation, motion control, transportation, and energy automation, Analog Devices (ADI) has introduced the ADIN2299. This is a multi-protocol industrial Ethernet switch designed to operate in a star, line, or ring topology. It supports ProfiNet, EtherCat, EtherNet/IP and Modbus TCP.

The ADIN2299 contains a communications controller, a two port 10/100Mbits per second Ethernet switch, memory, physical layer (PHY) and protocol stacks. The ADIN2299 hardware, coupled with its software and pre-certified industrial protocols, reduces system integration time while providing fast time to market, claimed ADI.

Time to design and debug time is reduced through the provision of the protocol stack but also the RTOS, file system, drivers and TCP/IP. An application processor can connect to the switch platform via a UART, SPI or Ethernet interface.

The ADIN2299 software enables the application processor to connect to a unified interface so that various industrial protocols can be used without requiring any changes to the application processor software. This eliminates the learning curve associated with incorporating additional protocols, said the company. Customers can now leverage a single field device hardware design to support multiple industrial protocols.

For cybersecurity, the ADIN2299 has a secure boot and secure update feature which ensures that only verified code is executed to reduce possible disruptions from cyber attacks.

An ADIN2299 evaluation kit is available for platform assessment and system development. An application example is provided to demonstrate end-to-end, host-to-network and interface-to controller communication. Once an application development board is connected via UART, SPI, or Ethernet interface with the ADIN2299 evaluation board, protocol communication can be evaluated using a PLC or controller simulator. This allows for a complete verification before integrating the ADIN2299 into a system, confirmed ADI.

The small form factor ADIN2299 has supplied in a 194 CSPBGA package.

The ADIN2299 is in full production now.

Analog Devices provides a suite of analogue and mixed signal, power management, radio frequency (RF), and digital and sensor technologies, serving customers in the industrial, communications, automotive, and consumer markets.

http://www.analog.com

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Taiwan Semiconductor offers alternative source for automotive-grade LDO regulators

Tue, Oct 11, 2022

Integrated AEC-Q100 qualified low dropout regulators (LDOs) require minimal external parts count and are offered in four configurations in heat-spreading SOP-8EP and TSSOP-14EP packages by Taiwan Semiconductor.

The TQL8xx family offers manufacturers a reliable alternative source for the critical linear regulators used in battery-driven automotive functions, including dashboard, cluster, climate control, fuel pump and advanced driver-assistance systems (ADAS). The regulators are suited for secondary supply applications where a regulated output is essential during very low-cranking voltage conditions.

They are designed for stability in automotive battery-connect applications. They maintain two per cent accuracy over a wide range of input voltages and a full operating temperature range of -40 to +125 degrees C. They are offered in models with fixed outputs of 3.3V or 5.V and feature typical dropout voltages of 70 to 80mV at IO=100mA.

The TQL8xx family’s four package configurations are the SOP-8EP package with ignition enable pin (only), the SOP-8EP-package with enable, reset and watchdog output; and reset threshold adjustment, the TSSOP-14EP package with enable, reset and watchdog output and reset threshold adjustment, finally there is the TSSOP-14EP package with enable, watchdog monitor input; watchdog output, reset threshold adjustment and program timing adjustment.

The AEC-qualifies devices are manufactured in-house and provide a viable alternate source for high-demand devices, commented Sam Wang, Taiwan Semiconductor’s vice president, products.

Available design resources include comprehensive datasheets and spice models for each component in the series.

Taiwan Semiconductor’s expanded product portfolio includes trench Schottky’s, MOSFETs, power transistors, LED driver ICs, analogue ICs and ESD protection devices. Production facilities are located in China and Taiwan. They are fully compliant with current automotive and environmental standards such as IATF16949, ISO9001 and ISO14001.

Taiwan Semiconductor products are used in an array of applications in the electronics industry including automotive, computer, consumer, industrial, telecomms and photovoltaic.

http://wwwtscus.com

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Explorer kits help develop cm-precision wireless comms products

Fri, Oct 07, 2022

Two development kits, scheduled for launch early next year, will bring precision positioning and wireless communications technology to engineers developing products that need cm-level positioning accuracy, said u-blox.

Both explorer kits will include the full gamut of u-blox technology and software required.

The XPLR-HPG-1 and XPLR-HPG-2 explorer kits include an open MCU, precision GNSS positioning with real-time kinematic (RTK), dead reckoning, cellular, Wi-Fi and Bluetooth communications, together with the necessary antennas.

The kits are designed to integrate seamlessly with complementary u-blox services, such as PointPerfect GNSS augmentation service, and the ubxlib software component which operates across u-blox products and services particularly during component evaluation and prototyping.

The explorer kits will assist engineers working in areas such as micro-mobility and low-speed robotics, helping them build, test and demonstrate early proofs of concept more quickly and accelerate overall time-to-market, said u-blox.

The modular XPLR-HPG-1 kit will be based around the wireless MCU in the u-blox NORA-W106; it has Wi-Fi and Bluetooth LE capabilities. This will give engineers flexibility to adjust solutions, using Mikroe Click boards which have a variety of u-blox modules. The kit will include three Click boards, each incorporating the ZED-F9R high-precision RTK GNSS module, the LARA-R6001D LTE Cat 1 module (for global coverage and with built-in MQTT client) or the NEO-D9S L-band correction data receiver module.

Engineers can purchase others, based on the needs of the application. The kit’s source code will include example software for the Espressif IoT Development Framework (ESP-IDF), based on ubxlib software components.

The compact XPLR-HPG-2 will have the same module choices as the XPLR-HPG-1 option but with the NINA-W106 which has MCU, Bluetooth LE and Wi-Fi capabilities.

This blend of technologies in a single explorer kit will give designers the ability to achieve cm-level positioning in a variety of scenarios, said u-blox. The GNSS receiver provides an initial position reading, which is then refined using correction data from the PointPerfect service, delivered using L-band satellite signals, as well as cellular and/or Wi-Fi communication.

Both the XPLR-HPG-1 and XPLR-HPG-2 explorer kits will be available from u-blox in early 2023.

http://www.u-blox.com

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Nordic Semiconductor supports Matter 1.0 in nRF Connect SDK

Fri, Oct 07, 2022

The latest version of Nordic Semiconductor’s unified software development kit brings support for all features of 1.0 version of Matter over Thread.

The latest version of the nRF Connect SDK (software development kit) brings developers support for the Connectivity Standard Alliance’s standard, which is emerging as an industry changing standard for smart home device interoperability, said the company.

“Nordic has played a major role in the Matter initiative since the very beginning, so we are pleased to introduce the nRF Connect SDK with full Matter over Thread support,” says Krzysztof Loska, a technical product manager with Nordic. “This support is ready for Matter 1.0 adoption and allows developers to get started immediately on Matter over Thread development using Nordic’s nRF52840 and nRF5340 SoCs,” he added.

nRF Connect SDK is a scalable and unified development tool for building products based on Nordic’s nRF52 and nRF53 Series SoCs, the nRF91 Series SiP (system in package and the recently announced nRF7002 Wi-Fi 6 Companion IC. The nRF Connect SDK 2.1.0 includes full Matter over Thread and also adds experimental support for Matter over Wi-Fi for the nRF5340 SoC in combination with the nRF7002 Companion IC.

The company released nRF Connect SDK 2.1.0 before Matter 1.0 was formally adopted and will soon release an nRF Connect SDK 2.1.X to provide bug fixes and small improvements in Matter over Thread. Nordic advised that customers can continue using nRF Connect SDK 2.1.0 to conform to the Matter 1.0 specification following some minor manual updates. Matter over Wi-Fi will be raised from experimental to full support when the nRF7002 enters volume production.

Matter is a connectivity standard that forms a common language to bring together disparate ecosystems and enables smart devices from different makers to work in harmony.

The standard uses a common application layer and data model that delivers interoperability between devices allowing them to communicate with each other – regardless of the underlying network protocol or ecosystem. It is built on market-proven technologies using Internet Protocol (IP). Matter runs on Wi-Fi, Thread and Ethernet network layers and uses Bluetooth LE for commissioning.

Nordic was awarded a Thread 1.3 certification badge for the nRF Connect SDK earlier this year. Thread 1.3 is a pre-requisite for Matter over Thread and the certification can be inherited by customers for their own products.

https://www.nordicsemi.com/

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Multi-protocol industrial Ethernet switch reduces system integration time

Taiwan Semiconductor offers alternative source for automotive-grade LDO regulators

Explorer kits help develop cm-precision wireless comms products

Nordic Semiconductor supports Matter 1.0 in nRF Connect SDK

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