Farnell takes a global view for ams-Osram

Optical products for automotive, consumer, industrial and healthcare products by ams-Osram are available from Farnell.

New proximity, temperature and vital sign monitoring sensors and a comprehensive range of LEDs, photodiodes and infrared (IR) emitters by ams-Osram are available from Farnell. 

The manufacturer has extended its distribution agreement with Farnell to offer optical products for sensing, visualisation and lighting applications from a single source. 

The enhanced range of solutions from ams-Osram available for fast delivery from Farnell includes the AS621X series of temperature sensors which are claimed to deliver the industry’s best combination of accuracy and low power consumption in a tiny wafer-level package. It is suitable for a range of consumer electronic devices and wearables, heating, ventilation and air conditioning (HVAC) systems and health-related monitoring systems. The series consists of three models, including AS6212, AS6214 and AS6218, providing measurement with different temperature accuracies and low power consumption, said Farnell. The compact size of each sensor ensures ease of integration and can feature up to eight different I²C addresses, which permits eight AS6221T devices to be used on one bus with no calibration or linearisation needed. 

The TMD3725 light, colour and proximity sensor offers reduced power consumption with design flexibility for dark room or full sunlight operation. Key features include advanced proximity measurement, colour sense (RGBC+IR) and digital ambient light sensing. The senor also compensates for unwanted IR energy system crosstalk reflection and undesirable ambient light photodiode current. The slim module incorporates an IR LED and factory calibrated LED driver with RGB + IR filters, high sensitivity down to mLux levels, a 1M:1 dynamic range and 0.18 micron processing technology with 1.8V I²C. The MD3725-EVM evaluation kit for the TMD3725 sensor provides everything required to evaluate the sensor.

There is also the TMD27553M ambient light / proximity photo sensor is optimised for narrow bezel mobile phones and offers industrial design flexibility, said Farnell. It has accurate ambient light sensing, superior proximity sensing and reduced power consumption. The proximity detection feature includes object recognition using photodiode detection of reflected IR energy (sourced by the integrated VCSEL). Detect and release events are interrupt driven and occur when the proximity result crosses the upper and / or lower threshold settings. The proximity engine features a wide range offset adjustment to compensate for unwanted IR energy reflection at the sensor. Moreover, the automatic ambient light subtraction with ALS (ambient light sensor) and IR photodiodes features dedicated data converters which have the capacity to produce 16-bit data. The extremely narrow 1.1mm module incorporates an IR VCSEL and factory calibrated VCSEL driver. 

The AS7056 bio-signal analogue front end (AFE) sensor is the next generation of vital sign sensors enabling users to detect bio-signals such as PPG (photoplethysmogram) and PTT (pulse transit time) as well as proximity measurements. The AS7056 is an analogue front end optimised for size and performance to support space-limited applications, such as in-ear vital sign monitoring, hearables, optical sensor platform, fitness band, smart watch, smart patches and heart rate monitors. Optical blood pressure measurements and SpO2 are enabled by the two independent working photodiode inputs of the AS7056. The AS7056 also provides two LEDs and one VCSEL driver outputs and samples up to three photodiode inputs. 

Customers can now buy the full range of ams OSRAM’s optical solutions with fast delivery from Farnell in EMEA, Newark in North America and element14 in APAC.

https://uk.farnell.com/

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Compact, low power, NB-IoT industrial modules have GNSS geo-location capability

Programmable, certified LTE Cat NB2 NB-IoT industrial modules, the SR87M01 series announced by STMicroelectronics, cover worldwide cellular frequency bands and integrate advanced security features. 

The low power modules combine reliable and robust NB-IoT data communication with accurate and resilient GNSS geo-location capability for IoT devices and assets. 

According to ST, the ST87M01 is one of the first IoT cellular products worldwide offered in accordance with the latest 3GPP Release 15. It provides extended multi-regional LTE coverage. The integrated native GNSS receiver with multi-constellation access delivers localisation with power saving features while operating during NB-IoT sleep time slots.

The module has dimensions of just 10.6 x 12.8mm and is in an LGA package.

It is qualified over the industrial temperature range (-40 to +85 degrees C), with low power consumption of less than 2.0 microA in low power mode. Output power is up to +23dBm. The ST87M01 targets wide-ranging IoT applications that require reliable low power wide area network (LPWAN) connectivity, such as smart metering, smart grid, smart building, smart city and smart infrastructure applications, as well as industrial condition monitoring and factory automation, smart agriculture and environmental monitoring. It is also suited to tracking applications such as locating pets, children, and elders, safety monitoring for remote workers, asset tracking for equipment such as power tools, and general intelligent logistics.

The STM8701’s programmable IoT platform lets users embed their own code directly in the module for simple applications. Alternatively, the module can be combined with a separate host microcontroller, for more sophisticated use cases. A variety of protocol stacks is available to handle popular IoT use cases, including IPv6, TCP/UDP, CoAP/LWM2M, MQTT, HTTP/HTTPS and TLS/DTLS. The ST87M01 is designed to support both standardised 3GPP AT commands and ST enhanced AT commands.

An ST4SIM embedded SIM (eSIM) is integrated in the module. This is certified according to the latest industry standards, including GSMA eSA (Security Assurance) certification and includes an embedded secure element (eSE).

The ST87M01 is sampling now to major customers worldwide.

http://www.st.com

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NXP integrates NFC in lock for Matter devices

The EdgeLock SE051H is a secure element designed for the Matter protocol by NXP Semiconductor. It integrates NFC (near field communication) functionality to simplify secure onboarding of Matter devices in the smart home, said the company.

The latest addition to NXP’s portfolio of Matter devices, the EdgeLock SE051H is a single chip with integrated NFC, designed to simplify the secure and seamless onboarding of Matter devices. It can also enable new smart home user experiences, such as suggested automations, installation videos and other content with just the tap of an NFC-enabled phone. 

The Matter standard, designed by the Connectivity Standards Alliance (CSA), is designed to ease device interoperability challenges within the smart home network. It raises smart home security with features such as cryptographic keypairs, digital certificates, and other security-related hardware and firmware requirements to protect smart home devices. The EdgeLock SE051H is optimised to support these requirements.

“The single-chip EdgeLock SE051H makes it easy for developers to secure their Matter-certified smart home devices, while integrated NFC improves the end user Matter experience and allows device makers to differentiate based on that user experience,” observed Philippe Dubois, senior vice president and general manager, secure transactions & identification, NXP.

The EdgeLock SE051H is Common Criteria EAL 6+ certified and supports the cryptographic operations needed for a Matter-certified smart device. This includes Matter device attestation and certificate-based authentication with ECC cryptography and NIST P-256 curve, as well as the SPAKE2+ algorithm for password authenticated key exchange. It also includes key security functions such as ECDSA, ECDH, and True Random Number Generator to protect the Matter protocol. In addition, the EdgeLock SE051H has an integrated NFC interface and Type-4 Tag capability.

Matter’s security requirements include a device attestation certificate, which confirms device authenticity, demonstrates trustworthiness and establishes an authenticated connection with the larger Matter network. NXP is one of the first semiconductor manufacturers to have been granted trusted Product Attestation Authority status by the CSA, with its EdgeLock 2GO service for securely provisioning IoT devices. EdgeLock 2GO, combined with EdgeLock SE051H, can pre-inject credentials directly into silicon at silicon manufacturing or can deliver the credentials securely over-the-air (OTA) with end-to-end security to simplify supply chain management and in compliance with the Matter standard.

http://www.nxp.com

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STMicroelectronics releases nine RF integrated passive devices (RF IPDs)

Nine RF integrated passive devices (RF IPDs) from STMicroelectronics combine antenna impedance-matching, balun, and harmonic filter circuity optimised for STM32WL wireless microcontrollers.

The STM32WL MCUs combine application-level processing and wireless communication for smart, connected devices. They integrate an Arm Cortex-M4 microcontroller with a sub-GHz long range radio managed by a Cortex-M0+ core. The radio is LPWAN-compliant, supports multiple modulation schemes, and comes with LoRaWAN and Sigfox stacks included in the STM32CubeWL microcontroller software package.

The RF IPDs are in tiny chip scale packages. They connect the STM32WL microcontroller to its antenna and help maximise the RF performance. By integrating all the components on one die, STMicro said performance is consistent and avoids the process variations that affect conventional matching networks built with discrete components. They also simplify circuit design, save on bill of materials, and permit a smaller form factor, added ST.

The nine RF IPD variants let designers choose the optimum parameters according to the RF frequency range and power, microcontroller package type, and two- or four-layer PCB. 

The series comprises the BALFHB-WL-01D3 through BALFHB-WL-06D3 for applications at 868MHz and 915MHz. The BALFLB-WL-07D3, BALFLB-WL-08D3, and BALFLB-WL-09D3 are optimised for 490MHz. Each integrates the complete receive and transmit signal paths between the microcontroller and antenna. The integrated filter provides high attenuation of unwanted transmitter harmonics, for designers to satisfy the regulations set by radio licensing authorities worldwide.

All devices are in production now. They are offered in a 2.13 x 1.83mm eight-bump wafer-level chip-scale package with a profile below 630 micron after reflow. 

http://www.st.com

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