ST’s second generation industry 4.0 edge AI processors are SESIP 3-certified

STMicroelectronics has introduced its second generation of industry 4.0-ready edge AI powered microprocessors, the STM32MP2 series of 64-bit microprocessors. They are supplied with SESIP Level 3 certification, industrial-application-ready interfaces and dedicated edge AI acceleration. 

The second generation of STM32 microprocessors are based on a new architecture built upon the same ecosystem and raising performance and security for applications at the industrial and IoT edge. 

They also integrate advanced security features in hardware ensuring SESIP Level 3 certification with Arm’s TrustZone architecture and resource isolation framework (RIF). There is also secure key storage, secure boot, device ID in one-time programmable (OTP) memory, hardware cryptographic engines, and on-the-fly DDR encryption / decryption. 

The 64-bit microprocessors are suitable for emerging opportunities in secure Industry 4.0, IoT, and rich user-interface applications, said the company.

The first product in this new generation, the STM32MP25, is available with single or dual 64-bit Arm Cortex-A35 cores running at 1.5GHz, complemented with a 400MHz Cortex-M33 embedded core for real-time processing. A dedicated neural processing unit adds up to 1.35TOPS (tera-operations per second) computing performance optimised for edge AI acceleration in applications such as advanced machine vision and predictive maintenance, said ST. There is also support for 32-bit DDR4 and LPDDR4 memories.

The processors also feature Gigabit time sensitive networking (TSN) support and a two-port Gigabit Ethernet TSN switch, with PCIe, USB 3.0 and CAN-FD peripherals for connectivity required for real-time industrial applications, data concentrators and gateways, and communication equipment. According to ST, the combined processing and networking capabilities enhance detection and feature recognition for security applications and industrial automation. For example, said ST, the processor can acquire video from a 5Mpixel sensor at 30 frames per second (fps), perform analytics with the edge AI accelerator, and send relevant video (encoding with an HW encoder) with detection metadata leveraging Gigabit Ethernet TSN, all in real-time streaming mode.

A 3D graphics processing unit (GPU) with 1080p resolution for graphics and video capabilities permits rich user interfaces, with support including Vulkan real-time graphics for Android applications. A1080p encoder/decoder and multiple display connections including LVDS, four-lane MIPI DSI and a MIPI CSI-2 camera interface are included to simplify connecting displays and digital cameras including raw-Bayer image sensors.

The STM32 microprocessors are specified over the extended temperature range from -40 to +125 degrees C, easing thermal management and enhancing reliability in industrial environments, said ST. The STM32MP2-series microprocessors are supplied with ST’s 10-year longevity commitment. 

Package options include a 0.8mm-pitch chip-scale package (TFBGA). This helps ease PCB design routing, said ST, and allows economical designs down to four layers avoiding costly laser vias.

The STM32MPU ecosystem contains the OpenSTLinux distribution that includes the complete AI framework (X-Linux-AI), as well as the STM32Cube development tools. The STM32Cube firmware will run bare metal or RTOS on the Cortex-M33 embedded core.

ST is now delivering samples of STM32MP25 devices along with evaluation boards to select OEM customers. Volume production of chips and boards is scheduled to begin in the first half of 2024. 

http://www.st.com 

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Hyperlux family claims to boost performance, speed and features of automotive image sensors

With a 2.1 Microm pixel size, 150dB high dynamic range (HDR) and LED flicker mitigation (LFM) across the full automotive temperature range, the onsemi Hyperlux family is claimed to provide high performance, speed and advanced features to propel the next generation of Advanced Driver Assistance Systems (ADAS) forward. It also enables a smooth transition to Level 2+ driving automation, which requires the driver to take over only when alerted by the technology. 

The Hyperlux family spans products with resolutions from 3 megapixel (MP) to 8MP and higher, catering to both sensing and viewing camera applications. With an HDR of 150dB, it claims to capture high quality images under extreme lighting conditions without sacrificing lowlight sensitivity. The LFM capability of the platform ensures that pulsed light sources do not appear to flicker and thereby avoids flicker-induced machine vision issues. 

The simultaneous HDR and LFM capabilities ensure that the potential hazard can be identified in either very dark or bright scenes, critical to ADAS and in-cabin applications, said the intelligent driving sensor business unit at Desay SV. With the new Hyperlux technology, automotive OEMs and tier ones can expect proven high performance in all operating conditions to accelerate more advanced safety and convenience features, it added.

The Hyperlux product family claims to boast the industry’s lowest power consumption and smallest footprint. By using up to 30% less power and having an up to 28 per cent smaller footprint than competing devices, the automotive image sensors are claimed to deliver energy-efficient designs with the lowest system material cost. As more electronic content, including image sensors, is added to cars,  the content needs to be as small as possible to fit in existing designs while not disrupting the internal and external style of the vehicle.

As vehicles become more connected and move closer to autonomy, the importance of safety and security is more critical than ever, said onsemi. It claimed its knowledge of automotive applications and trends, along with its engineering expertise in image sensing, enables its customers to develop next-generation products that bring it closer to the Vision Zero initiative, a strategy to eliminate all traffic fatalities and severe injuries.

Hyperlux is designed to meet the safety requirements of Automotive Safety Integrity Level D (ASIL D) systems, while integrated security gives the highest coverage to cybersecurity threats. These sensors also offer a dual output stream at differing resolutions, allowing sensing and other functions to be performed simultaneously. Designers can benefit from the flexible architecture for the use of a single camera for multiple functions, reducing design time, risk and cost. 

The first two sensors of the Hyperlux product family, AR0823AT and AR0341AT, are now sampling. 

Onsemi will be exhibiting at AutoSens Detroit, 9-11 May 2023. 

https://www.onsemi.com

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Motor drive inverter supports 14V to 80V input DC voltage

EPC’s EPC9186 supports a wide input DC voltage ranging from 14V to 80V. The high-power capability of the EPC9186 supports applications such as electric scooters, small electric vehicles, agricultural machinery, forklifts and high-power drones.

The three-phase BLDC motor drive inverter uses the EPC2302 eGaN fet and four EPC2302 fets in parallel per switch position. It can deliver up to 200Apk maximum output current. 

The EPC9186 contains all the necessary critical function circuits to support a complete motor drive inverter, including gate drivers, regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense, and protection functions. The boards can be configured for multiphase DC–DC conversion and support both phase and leg shunt current sensing.  

According to the company, the major benefits of a GaN-based motor drive are exhibited with this reference design, including lower distortion for lower acoustic noise, lower current ripple for reduced magnetic loss, lower torque ripple for improved precision and lower filtering for lower cost.  

EPC provides full demonstration kits, which include interface boards that connect the inverter board to the controller board development tool for fast prototyping that is claimed to reduce design cycle times.

GaN-based inverters increase motor efficiency and can increase power capability without increasing size, claimed EPC. This enables motor systems that are smaller, lighter, less noisy, have more torque, more range, and greater precision for a wide range of consumer and industrial applications, it added.

The EPC9186 reference design board is priced at $900.00 and is available from Digi-Key.

Designers interested in replacing their silicon mosfets with a GaN solution can use the EPC GaN Power Bench’s cross-reference tool to find a suggested replacement based on their operating conditions.

EPC claims to be the leader in enhancement mode gallium nitride (eGaN) based power management. eGaN fets and integrated circuits are claimed to provide performance many times greater than the best silicon power mosfets in applications such as DC-DC converters, remote sensing technology (lidar), motor drives for eMobility, robotics, drones and low-cost satellites.

https://www.epc-co.com

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SiC gate driver could help extend the driving range of electric vehicles

A highly integrated, functional safety-compliant, isolated gate driver has been released by Texas Instruments (TI). The company claimed that the driver could enable engineers to design more efficient traction inverters and maximise the driving range of electric vehicles (EVs). 

The UCC5880-Q1 reinforced isolated gate driver is claimed to offer features that enable EV powertrain engineers to increase power density and reduce system design complexity and cost. 

According to TI, semiconductor innovations in traction inverter systems are helping to overcome critical barriers to their widespread adoption. These innovations are said to enable automakers to build safer, more efficient and more reliable silicon carbide (SiC)- and insulated-gate bipolar transistor (IGBT)-based traction inverters by designing with UCC5880-Q1, featuring real-time variable gate-drive strength, Serial Peripheral Interface (SPI), advanced SiC monitoring and protection and diagnostics for functional safety.

The company said that the driver can be easily paired with other high-voltage power-conversion products, such as the UCC14141-Q1 isolated bias supply module, to improve power density and help engineers reach the high levels of traction inverter performance.

Achieving any increase in efficiency is difficult for designers, given that the majority of traction inverters already operate at 90 per cent efficiency or higher, according to TI. But by varying the gate-drive strength in real time, in steps between 20 A and 5 A, designers can improve system efficiency with the UCC5880-Q1 gate driver by as much as 2 per cent by minimising SiC switching power losses, resulting in up to seven more miles of EV driving range per battery charge, it claimed. For an EV user who charges their vehicle three times per week, that could mean more than 1,000 additional miles per year. 

It is claimed that engineers can reduce components and prototype a more efficient traction inverter system by using the SiC EV Traction Inverter Reference Design. This customisable, tested design includes the UCC5880-Q1, a bias-supply power module, real-time control MCUs and high-precision sensing.

Preproduction quantities of the automotive-grade, ISO26262-compliant UCC5880-Q1 are available in a 10.5mm x 7.5-mm, 32-pin shrink small-outline package (SSOP). Pricing starts at US$5.90 in 1,000-unit quantities. Designers can purchase a UCC5880-Q1 evaluation module for US$249. 

TI is exhibiting at the Power Conversion and Intelligent Motion (PCIM) Europe conference, Nuremberg, (9-11 May) at Hall 7, Booth No. 459.

https://www.TI.com

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