Dedicated software library accompanies MEMS inertial sensing module 

The ASM330LHB is an automotive-qualified MEMS inertial-sensing module by STMicroelectronics. It provides measurements for a variety of vehicle functions and is provided with dedicated software which addresses functional-safety applications up to ASIL B1.

The module contains a three-axis digital accelerometer and three-axis digital gyroscope and provides a six-channel synchronised output. The inertial measurements can improve the precise positioning of the car in context, said ST. It can support ADAS (advanced driver assistance systems) or vehicle to everything (V2X) communication, help stabilise key sensing systems like radar, lidar and visual cameras, and assist semi-automated driving applications up to L2+. It can also be used to enable a variety of functionalities in the car body, added ST.

Used with the companion software, the ASM330LHB supports automotive systems that require safety integrity up to level B. Using two ASM330LHB sensor modules for fail-safe redundancy delivers resilient contextual data for driver-assistance applications, such as lane centring, emergency braking, cruise assistance and semi-automated driving. The ASIL B -compatible software library has been developed in accordance with the automotive functional-safety standard ISO 26262 and certified independently by TÜV SÜD. The library implements dedicated safety mechanisms, including data integrity and accuracy to ensure compliance with ASIL B automotive systems.

The ASM330LHB has embedded intelligence to add new services about the car status when the driver is away. The integrated machine learning core draws just a few microA of current, said ST and a machine learning algorithm can detect events such as theft attempts, jacking-up or towing, or impacts from other vehicles. 

By monitoring threshold combinations, the integrated finite state machine can detect when the vehicle is in motion or stationary, and for sensing vibrations or instability.

The accelerometer and gyroscope inside the module maintain high stability over time and temperature and have very low noise, achieving an overall bias instability of three degrees per hour. The ASM330LHB operates over the extended temperature range of -40 to +105 degrees C and has multiple operating modes that let designers optimise the data-update rate and power consumption.

The ASM330LHB is AEC-Q100 qualified and in production now in a 2.5 x 3.0mm 14-lead VFLGA package.

http://www.st.com 

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GNSS receiver is tailored for automotive applications

The u-blox ZED-F9L is an L1/L5 GNSS receiver module, designed for automotive, telematics, V2X (vehicle to everything) and navigation applications.

It has integrated dead reckoning technology, six-axis IMU (inertial measurement unit), multiple outputs and robust automotive grade hardware (AEC-Q104) for  automotive designs that demand top-tier performance and seamless integration, said u-blox.

The ZED-F9L leverages L1/L5 band signals and six satellite constellations simultaneously, including NavIC. The receiver provides continuous sub-meter-level positioning accuracy, using algorithms to combine GNSS measurements, IMU data, wheel ticks, and vehicle dynamics for positioning and attitude data, even when GNSS services are unavailable, u-blox added. The receiver also has a 50Hz output rate with low latency for real-time applications.

Operating temperature is up to 105 degrees C, for use in telematic control units (TCUs) under the roof or smart antennas and motorbike applications. Security features include anti-jamming and sensor-based anti-spoofing techniques.

The ZED-F9L module is pin-to-pin compatible with the ZED-F9K module, offering an upgrade path to RTK (real time kinetic) technology.

u-blox specialises in positioning and wireless communication in automotive, industrial, and consumer markets. The company’s products and services let people, vehicles, and machines determine their precise position and communicate wirelessly over cellular and short range networks. It offers a broad portfolio of chips, modules, and secure data services and connectivity for customers to develop innovative and reliable solutions for the IoT quickly and cost-effectively. The company has headquarters in Thalwil, Switzerland and offices in Europe, Asia, and the USA. 

http://www.u-blox.com

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Texas Instruments makes Wi-Fi technology more robust and affordable for connected IoT applications 

Texas Instruments (TI)  has introduced a SimpleLink family of Wi-Fi 6 companion integrated circuits (ICs) to help designers implement reliable, secure and efficient Wi-Fi connections at an affordable price for applications that operate in high-density or high-temperature environments up to 105 degrees C.

The first products in TI’s CC33xx family include devices for Wi-Fi 6 only or for Wi-Fi 6 and Bluetooth Low Energy 5.3 connectivity in a single IC. When attached to a microcontroller (MCU) or processor, the CC33xx devices are said to enable a secure Internet of Things (IoT) connection with reliable radio-frequency (RF) performance in broad industrial markets such as grid infrastructure, medical and building automation. 

Building on TI’s growing wireless connectivity portfolio, the SimpleLink CC3300 Wi-Fi 6 companion IC and CC3301 Wi-Fi 6 and Bluetooth Low Energy 5.3 companion IC start at US$1.60. The 2.4-GHz CC33xx devices are claimed to provide greater Wi-Fi network efficiency and a stable connection across more than 230 access points, while operating at temperatures from –40 degrees C to 105 degrees C. The devices also allow designers to connect their IoT edge nodes directly to home or enterprise access points without additional equipment.

The Wi-Fi 6 companion devices feature orthogonal frequency division multiple access (OFDMA) technology and basic service set (BSS) colouring to deliver fast and consistent network performance and connect more devices simultaneously, without interference from congestion. The devices support Wi-Fi Protected Access (WPA) security features, including the latest WPA3 cryptographic technologies for personal and enterprise networks and a secure boot feature with firmware authentication.

SimpleLink CC3300 and CC3301 Wi-Fi 6 companion ICs easily attach to TI and many other companies’ MCUs and processors that support Linux or real-time operating systems (RTOS). For example, CC33xx products easily attach to artificial intelligence (AI)-capable processors such as TI’s AM62A Arm Cortex-based vision processors, used in edge AI applications such as smart appliances and security cameras to reliably connect smart Wi-Fi-enabled devices to the cloud.

Industrial design engineers can incorporate TI’s CC3300 with host MCUs such as TI’s 2.4-GHz CC2652R7 SimpleLink multiprotocol wireless MCU or an AM243x MCU-hosted system to enable greater IoT flexibility with Wi-Fi 6, Bluetooth LE 5.3, Thread, Zigbee 3.0 and Matter protocols.

Samples of the CC33xx companion ICs are available in a quad flat no-lead (QFN) package and start at US$1.60 in 1,000-unit quantities. A new, easy-to-use BP-CC3301 evaluation board is available for purchase for US$39. Volume production for the CC3300 and CC3301 is expected in the fourth quarter of 2023. TI is also developing pin-to-pin compatible, dual-band 2.4- and 5-GHz Wi-Fi 6 devices that will be available as samples later this year.

https://www.TI.com

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Customisable RISC-V IP cores is fully customisable, says Semidynamics 

Claimed to be the first fully customisable 64-bit RISC-V family of cores to be able to handle the large amounts of data required for AI, machine learning and high performance computing (HPC), cores released by Semidynamics are process agnostic. Versions are available down to 5nm.

Customers can control the configuration, said Semidynamics, rather than having, configurations fixed by the vendor or with a limited number of configurable options such as cache size, address bus size, interfaces and a few other control parameters. The IP cores available from Semidynamics enable the customer to have control over the configuration, in terms of new instructions, separate address spaces or new memory accessing capabilities . “This means that we can precisely tailor a core to meet each project’s needs so there are no unrequired overheads or compromises,” said Roger Espasa, CEO and founder of Semidynamics. “Even more importantly, we can implement a customer’s ‘secret sauce’ features into the RTL in a matter of weeks,” he added. 

The first core, the Atrevido, is available for licensing now. It has out-of-order scheduling that is combined with the company’s proprietary Gazzillion technology. The core can handle highly sparse data with long latencies and with high bandwidth memory systems, typically found in today’s machine learning applications. According to Semidynamics, Gazzillion technology removes the latency issues that can occur when using CXL technology to enable far away memory to be accessed at supercharged rates.

The Gazzillion technology is specifically designed for recommendation systems that are a key part of data centre machine learning processes. By supporting over a hundred misses per core, an SoC design can deliver sparse data to the compute engines without a large silicon investment. In addition, the core can be configured from two- for four-way versions to help accelerate the not-so-parallel portions of recommendation systems.

For the most demanding workloads, such as HPC, the Atrevido core supports large memory capacities with its 64-bit native data path and 48-bit physical address paths. According to Espasa, these are the fastest cores on the market for moving large amounts of data with a cache line per clock at high frequencies “even when the data does not fit in the cache. And we can do that at frequencies up to 2.4Hz on the right node” making them suitable for applications streaming a lot of data and/or if the application touches very large data that does not fit in cache. Competing core IPs average one cache line over many cycles, he added.

MMU support means Atrevido is also Linux-ready including supporting cache-coherent, multi-processing environments from two to hundreds of cores. It is vector ready, supporting both the RISC-V Vector Specification 1.0 as well as the upcoming Semidynamics Open Vector interface. Vector instructions densely encode large numbers of computations to reduce the energy used by each operation. Vector Gather instructions support sparse tensor weights efficiently to help with machine learning workloads.

Espasa concluded, “No-one else has such a complex RISC-V core that can be totally configured to perfectly meet the specific needs of each project rather than having to use an off-the-shelf core and compromise.”

http://www.semidynamics.com

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