Dual-band SoC supports long-range wireless protocols for robotics

A dual-band FG28 SoC, designed for long-range networks and proprietary protocols such as Amazon Sidewalk and Wi-SUN includes radios for sub-GHz and 2.4Ghz Bluetooth LE. Silicon Labs announced that the FG28 also has a built-in AI / ML accelerator for machine learning inference and its proprietary Secure Vault technology.

“The FG28 SoC addresses several key needs for our customers when it comes to developing and deploying low-power wide area networks,” said Daniel Cooley, CTO of Silicon Labs. “By including Bluetooth, it gives users an easy way to provision and deploy new devices onto the network, while the sub-Ghz band is designed to support device communications over one mile, allowing for new edge applications in areas like smart agriculture, smart cities, and neighbourhood networks like Amazon Sidewalk.”

Emerging applications require solutions that can provide a “Swiss army knife” of connectivity options, said Silicon Labs. By providing sub-Ghz connectivity using networks like Wi-SUN, the FG28 can serve as the battery-operated end node in smart cities, for example, as a tracker on refuse collection lorries to help locate them and check the last time they were emptied. Other uses are in irrigation systems across multi-acre commercial farming operations, or as livestock trackers and health monitors on sprawling ranches. Bluetooth connectivity not only allows for devices to easily be deployed on the network, but also allows for operators to connect to the device locally for diagnostics and data downloads.

Other features which open new applications for sub-Ghz devices are what is claimed to be the industry’s first integrated AI / ML hardware accelerator in a sub-Ghz SoC. This allows for machine learning inference at the edge to enable predictive maintenance warnings, monitor soil conditions for key conditions like moisture and pH levels.

There is also 1024kbytes of flash storage and 256kbytes of RAM, to meet the memory needs of a wide range of protocols and technology stacks, said Silicon Labs.

Its Secure Vault Mid and High support allow designers to choose the level of security needed for applications while the energy-efficient radio core with low active and sleep currents with fast wakeup times preserver battery life for end nodes.
There are also up to 49 general purpose I/O pins.

The FG28 is sampling now with general availability planned before the end of Q3 2023. Derivatives optimised for Amazon Sidewalk and Z-Wave Long-Range and a standalone MCU are also planned.

http://www.Silabs.com 

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u-blox bases two GNSS positioning modules on F9 

Two GNSS positioning modules, the NEO-F9P for industrial machinery and the ZED-F9P-15B for mobile robotics, have been introduced by u-blox.

Both are based on the company’s F9 platform. The low-power NEO-F9P supports navigation and automation of moving industrial machinery and the ZED-F9P-15B provides customers in the mobile robotics market with an L1/L5 option in addition to the L1/L2 bands.

The u-blox NEO-F9P GNSS module features include concurrent reception of GPS, Galileo and BeiDou, multi-band L1/L5 RTK and short convergence times. It delivers centimetre-level accuracy in seconds and comes in the smallest form factor for a high-precision module, said u-blox. It is 50 per cent smaller than the regular u-blox ZED. 

The small size, coupled with very low power consumption and ANN-MB1 antenna compatibility, makes the u-blox NEO-F9P suitable for navigation and automation in smart antennas, UAVs (unmanned aerial vehicles) and mobile robotics. It supports open as well as standards-based correction services for enhanced performance, such as the u-blox PointPerfect GNSS augmentation service.

The modules are the company’s response to the increased requirement for precise navigation and automation in industrial applications, particularly in the UAV and mobile robotics sectors, commented Alex Ngi, product manager, industrial navigation and robotics at u-blox. “By delivering centimeter-level accuracy in a compact and energy-efficient module, the NEO-F9P, u-blox proven RTK engine, is ideal for space-constrained designs,” he added.  

The NEO-F9P offers customers an effective upgrade path from the u-blox NEO-M8P model and the ZED-F9P-15B provides existing ZED customers with an L1/L5 alternative to L1/L2.

u-blox specialises in positioning and wireless communication in automotive, industrial and consumer markets, providing services and products which let people, vehicles and machines determine their precise position and communicate wirelessly over cellular and short range networks. The company’s portfolio include chips, modules and secure data services and connectivity to empower customers to develop innovative and reliable solutions for the IoT.

The company is headquartered in Thalwil, Switzerland and has offices in Europe, Asia, and the USA. 

http://www.u-blox.com

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Topside cooling creates thinner, lighter 5G radio units

Topside cooled RF amplifier modules have been developed by NXP Semiconductors and based on packaging designed to enable thinner and lighter radios for 5G infrastructure. 

Smaller base stations can be more easily and cost-effectively installed, increasing network density, while being able to blend more discretely into their environment, said NXP. Its GaN multi-chip module series, combined with what is claimed to be the industry’s first topside cooling for RF power, helps to reduce not only the thickness and weight of the radio by more than 20 per cent, but also the carbon footprint for the manufacture and deployment of 5G base stations.

“Top-side cooling represents a significant opportunity for the wireless infrastructure industry, combining high power capabilities with advanced thermal performance to enable a smaller RF subsystem,” said Pierre Piel, vice president and general manager for radio power at NXP. 

Benefits afforded by NXP’s topside cooled devices are the removal of the dedicated RF shield, use of cost-effective and streamlined PCBs and separation of thermal management from RF design. These features help networking solution providers create slimmer and lighter 5G radios for mobile network operators, while reducing their overall design cycle, NXP added.

NXP’s first topside cooled RF power module series is designed for 32T32R, 200W radios covering 3.3 to 3.8GHz. The devices combine the company’s in-house LDMOS and GaN semiconductor technologies to enable high gain and efficiency with wideband performance, delivering 31dB gain and 46 per cent efficiency over 400MHz of instantaneous bandwidth.

The A5M34TG140-TC, A5M35TG140-TC and A5M36TG140-TC modules are available today. The A5M36TG140-TC will be supported by NXP’s RapidRF reference board series. 

NXP Semiconductors specialises in secure connectivity solutions for embedded applications in the automotive, industrial and IoT, mobile and communications infrastructure markets while advancing a more sustainable future. The company has over 60 years of combined experience and expertise and operates in more than 30 countries.

http://www.nxp.com

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Infineon adds support for AutoSAR v4.4.0 to Aurix software

Support for AutoSARv4.4.0 extend the Aurix TC3xx MCAL support already available from Infineon Technologies. This expansion adds ASIL D and SIL-2 compliant drivers to support AUTOSARv4.4.0.

For ASIL D applications, the MC-ISAR TC3xx roadmap has been updated to also provide ASIL D compliant drivers. With the upcoming Maintenance Release 2.25.0, the driver will include ASIL D compliant software products. Support for IEC 61508 SIL-2 will be provided with Release 2.30.0. The latest release aims at AutoSAR applications in all automotive domains, including engine, chassis, safety, and body. It also applies to commercial agricultural vehicles (CAV), industrial and marine applications, Infineon noted.

According to the company, the biggest advantage of the MC-ISAR AS440 EXT TC3xx is its support for the latest standards, eliminating the need for additional drivers for ASIL D argumentation. It facilitates software partitioning and provides more flexibility by allowing the driver to run in an ASIL D domain, simplifying system-level security argumentation. Developers can therefore work with a production-ready driver with a qualification and safety certification that is ASIL D compliant, helping to avoid systematic failures. In addition, the driver offers ISO 21434 support for continuous monitoring. 

Infineon’s partners further assist developers with additional services and support.

The listed AutoSARv4.4.0 MCAL software packages is provided with MC-ISAR Basic drivers enabled (MCU,DIO, ICU, GPT, PWM , SPI , ADC, WDG, OCU, FLS, FEE, CAN, CanTrcv, LIN, BFX, CRC).

Another driver is the MC-ISAR Com Enhanced (FlexRay, Ethernet). Infineon also provides the MC-ISAR MCD MCAL complex driver – 11 complex drivers in addition to the standard AutoSAR drivers (DMA, FLSloader, UART, DS-ADC, SMU Safety Management Unit, DEMOCD: HSSL, SENT, I²C, IOM I/O Monitoring, STM System Timer, IRQ Interrupt Request).

In addition, the software packages include important features like AutoSAR BFX and CRC library, ASPICE L2, ASIL D process for FFI, MISRA 2012 change 1 (CERT-C) compliance (AUTOSARv4.4.0), and ISO 21434 support for continuous monitoring.

The key ASIL D compliant drivers with IEC 61508 SIL-2 support will be available from mid-2023. 

http://www.infineon.com

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