ICs & Semiconductors Archives - Page 57 of 235

NXP opens up S32K3 automotive microcontrollers to AWS cloud services

Tue, Oct 10, 2023

NXP Semiconductor has integrated Amazon Web Services (AWS) into its S32K3 automotive microcontroller series for body, zone control, and electrification applications.

The S32K3, S32Z/E, S32G2 and S32G3 enable new in-vehicle and secure cloud services. Using FreeRTOS libraries supporting AWS IoT Core, NXP’s S32K3 with integrated cloud connectivity speeds up the development time for software-defined vehicles (SDVs) to securely connect to the cloud and deliver vehicle data-driven insights and services and over-the-air (OTA) updates, claimed NXP. The software libraries also enable seamless connectivity between the S32K3 and devices running AWS IoT Greengrass.

AWS IoT services have been integrated with NXP’s S32G vehicle network processor for service-oriented gateways since 2020. The NXP S32 devices’ software with AWS cloud solution supports a range of communication technologies and can be used with wireless connectivity technologies like 4G/5G cellular and Wi-Fi. Now NXP S32K3 devices can connect directly to AWS cloud services or a more powerful S32G device using AWS cloud services such as AWS IoT Core, AWS IoT Greengrass or AWS IoT FleetWise.

Extending AWS connectivity to S32K3 gives automotive OEMs the flexibility to build AWS cloud connectivity into their vehicles regardless of the vehicle architecture used and supports the vehicle architecture transition. This includes architectures in which the S32K3 acts primarily as an end node or zonal controller and supplements an S32G vehicle network processor, as well as configurations with multiple S32K devices without an S32G processor, with at least one S32K3 acting as a gateway to access AWS cloud services.

The combination of NXP’s S32 vehicle compute platform and AWS cloud connectivity is appropriate for different mobility types. For example, the direct connection of the S32K3 devices to the cloud is suitable for smaller vehicles such as electric bicycles and scooters, where the S32K3 acts as the aggregator or main controller.

The NXP S32K3 devices are scalable, low power Arm Cortex-M series-based microcontrollers that are AEC-Q100 qualified with advanced safety and security and software support for automotive and industrial ASIL B/D applications in body, zone control and electrification. There is a dedicated hardware security engine (HSE) and A/B swap capability and OTA firmware updates to the S32K3 are secure and protected, said NXP. The devices are supported by a minimum of 15 years of product longevity and a comprehensive, third-party software and tools ecosystem.

Access to and processing of real time, vehicle wide data with secure access to cloud services and machine learning can enable intelligent vehicles that continually improve with OTA updates. This can provide insights into vehicle performance and health, driver behaviour and traffic patterns for automotive manufacturers while consumers can extend the longevity of their vehicles and add features. NXP suggested one example could be that data collected and analysed can lead to new revenue streams with services such as usage-based insurance.

http://www.nxp.com

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Space computing reference design provides high speed data connectivity

Thu, Oct 05, 2023

Based on Microchip Technology’s radiation-tolerant GbE PHYs, the QLS1046-Space reference design has been developed by Teledyne e2v to provide high speed data connectivity in space applications.

The space computing reference design was presented at EDHPC 2023 (European Data Handling & Data Processing Conference, October 2-6, 2023 in Juan-Les-Pins, France) and enables high speed data routing in space applications.

It features Teledyne e2v’s radiation tolerant Qormino QLS1046-Space processing platform and data communication technology from Microchip. The radiation-tolerant design delivers robust, high performance processing, with enhanced sub-system connectivity capabilities. The QLS1046-Space has 30,000 DMIPS computing capability via the quad Arm Cortex-A72 cores and four to 8Gbyte of high speed DDR4 and multiple high speed interfaces. The architecture can process and route large incoming data rates from various sources, including telecommunication RF front ends, high resolution image sensors, radars, and other processing devices in the spacecraft.

The GbE interfaces ensure high-speed connectivity, supported by Microchip’s radiation tolerant Ethernet PHYs, claimed Teledyne e2v. The space computing reference design uses the VSC8541RT PHY to offer two RGMII links, and the VSC8574RT to offer two SGMII interfaces. The four Gigabit Ethernet connections could be ported up to seven Ethernet interfaces by exploiting all high speed interfaces available for high speed transfers between the QSL1046-Space and the other devices placed on different accompanying boards within the satellite or spacecraft. Target use cases include Earth observation, satcom applications, defence in space and space debris monitoring.

“In the vast majority of cases, modern space hardware will have a decentralised architecture. Normally communication between the constituent subsystems relies on 10 to100Mbit data transfer rates, explained Thomas Porches, application engineer at Teledyne e2v. “Greater levels of functional sophistication are now being incorporated for purposes like advanced telecommunication schemes, real time image processing, AI-driven analysis, and navigation.

“By working with Microchip, we’ve been able to significantly boost the interfacing capabilities for designs using the QLS1046-Space, leading to accelerated speeds plus extended propagation range. Consequently, they are completely aligned with what space customers are now demanding for edge computing applications.”

Staff from both Teledyne e2v and Microchip will present papers relating to their involvement in edge-located processing and inter-board communication for space deployments at the conference.

http://www.teledyne.com

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Cube architecture targets powerful edge AI devices, says Winbond

Mon, Oct 02, 2023

Affordable edge AI computing can be enabled in mainstream use cases with the CUBE customised ultra-bandwidth elements) architecture which has been introduced by Winbond Electronics. The architecture optimises memory technology for seamless performance running generative AI on hybrid edge/cloud applications.
CUBE enhances the performance of front-end 3D structures such as chip on wafer (CoW) and wafer on wafer (WoW), as well as back-end 2.5D/3D chip on Si-interposer on substrate and fan-out solutions, said Winbond. It is compatible with memory density from 256Mbit to 8Gbit with a single die, and it can also be 3D stacked to enhance bandwidth while reducing data transfer power consumption.

Winbond said CUBE is a major step forward, enabling seamless deployment across various platforms and interfaces. The technology is suited to advanced applications such as wearable and edge server devices, surveillance equipment, ADAS and co-robots, said the company.
The company believes that the integration of cloud AI and powerful edge AI will define the next phase of AI development. “With CUBE, we are unlocking new possibilities and paving the way for improved memory performance and cost optimisation on powerful edge AI devices,” added the company.
CUBE is power efficient, consuming less than 1pJ/bit, ensuring extended operation and optimised energy usage. It has bandwidth capabilities ranging from 32Gbytes per second to 256Gbytes per second per die for accelerated performance that exceeds industry standards.
Memory capacities range from 256Mbit to 8Gbit per die, based on the 20nm specification now and 16nm in 2025. This allows CUBE to fit into smaller form factors seamlessly. The introduction of through-silicon vias (TSVs) further enhances performance, improves signal and power integrity while reducing the I/O area through a smaller pad pitch, said Winbond. It also reduces heat dissipation, especially when using SoC on the top die and CUBE on the bottom die, advised the company.
It is also cost-effective, said Winbond, boosting the data rate up to 2Gbits per second with total 1K I/O. When paired with legacy foundry processes like 28nm/22nm SoC, CUBE unleashes high bandwidth capabilities, reaching 32 to 256Gbytes per second, equivalent to harnessing the power of 4-32pcs LP-DDR4x 4266Mbits per second x16 I/O bandwidth.
Stacking the SoC (top die without TSV) on top of the CUBE (bottom die with TSV) minimises the SoC die size, eliminating any TSV penalty area, said Winbond.
The company said CUBE can unleash the full potential of hybrid edge/cloud AI to elevate system capabilities, response time, and energy efficiency.
The company added that it is actively engaging with partner companies to establish the 3DCaaS platform, which will leverage CUBE’s capabilities.
Winbond Electronics supplies semiconductor memory products with capabilities of product design, R&D, manufacturing and sales services. The company’s product portfolio consists of specialty DRAM, mobile DRAM, code storage flash and TrustME secure flash for tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and has subsidiaries in the USA, Japan, Israel, China, Hong Kong and Germany and 12 inch fabs in Taichung and Kaohsiung in Taiwan.

https://www.winbond.com

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SoM and starter kit accelerate development for motor control and DSP applications

Thu, Sep 21, 2023

Additions to the Kria portfolio of adaptive system on module (SoM) and developer kits have been announced by AMD. The Kria K24 SoM and KD240 Drives starter kit are available to order now.

The Kria K24 SoM offers power-efficient compute in a small form factor and targets cost-sensitive industrial and commercial edge applications, explained the company. InFO (integrated fan-out) packaging results in the K24 being half the size of a credit card while using half the power of the larger, connector-compatible Kria K26 SoM.

It provides high determinism and low latency for powering electric drives and motor controllers used in compute-intensive DSP applications at the edge, such as electric motor systems, robotics for factory automation, power generation, public transportation such as elevators/lifts and trains, surgical robotics and medical equipment such as MRI beds, and also EV charging stations.

The KD240 Drives starter kit is a motor control-based development platform. Coupled with the 24 SoM, users can quickly develop motor control and DSP applications at a reduced time to market and without requiring FPGA programming expertise.

The K24 SoM features a custom-built Zynq UltraScale+ MPSoC device and the supporting KD240 starter kit is a sub-$400 FPGA-based motor control kit. Enabling developers to begin at a more evolved point in the design cycle, the KD240 provides easy access for entry-level developers compared to other processor-based control kits.

The K24 SOM is qualified for use in industrial environments with support for more design flows than any generation before it, said AMD. That includes familiar design tools like Matlab Simulink and languages like Python with its extensive ecosystem support for the PYNQ framework. Ubuntu and Docker are also supported. Software developers can also use the AMD Vitis motor control libraries while maintaining support for traditional development flows.

“The K24 SOM delivers high performance-per-watt in a small form factor and houses the core components of an embedded processing system on a single production-ready board for a fast time to market,” said Hanneke Krekels, corporate vice president, Core Vertical Markets, AMD.

It is estimated that around 70 per cent of the total global electrical use by the industrial sector is tied to electric motors and motor-driven systems. AMD said that even a one per cent improvement in the efficiency of a drive system can have a significant positive impact on operational expenses and the environment.

The KD240 is supported by an optional motor accessory pack (MACCP), with additional motor kits available in the future that can be purchased separately for an enhanced ramp-up experience for developers.

K24 SOMs are offered in both commercial and industrial versions and are built for 10-year industrial lifecycles. In addition to support for expanded temperature ranges, the industrial-grade SoM includes ECC-protected LPDDR4 memory for high-reliability systems.

The K24 commercial version is shipping today, and the industrial version is expected to ship in Q4.

https://www.amd.com

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NXP opens up S32K3 automotive microcontrollers to AWS cloud services

Space computing reference design provides high speed data connectivity

Cube architecture targets powerful edge AI devices, says Winbond

SoM and starter kit accelerate development for motor control and DSP applications

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