Robust package technology, MRigidCSP, by Alpha and Omega Semiconductor (AOS), is initially offered on its AOCR33105E, 12V, common drain, dual N-channel MOSFET. The packaging technology is designed to decrease on resistance while increasing mechanical strength, and is particularly suited to battery applications in smartphones, tablets and ultra-thin notebooks.
AOS explained that fast charging, which requires lower power loss in the battery management circuit, is now widely adopted for portable devices. As the charging currents increase, ultra-low electrical resistance is needed for improved performance. In standard wafer-level chip scale packages (WL-CSPs), the substrate can be a significant portion of the total resistance when back-to-back MOSFETs are employed in battery management applications. A thinner substrate reduces the overall resistance but drastically reduces the package’s mechanical strength. This reduction of mechanical strength can lead to more stress during the PCB assembly reflow process, potentially causing warping or cracking in the die and, ultimately, failure in the application. The AOCR33105E is designed with trench-power MOSFET technology in a common drain configuration for design simplicity. It features low on resistance with ESD protection to improve performance and safety in battery management, such as protection switches and mobile battery charging and discharging circuits.
“Incorporating the AOS MRigidCSP packaging technology with our new dual N-channel MOSFET combines electrical performance improvements with the benefit of high robustness,” said Peter H. Wilson, senior MOSFET product line marketing director at AOS.
AOS designed the MRigidCSP package technology to be used with high aspect ratio CSP die sizes. The CSP construction delivers “a significantly strengthened battery MOSFET that won’t warp or break during the board manufacturing process,” added Wilson.
The AOCR33105E is available in a 2.08 x 1.45mm package, with RDS(on) of 3mOhm at 4.5V / 4.2mOhm at 3.1V.
The AOCR33105E in the MRigidCSP package is immediately available in production quantities with a lead time of 14 to 16 weeks. It is RoHS 2.0 compliant and is halogen-free.
ICs & Semiconductors
TMCS1123 extends EZShunt portfolio to simplify current sensing
The latest addition to Texas Instruments’ current sensors portfolio is the TMCS1123 Hall-effect current sensor. It helps engineers simplify designs while improving accuracy, said the company.
Designed for a broad range of common-mode voltages and temperatures, the TMCS1123 series includes what is claimed to be a lowest-drift isolated Hall-effect current sensor for high voltage systems. There is also a portfolio of current shunt monitors that eliminate the need for an external shunt resistor for non-isolated voltage rails.
The TMCS1123 is also claimed to have the industry’s highest reinforced isolation and highest accuracy over lifetime and temperature. Its high accuracy and low propagation delay enables designers to use Hall-effect sensors in previously unrealisable high voltage systems, said the company, to reduce system cost and size.
The need for highly accurate current measurements in high-voltage systems such as electric vehicle chargers and solar inverters is growing, but Hall-effect current sensors have typically been overlooked given their high drift over lifetime. The TMCS1123 Hall-effect current sensor features the highest reinforced isolation working voltage of 1,100V DC. It also features a maximum sensitivity error of ±0.75 per cent with 50 ppm per degree C drift over temperature and ±0.5 per cent drift over lifetime. The TMCS1123 features low propagation delay of 600 nanoseconds and bandwidth of 250kHz, which enable faster control loops while keeping noise low to help increase system efficiency. The high precision and stability over lifetime remove the need to recalibrate equipment, reducing costly and time-consuming maintenance, added TI.
For non-isolated systems up to 85V and 75A RMS, TI also offers what is believed to be the industry’s smallest fully integrated current shunt monitor and the industry’s highest accuracy 75A integrated shunt solution.
TI’s EZShunt portfolio of current-sensing solutions simplifies designs by removing the need for an external shunt resistor. It provides a fully integrated current-sensing solution that fits within the footprint of a 1206 shunt resistor.
Pre-production quantities of the TMCS1123 Hall-effect current sensor are available now, in a 10.3 x 10.3mm, 10-pin small outline integrated circuit (SOIC) package. Designers can purchase the TMCS1123EVM evaluation module.
Higher bandwidth and automotive-qualified versions of the TMCS1123 are expected to be available in fourth quarter of 2023 and second quarter of 2024, respectively.
Gigabit Ethernet switch has a real time engine for industrial automation
With the ability to process high speed cyclical data in flight, the LAN9662 is Microchip’s latest Gbit Ethernet switch for industrial automation.
For automation networking, it has four ports, audio-video bridging and time sensitive networking (AVB/TSN), two integrated 10/100/1000BASE-T PHYs and a 600MHz Arm Cortex-A7 CPU subsystem.
A real time engine support industrial Ethernet applications, and provides the ability to modify the Ethernet frame in flight. This enables faster cyclical data rates and low latency, confirmed Microchip. The LAN9662 is compliant with key industry standards such as the OPC Unified Architecture (OPC/UA) and PROFINET software stack, offering deterministic communication capabilities necessary for industrial networking applications.
“Expanding on the LAN966x family, the LAN9662 opens a path to scale with TSN-enabled networking endpoints,” explained Charles Forni, vice president of Microchip’s USB and networking business unit. Developers can start designs knowing that industry standards are met and supported by a comprehensive software portfolio.
With two integrated PHYs, the LAN9662 provides low latency to support various daisy chain topologies. The PHY interfaces enable fast data processing within a specified time to provide a reliable network for automation applications such as motor, conveyor and multi-axis robot controllers.
The LAN9662 supports multiple interfaces, namely up to two RGMII/RMII, up to two 1000BASE-X/SerDes/2.5GBASE-X/KX, and a Quad-SGMII/Quad-USGMII interface. The configurable interfaces allow designers to reach various types of physical layers or interconnects as required.
The LAN9662 is supported by Microchip’s Switch API, the EVB-LAN9662 and the EVB-LAN9662 carrier board. Software support is also offered through Platform BSP, Linux Switchdev and PROFINET Software Stack.
Microchip Technology offers a wide product portfolio of smart, connected and secure embedded control solutions with development tools for customers operating in the industrial, automotive, consumer, aerospace and defence, communications and computing markets. It is headquartered in Chandler, Arizona, USA.
Silicon Labs unveils Amazon Sidewalk optimised SoCs
Two SoCs unveiled by Silicon Labs, the SG23 and SG28, are optimised for Amazon Sidewalk.
To address the varied technologies and protocols that exist in the IoT today, the Silicon Labs portfolio includes different device families and derivatives for different parts, such as the BG line of Bluetooth SoCs and the ZG line of Z-Wave SoCs, and this latest addition, the SG family of SoCs optimised for Amazon Sidewalk.
The always-on Amazon Sidewalk network uses Bluetooth LE for device provisioning and nearby device connectivity, sub-GHz FSK for connectivity up to one mile, and a proprietary CSS radio for extreme long range. Most Amazon Sidewalk end-devices will support Bluetooth LE and either FSK or CSS. The SG28 includes two dual-band SoCs with radios for both sub-GHz FSK as well as Bluetooth LE. These dual-band parts help simplify devices and reduce cost by including the two most commonly used radios on Sidewalk end devices in a single package. The SG23 provides security and a robust sub-GHz link budget for long range, end node devices.
The company has also introduced developer tools as the company continues to work closely with Amazon to provide developers with the hardware, software, and development tools needed to navigate the Amazon Sidewalk development process.
Silicon Labs has worked directly with Amazon to create the Amazon Sidewalk Developer’s Journey, a guide with 12 steps organised in three stages, covering determining if a targeted region has Amazon Sidewalk coverage, device deployment and ongoing support for devices in the field. The guide includes technical documentation, videos, and code samples, with the option to engage a Silicon Labs expert for support. Silicon Labs provides all the tools needed for each step, and by following the Developers Journey, device makers are well-positioned for Amazon Web Services and Amazon Sidewalk certification and approval.
Silicon Labs develops secure, intelligent wireless technology for a more connected world with an integrated hardware and software platform, intuitive development tools, ecosystem and robust support for building advanced industrial, commercial, home, and life applications.
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