Renesas bases high performance MCUs on Arm Cortex-M85 

Claimed to be the world’s most powerful microcontrollers (MCUs), the RA8 series from Renesas Electronics deliver breakthrough performance of over 3000 CoreMark points. It is also characterised by fully deterministic, low latency, real time operation.

The MCUs are believed to be the first to implement the Arm Cortex-M85 processor, enabling the new devices to deliver industry-leading 6.39 CoreMark / MHZ performance. They are part of Renesas’ RA family of MCUs based on Arm Cortex processors. Existing designs built for other RA devices can be ported to the new RA8 MCUs.

This level of performance will allow system designers to use the MCUs in applications that previously required microprocessors, advised Renesas

The RA8 series MCUs deploy Arm Helium technology, Arm’s M-Profile vector extension that provides up to a four-fold performance boost for digital signal processor (DSP) and machine learning (ML) implementations versus MCUs based on the Arm Cortex-M7 processor. This performance uplift can enable customers to eliminate an additional DSP in their systems for certain applications.

The MCUs enable edge and endpoint devices to implement natural language processing in voice AI and predictive maintenance applications, using Helium to accelerate the neural network processing.

“The advent of AI is increasing demand for intelligence at the edge and endpoints to serve new applications across diverse markets including industrial automation, smart home, and medical,” said Paul Williamson, senior vice president and general manager, IoT line of business, Arm. “Renesas’ new MCUs, built on Arm’s highest-performing and most secure Cortex-M processor to date, are specifically optimised for signal processing and ML workloads, and will be game-changing for innovators looking to address the growing AI opportunities in the embedded and IoT space, without compromising on security,”  he added.

For security, the RA8 series MCUs’ Cortex-M85 core includes Arm TrustZone technology which enables isolation and secure / non-secure partitioning of memory, peripherals and code. The MCUs introduce the most advanced Renesas Security IP (RSIP-E51A) that provides leading edge cryptographic accelerators and supports a true secure boot. Other security features include immutable storage for a strong hardware root-of-trust, Octal SPI with decryption-on-the-fly (DOTF), secure authenticated debug, secure factory programming and tamper protection. 

The Armv8.1-M architecture introduces Pointer Authentication and Branch Target Identification (PACBTI) security extension that provides mitigation for software attacks targeting memory safety violations and memory corruptions. The RA8 Series also targets PSA Certified Level 2 + Secure Element (SE), NIST CAVP and FIPS 140-3 certifications.

Low Power Features

Renesas has begun volume shipments of the first devices in the RA8 Series, the RA8M1 Group. These are general-purpose devices that address diverse compute intensive applications in industrial automation, home appliances, smart home, consumer, building/home automation, medical and AI in applications such as fingerprint scanners, thermostats, PLC, smart meters and home hubs.

They are available in a choice of packages: 100/144/176 LQFP, 224 BGA and supported by Flexible Software Package (FSP) to accelerate application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. 

Renesas is also shipping the RA8M1 Group Evaluation Kit (RTK7EKA8M1S00001BE). 

http://www.renesas.com

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Infineon goes beyond standard Wi-Fi with lates AIROC device

The latest addition to Infineon Technologies’ AIROC portfolio is the Airoc CYW5551x. This single device combines Wi-Fi 6 / 6E performance and advanced Bluetooth connectivity, making it suitable for a host of IoT applications.

The AIROC CYW5551x Wi-Fi 6/6E and Bluetooth 5.4 family delivers secured, reliable 1×1 Wi-Fi 6 / 6E (802.11ax) connectivity that goes beyond the standard, said Infineon. This is combined with advanced low power Bluetooth connectivity. The optimised CYW55512 is a dual-band Wi-Fi 6 solution and the CYW55513 is a tri-band Wi-Fi 6 / 6E device. Both feature power-efficient designs that are suitable for use in smart homes, industrial applications, wearable devices and equipment and other small factor IoT applications, said the company.

“Infineon’s new CYW5551x family brings the range, reliability, and network robustness from our 2×2 Wi-Fi 6/6E CYW5557x family of devices to an IoT optimised family,” said Sivaram Trikutam, vice president of Wi-Fi Products of Infineon. “As part of the company’s digitalisation and decarbonisation strategy, this family is optimised for very low power consumption, making it ideal for battery-operated devices like wearables and IP cameras,” he said. They are also tuned for best performance across a wide temperature range, enabling them to serve industrial and infrastructure applications such as electric vehicle charging and solar panel controls, logistics.

The AIROC CYW551x family offers support for the 6GHz band for Wi-Fi 6E, delivering lower latency and reduced interference. Bluetooth 5.4 low energy (LE) with Audio is range and power optimised with up to 20dBm transmit power. 

Other features include improved multi-layer security (PSA Level 1-certifiable) and design versatility supported by a wide ecosystem of module and platform partners. 

The devices feature Linux, RTOS and Android support, and have a fully validated Bluetooth stack and sample code to accelerate development time.

Infineon’s AIROC CYW55512 and CYW55513 are sampling now. The CYW5512 will be commercially available in March 2024, and the CYW55513 will be commercially available in June 2024. 

http://www.infineon.com

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Wireless charging transmitter reference design meets Qi2 standard

In response to the enhanced Qi wireless charging standard released by the Wireless Power Consortium, Infineon Technologies has released its first Qi2 Magnetic Power Profile (MPP) charging transmitter reference design kit, the REF_WLC_TX15W_M1. 

The MPP in Qi2 offers magnet-based fixed positioning for precision locating of charging devices. It has significant benefits in automotive and consumer applications, such as in-cabin wireless charging, smartphones and EarPods cases, portable speakers, and healthcare equipment through better efficiency and safety, said Infineon.

The reference design kit is highly integrated and form factor optimised with a diameter of less than 43mm. It also has a programmable wireless charging transmitter centred around an Infineon WLC1 controller – the Qi2-capable WLC1 is already on the market. The IC integrates a microcontroller with flash memory, a 4.5 to 24V DC input buck-boost controller, inverter gate drivers and factory-trimmed current sensing. It features analogue protection peripherals, USB PD, and LIN as well as serial interfaces enabling efficient and smart power delivery.

The REF_WLC_TX15W_M1 is supported with code examples in ModusToolbox to help users take advantage of the IC’s configuration capabilities. The 15W Qi2 MPP board is backwards compatible with a basic power profile (BPP) that allows receivers without MPP support to wirelessly charge at 5W. There is also a multi-path ASK demodulator and adaptive foreign object detection (FOD) provided for a robust and secure wireless power design.

“With the emerging Qi2 standards, our programmable solutions offer the flexibility that the industry needs to adapt swiftly and offer differentiated features for automotive and consumer applications,” said Ganesh Subramaniam, senior vice president and general manager of the Wired Connectivity Solutions Product Line at Infineon.

The WLC1 transmitter controllers can be ordered now. There are two versions, the WLC1515 for the automotive package and the WLC1115 for the consumer package. REF_WLC_TX15W_M1 board is available on demand. 

The first public live demonstration of the wireless charging transmitter solution board will take place during OktoberTech Silicon Valley, the annual technology collaboration forum hosted by Infineon. This year, it will take place in the Computer History Museum in Mountain View, California, USA on 25 October.

http://www.infinenon.com

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NXP reference platform puts two-wheelers in the picture

A combined digital instrument cluster and connectivity reference platform delivers high performance graphics and rich connectivity for an advanced two-wheeler user experience, said NXP Semiconductors.

It is designed for mass-market two-wheelers, including motorcycles, electric scooters and commuter bikes. It combines the i.MX RT1170 crossover microcontroller with AEC-Q100 Grade 3 qualification. This helps reduce system costs due to the highly integrated nature of the i.MX RT1170, which does not require expensive external memory or power management subsystems, said NXP. The NXP Wi-Fi and Bluetooth device drivers are pre-integrated into the MCUXpresso SDK (software development kit), along with display and GNSS, making it easy for developers to create their own twowheeler connected cluster. The dual-core i.MX RT1170 crossover MCU provides a wide range of interfaces for connecting peripherals, such as WLAN, Bluetooth, GPS, audio, displays, and camera sensors, plus a vector graphics accelerator. The i.MX RT1170 crossover MCU’s rich graphics capabilities are supported by NXP’s broad ecosystem of partners, including Altia, The QT Company, Embedded Wizard by TARA Solutions, and Crank.

The reference platform also includes the integrated AW611 a highly integrated dual-band Wi-Fi 6 and Bluetooth/Bluetooth Low Energy 5.2 single-chip solution with AEC-Q100 Grade 2 qualification. This high degree of integration enables efficient coexistence between internal radios, as well as with external radios, while helping to reduce system costs, said NXP.

The KW45 secure wireless access microcontroller delivers secure vehicle access and vehicle location services. Its three-core architecture integrates a 96MHz Arm Cortex-M33 application core, a dedicated Cortex-M3 radio core and an isolated EdgeLock secure enclave. It also integrates a Bluetooth Low Energy 5.3-compliant radio that supports up to 24 simultaneous secure connections.

Connected digital displays with rich graphics are essential to the safe operation of two-wheeler electric vehicles, which are rapidly gaining in popularity for transport around cities. The displays can provide critical information that allows drivers to compare navigation details to battery levels and health, as well as the location of charging points.

Telemetry in the field also provides OEMs with important information about usage and battery lifetimes.

NXP’s digital instrument cluster and connectivity reference platform is designed to allow OEMs to deliver these capabilities, while also enabling a wide variety of different connectivity use cases designed to improve the user experience, for example three-way Bluetooth pairing between the phone, scooter’s digital cluster, and headphones, rider and pillion music sharing or even location capabilities such as “find my bike” in a parking lot.

“Not only does the digital instrument cluster inform the driver of the state of their vehicle, it also represents the main way a driver can customise their vehicle to their preferences,” said Dan Loop, vice president and general manager, Automotive Edge, NXP. “NXP’s digital instrument cluster and connectivity platform enables consistent updates and customizations to support the latest safety, security and connectivity features, all in a platform that balances performance and wireless connectivity capabilities with cost considerations.”

The platform enables high-performance graphics and rich connectivity use cases such as hands-free calling, wireless pairing for smartphone projection, Bluetooth audio, over the air (OTA) updates, cloud connectivity, fleet management, secure vehicle access and vehicle location.

http://www.nxp.com

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