ICs & Semiconductors

32-bit RX microcontroller accelerates data rates for industrial sensor systems

Thu, Nov 23, 2023

Renesas Electronics has expanded its 32-bit microcontroller portfolio with a new RX device for industrial sensor systems. The RX23E-B, is a 32-bit device from the RX family and features a high-precision analogue front end (AFE), specifically designed for systems that demand fast and accurate analogue signal measurements. 

The new microcontroller integrates a 24-bit delta-sigma ADC capable of achieving a conversion speed of up to 125ksamples per second which is eight times faster than the existing RX23E-A. It can process accurate ADC while reducing RMS noise to 1/3 (0.18µVrms at 1ksample per second compared to the RX23E-A. 

The RX23E-B facilitates faster and more precise measurements of critical parameters such as strain, temperature, pressure, flow rate, current and voltage, making it suitable for high-end sensor devices, measuring instruments, and test equipment. It also has sufficient performance to drive force sensors used in industrial robots, which often demand measurements as fast as 10 microseconds (100,000 samples per second). The microcontroller also reduces overall system size and the component count by incorporating the analogue front end and the microcontroller on a single chip. 

Similar to the RX23E-A, the RX23E-B incorporates a 32MHz RXv2-based CPU with DSP instructions and a floating point unit. It also combines the analogue front end into a single chip using the same fabrication process. There are new peripheral functions such as a 16-bit DAC, which enables measurement adjustments, self-diagnosis, and analogue signal output. The device’s +/-10V analogue input enables +/-10V measurement with a 5V power supply without requiring external components or additional power supply. An LCD controller with a maximum of 40 SEG x 4 COM and a real-time clock (RTC) function are also included.

The RX23E-B is available in two versions, one that supports an ADC data rate of up to 125ksamples per second and one that supports up to 31.25ksamples per second. Both offer flexible data rate settings ranging from 3.8 SPS to the maximum value, allowing users to choose the best balance between data rate and noise for their specific system requirements. 

The microcontroller is available in a 5.5mm square, 100-pin BGA package and a 6.0mm square 40-pin QFN package. There are also wide pin packages ranging from 48- to 100-pin options. 

The RX23E-B is available now, along with a Renesas Solution Starter Kit for RX23E-B. 

http://www.renesas.com  

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Digital cockpit Antora 1000 computing platform powers Lynk SUV

Thu, Nov 23, 2023

A digital cockpit experience is enabled in the EM-P SUV by Lynk, courtesy of the Ecarx Antora 1000 computing platform.

The 08 EM-P SUV was the first vehicle to use Ecarx’s Antora 1000 Pro cockpit computing platform and now the 06 model is released with a 14.6-inch floating central control screen and a 10.2-inch TFT instrument cluster to support a diverse range of interactive functions and immersive experiences, from online navigation and voice command features to karaoke and e-sports.

The Antora 1000 features the SE1000 7nm automotive-grade SoC which provides 100k DMIPS (Dhrystone million instructions per second) of computing power and 900G FLOPS (floating point operations per second) of graphic rendering capability through a multi-core, heterogeneous computing engine and hardware architecture without virtualisation. This earned an AnTuTu benchmarking performance test score of over 500,000 which is approximately 20 per cent better than comparable processors currently available, said Ecarx.

There is also a programmable NPU (neural processing unit) and multiple acceleration engines capable of 8 Tera operations per second.

Memory is configurable to 16gByte and there is 128Gbyte of storage. It also has automotive-grade functional safety and information security solutions and certifications.

Ecarx is an automotive technology provider with the capabilities to deliver turnkey solutions for next-generation smart vehicles, from the SoC to central computing platforms and software. As automakers develop new electric vehicle architectures from the ground up, Ecarx is developing full-stack solutions to enhance the user experience, while reducing complexity and cost.

Founded in 2017 Ecarx has 11 major locations in China, UK, USA, Sweden, Germany and Malaysia. The co-founders are two automotive entrepreneurs, chairman and CEO, Ziyu Shen, and Eric Li (Li Shufu), who is also the founder and chairman of Zhejiang Geely Holding Group with ownership interests in brands including Lotus, Lynk, Polestar, Smart and Volvo Cars. Ecarx also works with other well-known automakers, including FAW and Dongfeng Peugeot-Citroën. 

http://www.ecarxgroup.com

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Long range microcontrollers simplify wireless design for smart buildings

Tue, Nov 21, 2023

Wireless device design expertise gained by STMicroelectronics is combined with its STM32 architecture in the new STM32 SoC which has low power operation and multi-protocol support.

The microcontroller simplifies wireless system design for diverse use cases including metering and monitoring devices in smart buildings, factories and cities, said the company. It is characterised with power-saving features which enable the extension of battery life in the new wireless microcontroller of more than 15 years.

The STM32WL3 wireless microcontroller is designed to be used in remotely deployed applications including metering and monitoring devices and data from alarm systems, actuators, and sensors in smart buildings, smart factories and smart cities. It can help limit power consumption and prioritise activities to improve user experience, service delivery and to reduce the environmental footprint, explained ST.

This is the latest in ST’s lineup of integrated wireless chips. The STM32WL3 contains an advanced, power-efficient multi-protocol radio suitable for long range communication and using license-free frequency bands reserved globally for industrial, scientific and medical (ISM) applications.

The long-range radio on the STM32WL3 microcontrollers operate in the internationally designated license-free frequency bands, 413MHz to 479MHz and 826MHz to 958MHz, with the support for 169MHz coming in 2024.

In addition to the main radio, ST has integrated a low power radio and the system can power down to save energy while listening continuously for a wake-up signal.

The radio is multi-protocol and multi-modulation capable, supporting 4-(G)FSK up to 600kbit per second, 2-(G)FSK, (G)MSK, DBPSK, DSSS, OOK, ASK modulation schemes.

The STM32WL3 microcontrollers can add value to smart connected devices, for example to reduce power and add long range wireless connectivity to existing networking products, as is the case with Lierda which uses the microcontroller’s wake-up radio to minimise power consumption, while the Lierda module monitors and maintains network equipment across a point-to-point or point-to-multipoint wireless connection.

Another customer, Silent Smart Technology, has created a family of modules based on STM32WL3 wireless mictrocontrollers that operate in various sub-1GHz frequency bands. The modules support multiple transmission modes, channel monitoring, wireless relay and other functions. The wakeup feature allows the modules to operate in deep-sleep mode, consuming only about 1microA overall current while remaining ready to return to full operation.

Benoit Rodriguez, wireless business line general manager, STMicroelectronics, said: “Special features such as the wake-up radio and our flow-metering LC sensor controller enable energy-saving designs in smart metering, smart agriculture, and asset tracking that run for up to 15 years from a small battery.”

The radio is multi-protocol and multi-modulation capable, supporting 4-(G)FSK up to 600kbit/s, 2-(G)FSK, (G)MSK, DBPSK, DSSS, OOK, ASK modulation schemes to maximize versatility and ease deployment.

On-board peripherals include an LCD driver, a 12-bit 1Msample per second ADC, analogue comparator, DAC and multiple timers. Together with an integrated balun, RF power amplifier and switch mode power supply, they minimise external bill of materials (BoM) for a cost-optimised solution with short time-to-market, said ST.

Tailored to the specific needs of smart-metering applications, the STM32WL3 embeds an LCD controller and a specific peripheral – LC sensor controller – for fluid flow measurement. The multi-protocol support enables cost-efficient deployment of one single platform over different long-range wireless technologies, including Sigfox, KNX, mioty, M-Bus said ST.

The complete lineup in the STM32WL3 series contains devices with Flash density from 64kbyte to 256kbyte and 16kbyte or 32kbyte RAM, in a 32-pin or 48-pin VFQFPN package. There is also an extended temperature range option, from -40 to +105 degrees C.

All variants are covered with ST’s 10-year longevity guarantee for industrial products. Sample quantities are available now.

https://www.st.com.

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ITEC claims latest RFID inlay die bonder is fastest and most accurate yet

Tue, Nov 21, 2023

According to ITEC, its ADAT3 XF Tagliner is the industry’s fastest and most accurate RFID inlay die bonder. It has placement speeds of up to 48,000 units per hour (UPH), with positional and rotational accuracies better than nine microns and 0.67 degrees at one sigma. It is three times faster and 30 per cent more accurate than other die bonding equipment, claimed the company. “

The ADAT3 XF Tagliner is fully automated, with yields in excess of 99.5 per cent. It is also claimed to have the industry’s lowest total cost of ownership for equipment of this type, enabling it to bring a “significant competitive advantage” through lower manufacturing costs, said the company. It can be used in a broad range of new RFID applications including retail and automotive labels, access control, railway tickets, airline luggage tags and shipping containers.

ITEC has over 30 years’ experience in RFID, installing high-volume semiconductor chip-attach systems in multiple markets. The ADAT3 XF Tagliner includes semiconductor industry-standard features like automatic wafer change (for eight- and 12-inch wafers) and multiple high-resolution cameras inspecting before and after every process step.

The machine’s high-precision glue curing system has only two thermodes. This results in fewer moving parts for improved reliability and maintainability. The curing time of 65 milliseconds is two orders of magnitude lower than other RFID die bonders (typically several seconds), which increase operating efficiency.

The ADAT3 XF Tagliner can accommodate a diverse range of transparent and opaque web materials. That gives it another advantage over incumbent RFID die bonding equipment, said ITEC which can only use transparent material. The system integrates BW Paper systems winders and Voyantic readers, which allows it to be used with emerging and more sustainable substrate materials like paper, which are gradually replacing PET plastics. Even up to a web pitch of 50.8mm, it mains a speed of 48,000 UPH, confirmed ITEC.

The RFID die bonder has been qualified for qualified for major chip suppliers and meets the industry’s most rigorous temperature, humidity, and mechanical reliability requirements, said the company. Today it can place dies with dimensions as small as 200 microns, and this figure will improve over time. Upgrades over the course of the ADAT3 XF Tagliner’s lifetime will further optimise operation and boost performance, said the company.

Headquartered in Nijmegen, the Netherlands, ITEC is a back-end semiconductor equipment manufacturer specialising in high-volume production of semiconductors. ITEC provides the highest productivity assembly, test, inspection, and smart manufacturing platforms, targeting mass volume manufacturing from small signal to power MOS devices.

ITEC is rooted in semiconductor manufacturing, combining over 30 years of equipment and automation expertise as partner to Philips and Nexperia. In 2021, ITEC became a separate legal entity.

 

http://www.itecequipment.com

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