ICs & Semiconductors Archives - Page 50 of 227

Space computing reference design provides high speed data connectivity

Thu, Oct 05, 2023

Based on Microchip Technology’s radiation-tolerant GbE PHYs, the QLS1046-Space reference design has been developed by Teledyne e2v to provide high speed data connectivity in space applications.

The space computing reference design was presented at EDHPC 2023 (European Data Handling & Data Processing Conference, October 2-6, 2023 in Juan-Les-Pins, France) and enables high speed data routing in space applications.

It features Teledyne e2v’s radiation tolerant Qormino QLS1046-Space processing platform and data communication technology from Microchip. The radiation-tolerant design delivers robust, high performance processing, with enhanced sub-system connectivity capabilities. The QLS1046-Space has 30,000 DMIPS computing capability via the quad Arm Cortex-A72 cores and four to 8Gbyte of high speed DDR4 and multiple high speed interfaces. The architecture can process and route large incoming data rates from various sources, including telecommunication RF front ends, high resolution image sensors, radars, and other processing devices in the spacecraft.

The GbE interfaces ensure high-speed connectivity, supported by Microchip’s radiation tolerant Ethernet PHYs, claimed Teledyne e2v. The space computing reference design uses the VSC8541RT PHY to offer two RGMII links, and the VSC8574RT to offer two SGMII interfaces. The four Gigabit Ethernet connections could be ported up to seven Ethernet interfaces by exploiting all high speed interfaces available for high speed transfers between the QSL1046-Space and the other devices placed on different accompanying boards within the satellite or spacecraft. Target use cases include Earth observation, satcom applications, defence in space and space debris monitoring.

“In the vast majority of cases, modern space hardware will have a decentralised architecture. Normally communication between the constituent subsystems relies on 10 to100Mbit data transfer rates, explained Thomas Porches, application engineer at Teledyne e2v. “Greater levels of functional sophistication are now being incorporated for purposes like advanced telecommunication schemes, real time image processing, AI-driven analysis, and navigation.

“By working with Microchip, we’ve been able to significantly boost the interfacing capabilities for designs using the QLS1046-Space, leading to accelerated speeds plus extended propagation range. Consequently, they are completely aligned with what space customers are now demanding for edge computing applications.”

Staff from both Teledyne e2v and Microchip will present papers relating to their involvement in edge-located processing and inter-board communication for space deployments at the conference.

http://www.teledyne.com

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Cube architecture targets powerful edge AI devices, says Winbond

Mon, Oct 02, 2023

Affordable edge AI computing can be enabled in mainstream use cases with the CUBE customised ultra-bandwidth elements) architecture which has been introduced by Winbond Electronics. The architecture optimises memory technology for seamless performance running generative AI on hybrid edge/cloud applications.
CUBE enhances the performance of front-end 3D structures such as chip on wafer (CoW) and wafer on wafer (WoW), as well as back-end 2.5D/3D chip on Si-interposer on substrate and fan-out solutions, said Winbond. It is compatible with memory density from 256Mbit to 8Gbit with a single die, and it can also be 3D stacked to enhance bandwidth while reducing data transfer power consumption.

Winbond said CUBE is a major step forward, enabling seamless deployment across various platforms and interfaces. The technology is suited to advanced applications such as wearable and edge server devices, surveillance equipment, ADAS and co-robots, said the company.
The company believes that the integration of cloud AI and powerful edge AI will define the next phase of AI development. “With CUBE, we are unlocking new possibilities and paving the way for improved memory performance and cost optimisation on powerful edge AI devices,” added the company.
CUBE is power efficient, consuming less than 1pJ/bit, ensuring extended operation and optimised energy usage. It has bandwidth capabilities ranging from 32Gbytes per second to 256Gbytes per second per die for accelerated performance that exceeds industry standards.
Memory capacities range from 256Mbit to 8Gbit per die, based on the 20nm specification now and 16nm in 2025. This allows CUBE to fit into smaller form factors seamlessly. The introduction of through-silicon vias (TSVs) further enhances performance, improves signal and power integrity while reducing the I/O area through a smaller pad pitch, said Winbond. It also reduces heat dissipation, especially when using SoC on the top die and CUBE on the bottom die, advised the company.
It is also cost-effective, said Winbond, boosting the data rate up to 2Gbits per second with total 1K I/O. When paired with legacy foundry processes like 28nm/22nm SoC, CUBE unleashes high bandwidth capabilities, reaching 32 to 256Gbytes per second, equivalent to harnessing the power of 4-32pcs LP-DDR4x 4266Mbits per second x16 I/O bandwidth.
Stacking the SoC (top die without TSV) on top of the CUBE (bottom die with TSV) minimises the SoC die size, eliminating any TSV penalty area, said Winbond.
The company said CUBE can unleash the full potential of hybrid edge/cloud AI to elevate system capabilities, response time, and energy efficiency.
The company added that it is actively engaging with partner companies to establish the 3DCaaS platform, which will leverage CUBE’s capabilities.
Winbond Electronics supplies semiconductor memory products with capabilities of product design, R&D, manufacturing and sales services. The company’s product portfolio consists of specialty DRAM, mobile DRAM, code storage flash and TrustME secure flash for tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and has subsidiaries in the USA, Japan, Israel, China, Hong Kong and Germany and 12 inch fabs in Taichung and Kaohsiung in Taiwan.

https://www.winbond.com

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SoM and starter kit accelerate development for motor control and DSP applications

Thu, Sep 21, 2023

Additions to the Kria portfolio of adaptive system on module (SoM) and developer kits have been announced by AMD. The Kria K24 SoM and KD240 Drives starter kit are available to order now.

The Kria K24 SoM offers power-efficient compute in a small form factor and targets cost-sensitive industrial and commercial edge applications, explained the company. InFO (integrated fan-out) packaging results in the K24 being half the size of a credit card while using half the power of the larger, connector-compatible Kria K26 SoM.

It provides high determinism and low latency for powering electric drives and motor controllers used in compute-intensive DSP applications at the edge, such as electric motor systems, robotics for factory automation, power generation, public transportation such as elevators/lifts and trains, surgical robotics and medical equipment such as MRI beds, and also EV charging stations.

The KD240 Drives starter kit is a motor control-based development platform. Coupled with the 24 SoM, users can quickly develop motor control and DSP applications at a reduced time to market and without requiring FPGA programming expertise.

The K24 SoM features a custom-built Zynq UltraScale+ MPSoC device and the supporting KD240 starter kit is a sub-$400 FPGA-based motor control kit. Enabling developers to begin at a more evolved point in the design cycle, the KD240 provides easy access for entry-level developers compared to other processor-based control kits.

The K24 SOM is qualified for use in industrial environments with support for more design flows than any generation before it, said AMD. That includes familiar design tools like Matlab Simulink and languages like Python with its extensive ecosystem support for the PYNQ framework. Ubuntu and Docker are also supported. Software developers can also use the AMD Vitis motor control libraries while maintaining support for traditional development flows.

“The K24 SOM delivers high performance-per-watt in a small form factor and houses the core components of an embedded processing system on a single production-ready board for a fast time to market,” said Hanneke Krekels, corporate vice president, Core Vertical Markets, AMD.

It is estimated that around 70 per cent of the total global electrical use by the industrial sector is tied to electric motors and motor-driven systems. AMD said that even a one per cent improvement in the efficiency of a drive system can have a significant positive impact on operational expenses and the environment.

The KD240 is supported by an optional motor accessory pack (MACCP), with additional motor kits available in the future that can be purchased separately for an enhanced ramp-up experience for developers.

K24 SOMs are offered in both commercial and industrial versions and are built for 10-year industrial lifecycles. In addition to support for expanded temperature ranges, the industrial-grade SoM includes ECC-protected LPDDR4 memory for high-reliability systems.

The K24 commercial version is shipping today, and the industrial version is expected to ship in Q4.

https://www.amd.com

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Dual output Hall-effect sensors save space while detecting speed and direction

Thu, Sep 21, 2023

For high voltage, automotive and industrial applications, the AH39xxQ series of Hall-effect sensors provide speed and directional data, said Diodes.

The high-voltage, dual output, automotive-compliant sensors provide accurate speed and directional data or two independent outputs. They are designed for industrial and automotive applications such as detecting rotational and linear speed/direction and determining the angular position of a rotating shaft.

They operate over a wide supply voltage range of 2.7 to 27V to meet automotive battery requirements. They also have a 40V absolute maximum rating, enabling them to safely handle 40V load dumps.

There is also -18V of reverse voltage protection to guard against incorrect battery connections.

For added robustness, the ESD (electrostatic discharge) protection exceeds the automotive norms of 5kV human body model (HBM) and 2kV charge device model (CDM).

Three BOP/BRP (operating/release) options are offered, with typical values of 10/-10, 25/-25 and 75/-75 Gauss and the narrow operating window ensures accurate and reliable switching points, confirmed Diodes.

Dual-channel operation means these sensors can replace two latch switches, reducing both PCB space and overall component costs. Combining chopper-stabilised amplifiers with an advanced Hall plate design mitigates switch point drift, ensuring accurate measurements over a broad temperature range.

The self-diagnostic features make the AH39xxQ sensors suitable for ISO 26262-compliant systems. There is also a safe operating mode which is entered if an error, such as over-temperature or under-voltage lockout, is detected.

The AH39xxQ series Hall-effect sensors from Diodes are AEC-Q100 Grade 0 qualified, manufactured in IATF 16949 certified facilities, and support PPAP (production part approval process) documentation.

They are supplied in TSOT25 packages.

Diodes supplies semiconductor products to the world’s leading companies in the automotive, industrial, computing, consumer electronics, and communications markets. Its product portfolio consists of discrete, analogue and mixed-signal products and packaging technology.

The company has worldwide operations of 32 sites, including engineering, testing, manufacturing.

http://www.diodes.com

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Space computing reference design provides high speed data connectivity

Cube architecture targets powerful edge AI devices, says Winbond

SoM and starter kit accelerate development for motor control and DSP applications

Dual output Hall-effect sensors save space while detecting speed and direction

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