ICs & Semiconductors Archives - Page 49 of 231

Market leaders collaborate with Synopsys to realize gains of Generative AI

Wed, Nov 29, 2023

Synopsys aims to revolutionise the industry with generative AI capabilities, starting with Synopsys.ai Copilot, across the Synopsys.ai suite, building on its AI-driven optimisation and data analytics solutions.

Expansion of Synopsys.ai with generative AI capabilities will include collaborative, generative, and autonomous design to significantly boost productivity and accelerate innovation.

Synopsys have announced the expansion of its leading Synopsys.ai™ EDA suite, to bring the power of generative artificial intelligence (GenAI) across the full stack in order to dramatically improve engineering productivity for the semiconductor industry. This expands upon Synopsys’ recent announcement to deliver Synopsys.ai Copilot, the first in a series of GenAI capabilities for chip design.

The integration of GenAI across the Synopsys.ai suite will provide chip designers with collaborative capabilities that offer expert tool guidance; generative capabilities for RTL, verification, and other collateral creation; and autonomous capabilities for workflow creation from natural language. Synopsys is engaging early with leading chip makers including AMD, Intel, and Microsoft to leverage the value of GenAI across the Synopsys.ai full EDA stack, from design and verification to test and manufacturing.

“For 37 years, Synopsys has helped chipmakers solve their toughest design challenges and continues to be a catalyst for semiconductor progress,” said Shankar Krishnamoorthy, general manager, Synopsys EDA Group. “As the pioneer of AI-driven chip design, Synopsys is directly addressing engineering productivity during a period of talent shortages by expanding our leading Synopsys.ai suite to include generative AI capabilities across the full stack. This is an exciting time in the semiconductor industry and Synopsys continues to innovate relentlessly to enable the industry to meet stringent compute and performance-per-watt requirements of end markets.”

Synopsys is addressing the engineering productivity gap by delivering production-proven, AI-driven optimisation and data analytics capabilities across all stages of IC chip development. The Synopsys.ai EDA suite accelerates the chip design workflow by enabling companies to build more chips faster with a workforce that is not growing at the same pace as the industry demands.

https://www.synopsys.ai.

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Microchip unveils new standard of enhanced code security with the PIC18-Q24 family of MCUs

Tue, Nov 28, 2023

More and more everyday items are connected to the cloud—from cellphones and vehicles to smart thermostats and home appliances. With this rise in connectivity, the need for advanced security measures at the chip level, protecting both firmware and data, is critical. To defend against current and ever-expanding security threats, Microchip has launched the PIC18-Q24 family of MCUs.

To counter the threat of maliciously reprogramming a device in an embedded system, PIC18-Q24 MCUs introduce the programming and debugging interface disable (PDID) feature. When enabled, this enhanced code protection feature is designed to lock out access to the programming/debugging interface and block unauthorised attempts to read, modify or erase firmware.

“System security is only as strong as its weakest link. Any programmable component can be vulnerable, and it is essential to implement enhanced protection features to prevent potential hacks,” said Greg Robinson, corporate vice president of Microchip’s 8-bit MCU business unit. “The PIC18-Q24 family of MCUs from Microchip are designed with advanced security in the forefront, to help customers combat threats at the system’s foundation.”

Because many secure systems often connect and communicate with a wide variety of sensors, memory chips and processors, the PIC18-Q24 MCUs feature Multi-Voltage I/O (MVIO). This feature eliminates the need for external level shifters and allows the MCUs to interface with digital inputs or outputs at different operating voltages. In addition to reducing board complexity and Bill of Material (BOM) cost, MVIO makes PIC18-Q24 MCUs especially well-suited as system management processors, performing monitoring and telemetry for a larger processor. These seemingly routine tasks are typically most vulnerable to potential hackers as they try to gain access to embedded systems.

The PIC18-Q24 family is also enabled with the option to have an immutable bootloader for applications that want a secure way to upgrade firmware.

https://www.microchip.com

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Snapdragon 7-Series mobile platform provides performance and power efficiency with First-in-Tier features

Mon, Nov 27, 2023

Qualcomm Technologies have announced the Snapdragon® 7 Gen 3 Mobile Platform to amplify immersive experiences and bring premium performance to consumers’ everyday life. The upgraded platform delivers across-the-board advancements to ignite on-device AI, fan-favorite mobile gaming, a creativity-charged camera and powerful 5G connectivity. The new platform is fully equipped to enable exciting new use-cases including up to 2.63GHz peak CPU speeds, over 50% faster GPU performance, and 60% improved AI performance per watt while still delivering incredible power efficiency.

“Intelligently designed to balance performance and power efficiency, the Snapdragon 7 Gen 3 Mobile Platform delivers a selection of premium experiences that are brand new to the Snapdragon 7-series,” said Christopher Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. “By working closely with our OEM partners, we’re able to help make the next generation of in-demand features, such as enhanced AI and extraordinary camera capabilities, more widely accessible to consumers.”

Snapdragon 7 Gen 3 will first be adopted by key OEMs including HONOR and vivo with the first device expected to be announced this month. For more information about Snapdragon 7 Gen 3 visit website and specification sheet.

About Qualcomm
Qualcomm is enabling a world where everyone and everything can be intelligently connected. Our one technology roadmap allows us to efficiently scale the technologies that launched the mobile revolution – including advanced connectivity, high-performance, low-power compute, on-device intelligence and more – to the next generation of connected smart devices across industries. Innovations from Qualcomm and our family of Snapdragon platforms will help enable cloud-edge convergence, transform industries, accelerate the digital economy, and revolutionise how we experience the world, for the greater good.
Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business. Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patented technologies are licensed by Qualcomm Incorporated.

https://Qualcomm.com

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Alchip unveils “first automotive ASIC design platform” for a global industry

Fri, Nov 24, 2023

At the Design Solutions Forum 2023 in Kawasaki, Japan, Alchip Technologies rolled out what is claimed to be the semiconductor industry’s first automotive ASIC platform. It targets the specialised needs of the global automotive industry and streamlines the ASIC design needs of global automotive IC module and component manufacturers, as well as automotive companies, said Alchip.

The platform consists of six modules: Design for Autonomous Driving (AD)/ Advanced Driver Assistance System (ADAS), Design for Safety, Design for Test, Design for Reliability, Automotive Chip Sign-off, and Automotive Chip Manufacturing (MFG) Service.
Design for AD/ADAS integrates a CPU and neural processing unit (NPU) into the smallest possible die size, while meeting aggressive higher performance and lower power consumption required by automotive applications, said Alchip.

The Design for Safety module follows the ISO26262 pre-scribed flow that includes required isolated TMR / lock-step design methodology. This module also features an experienced safety manager and includes the mandated Development Interface Agreement (DIA) that defines the relationship between the manufacturer and the supplier throughout the entire automotive safety lifecycle and activities.

Design for Reliability includes enhanced electromigration (EM) as part of silicon lifecycle management. It also covers AEC-Q grade IP sourcing and implementation.

The Automotive Chip Manufacturing Service works with IATF16949 -approved manufacturing suppliers. Services include tri-temp testing by target AEC-Q grade, automotive wafer, automotive substrate, assembly and burn-in.

Design for Test capabilities support in system test (IST) and MBIST / LBIST design, critical and redundancy logic for yield harvest, automotive-level ATPG coverage, and physical-aware ATPG.

The final sign-off module covers an ageing library based on a customer mission profile, OD / UD / AVS / DVFS library support, and the final design for manufacturing sign-off.

The platform will “speed up the development and time-to-market of essential safety-critical ADAS applications, while significantly advancing the innovation with increasing complex autonomous driving implementation and features,” Alchip CEO, Johnny Shen.

Access to the new automotive platform is available now through Alchip offices in Taipei, Silicon Valley, Yokohama, Shanghai, Penang, and its affiliate office in Israel.

Alchip Technologies was founded in 2003 and is headquartered in Taipei, Taiwan. The company provides silicon and design and production services for system companies developing complex and high volume ASICs and SoCs. Alchip offers advanced 2.5D / 3DIC design, CoWoS / chiplet design and manufacturing management.

Customers include global leaders in AI, HPC/supercomputer, mobile phones, entertainment device, networking equipment and other electronic product categories.

http://www.alchip.com

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Market leaders collaborate with Synopsys to realize gains of Generative AI

Microchip unveils new standard of enhanced code security with the PIC18-Q24 family of MCUs

Snapdragon 7-Series mobile platform provides performance and power efficiency with First-in-Tier features

Alchip unveils “first automotive ASIC design platform” for a global industry

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