ICs & Semiconductors

ST has introduced the STSAFE-V100-Qi secure element to strengthen privacy and security when charging car occupants’ portable devices. ST also revealed its collaboration with indie Semiconductor to integrate the new secure element in indie’s Qi wireless in-car charging reference design.

ST’s new IC enables in-car charging to meet the latest Wireless Power Consortium (WPC) specifications, which call for protection by a secure element. It is also certified to the highest level of security applicable for Qi chargers, common criteria (CC) EAL4+, ensuring heightened cybersecurity protection.

ST’s secure element families are proven to protect the confidentiality, integrity, and authenticity of information and devices in security-conscious applications such as banking, ticketing, and identity protection, and in this Qi wireless-charging reference design, contribute to optimised charging and safety in an automotive application.

Customised for Qi charging at ST’s factory, the STSAFE-V100-Qi also supports secure boot, secure storage, and secure software update. This extra safeguarding strengthens protection against risks such as remote tampering, counterfeiting, and copying. Designed with secure software updates, the IC ensures a high level of security for the life of the vehicle.

“indie’s advanced Qi standards-based wireless charging silicon solutions enhance the overall in-cabin user experience, bringing convenient portable device charging to vehicles across all segment classes,” commented Fred Jarrar, Vice President and General Manager of indie Semiconductor’s Power and USB product lines. “ST’s secure element brings the highest level of cybersecurity protection to our reference design, enabling brand protection for our automotive customers and safety, security and reassurance for vehicle occupants.”

“By integrating our STSAFE-V100-Qi, the reference design meets the latest WPC specification and Common Criteria EAL4+ to assure protection of charging devices at up to 15W,” said Laurent Degauque, Marketing Director, Connected Security, STMicroelectronics. “As a result, indie’s customers benefit from a powerful combination of a high-quality charging system with the highest level of security.”

For more information, please go to https://www.st.com/en/secure-mcus/stsafe-v100-qi.html

The EZ-USB™ family of programmable USB peripheral controllers has continuously advanced features and performance, enabling developers to create USB devices that meet the highest performance requirements in AI, imaging, and emerging applications. Now, Infineon introduces the latest addition to the family: The EZ-USB FX10. The device offers fast connectivity with USB 10Gbps and LVDS interfaces, increasing the total bandwidth up to 3 times compared to its predecessor.

The EZ-USB FX10 is equipped with dual ARM® Cortex®-M4 and M0+ core CPUs, a 512 KB flash, a 128 KB SRAM, a 128 KB ROM, and seven serial communication blocks (SCBs). It also includes a cryptography accelerator and a high-bandwidth data subsystem. The high-bandwidth data subsystem enables direct memory access (DMA) data transfers between LVDS/LVCMOS and USB ports at speeds of up to 10 Gbps. Data transfer is supported by an additional 1 MB of SRAM for USB data buffering. The peripheral controller provides USB-C connector orientation detection and flip-mux functionality, eliminating the need for external logic. This comprehensive feature set makes the EZ-USB FX10 an ideal choice for developers looking for a powerful and adaptable USB controller.

The EZ-USB FX10 requires a smaller PCB footprint and thus helps to optimise the BOM. The 10 x 10 mm² BGA package makes it ideal for space-constrained applications. Additionally, it supports USB-C direct connection without a high-speed signal multiplexer, which simplifies the design process. The Quick Start Development Kit includes firmware and a configuration tool for easy integration. The EZ-USB FX10 DVK (development kit) also comes with a standard FPGA Mezzanine Card (FMC) connector for easy connection to field-programmable gate array (FPGA) boards and an all-in-one programming and debugging accessory board. The controller comes with a comprehensive set of application notes for hardware and software design, enabling developers to create high-performance devices for various applications.

The EZ-USB FX10 will be officially launched at the International Technical Exhibition on Image Technology and Equipment (ITE 2023) in Yokohama, Japan on 6 December.
Availability

The EZ-USB FX10 peripheral controller in a 10 x 10 mm² BGA package will be available in the fourth quarter of 2024. Engineering samples are available now.

http://www.infineon.com/ez-usb-fx10

The ever-increasing power demand in data centres and computing applications requires advancements in power efficiency and compact power supply design. Infineon responds to trends on the system level by introducing its new OptiMOS™ 7 family, industry’s first 15 V trench power MOSFET technology. The OptiMOS 7 15 V series primarily targets optimised DC-DC conversion for servers, computing, datacenter, and artificial intelligence applications.

The product portfolio includes the latest PQFN 3.3 x 3.3 mm² Source-Down, with bottom- and dual-side cooling variants in standard- and centre-gate footprints. The portfolio also includes a robust PQFN 2 x 2 mm² variant with a reinforced clip. The OptiMOS 7 15 V technology is specifically tailored for DC-DC conversions with low output voltages, particularly in server and computing environments. This advancement aligns with emerging shifts towards high ratio DC-DC conversion in data-center power distribution.

Compared to the established OptiMOS5 25 V, the new OptiMOS 7 15 V achieves a reduction of R DS(on) and FOMQ g by ~30 percent, and FOMQ OSS by ~50 percent by lowering the breakdown voltage. The PQFN 3.3 x 3.3 mm² Source-Down package variants provide a more versatile and effective PCB-design. Furthermore, the PQFN 2 x 2 mm² package provides a pulsed current capability higher than 500 A and a typical R thJC of 1.6 K/W. By minimising conduction and switching losses and incorporating advanced packaging technology, thermal management becomes easy and effective, setting new benchmarks both for power density and overall efficiency.

Availability
The OptiMOS 7 15 V product portfolio can be ordered now and is available in two package sizes: PQFN 3.3 x 3.3 mm² Source-Down variants and PQFN 2 x 2 mm². More information is available at http://www.infineon.com/optimos-7-15v.