ICs & Semiconductors

The EZ-USB™ family of programmable USB peripheral controllers has continuously advanced features and performance, enabling developers to create USB devices that meet the highest performance requirements in AI, imaging, and emerging applications. Now, Infineon introduces the latest addition to the family: The EZ-USB FX10. The device offers fast connectivity with USB 10Gbps and LVDS interfaces, increasing the total bandwidth up to 3 times compared to its predecessor.

The EZ-USB FX10 is equipped with dual ARM® Cortex®-M4 and M0+ core CPUs, a 512 KB flash, a 128 KB SRAM, a 128 KB ROM, and seven serial communication blocks (SCBs). It also includes a cryptography accelerator and a high-bandwidth data subsystem. The high-bandwidth data subsystem enables direct memory access (DMA) data transfers between LVDS/LVCMOS and USB ports at speeds of up to 10 Gbps. Data transfer is supported by an additional 1 MB of SRAM for USB data buffering. The peripheral controller provides USB-C connector orientation detection and flip-mux functionality, eliminating the need for external logic. This comprehensive feature set makes the EZ-USB FX10 an ideal choice for developers looking for a powerful and adaptable USB controller.

The EZ-USB FX10 requires a smaller PCB footprint and thus helps to optimise the BOM. The 10 x 10 mm² BGA package makes it ideal for space-constrained applications. Additionally, it supports USB-C direct connection without a high-speed signal multiplexer, which simplifies the design process. The Quick Start Development Kit includes firmware and a configuration tool for easy integration. The EZ-USB FX10 DVK (development kit) also comes with a standard FPGA Mezzanine Card (FMC) connector for easy connection to field-programmable gate array (FPGA) boards and an all-in-one programming and debugging accessory board. The controller comes with a comprehensive set of application notes for hardware and software design, enabling developers to create high-performance devices for various applications.

The EZ-USB FX10 will be officially launched at the International Technical Exhibition on Image Technology and Equipment (ITE 2023) in Yokohama, Japan on 6 December.
Availability

The EZ-USB FX10 peripheral controller in a 10 x 10 mm² BGA package will be available in the fourth quarter of 2024. Engineering samples are available now.

http://www.infineon.com/ez-usb-fx10

The ever-increasing power demand in data centres and computing applications requires advancements in power efficiency and compact power supply design. Infineon responds to trends on the system level by introducing its new OptiMOS™ 7 family, industry’s first 15 V trench power MOSFET technology. The OptiMOS 7 15 V series primarily targets optimised DC-DC conversion for servers, computing, datacenter, and artificial intelligence applications.

The product portfolio includes the latest PQFN 3.3 x 3.3 mm² Source-Down, with bottom- and dual-side cooling variants in standard- and centre-gate footprints. The portfolio also includes a robust PQFN 2 x 2 mm² variant with a reinforced clip. The OptiMOS 7 15 V technology is specifically tailored for DC-DC conversions with low output voltages, particularly in server and computing environments. This advancement aligns with emerging shifts towards high ratio DC-DC conversion in data-center power distribution.

Compared to the established OptiMOS5 25 V, the new OptiMOS 7 15 V achieves a reduction of R DS(on) and FOMQ g by ~30 percent, and FOMQ OSS by ~50 percent by lowering the breakdown voltage. The PQFN 3.3 x 3.3 mm² Source-Down package variants provide a more versatile and effective PCB-design. Furthermore, the PQFN 2 x 2 mm² package provides a pulsed current capability higher than 500 A and a typical R thJC of 1.6 K/W. By minimising conduction and switching losses and incorporating advanced packaging technology, thermal management becomes easy and effective, setting new benchmarks both for power density and overall efficiency.

Availability
The OptiMOS 7 15 V product portfolio can be ordered now and is available in two package sizes: PQFN 3.3 x 3.3 mm² Source-Down variants and PQFN 2 x 2 mm². More information is available at http://www.infineon.com/optimos-7-15v.

Synopsys aims to revolutionise the industry with generative AI capabilities, starting with Synopsys.ai Copilot, across the Synopsys.ai suite, building on its AI-driven optimisation and data analytics solutions.

Expansion of Synopsys.ai with generative AI capabilities will include collaborative, generative, and autonomous design to significantly boost productivity and accelerate innovation.

Synopsys have announced the expansion of its leading Synopsys.ai™ EDA suite, to bring the power of generative artificial intelligence (GenAI) across the full stack in order to dramatically improve engineering productivity for the semiconductor industry. This expands upon Synopsys’ recent announcement to deliver Synopsys.ai Copilot, the first in a series of GenAI capabilities for chip design.

The integration of GenAI across the Synopsys.ai suite will provide chip designers with collaborative capabilities that offer expert tool guidance; generative capabilities for RTL, verification, and other collateral creation; and autonomous capabilities for workflow creation from natural language. Synopsys is engaging early with leading chip makers including AMD, Intel, and Microsoft to leverage the value of GenAI across the Synopsys.ai full EDA stack, from design and verification to test and manufacturing.

“For 37 years, Synopsys has helped chipmakers solve their toughest design challenges and continues to be a catalyst for semiconductor progress,” said Shankar Krishnamoorthy, general manager, Synopsys EDA Group. “As the pioneer of AI-driven chip design, Synopsys is directly addressing engineering productivity during a period of talent shortages by expanding our leading Synopsys.ai suite to include generative AI capabilities across the full stack. This is an exciting time in the semiconductor industry and Synopsys continues to innovate relentlessly to enable the industry to meet stringent compute and performance-per-watt requirements of end markets.”

Synopsys is addressing the engineering productivity gap by delivering production-proven, AI-driven optimisation and data analytics capabilities across all stages of IC chip development. The Synopsys.ai EDA suite accelerates the chip design workflow by enabling companies to build more chips faster with a workforce that is not growing at the same pace as the industry demands.

https://www.synopsys.ai.