Renesas delivers new RA8 MCU group targeting graphic display solutions and voice/vision multi-modal AI applications

Renesas has introduced the RA8D1 microcontroller (MCU) group. The RA8D1 group is the second in Renesas’ RA8 Series, the first MCUs based on the Arm Cortex-M85 processor. RA8D1 MCUs deliver breakthrough performance of over 6.39 CoreMark/MHz EEMBC’s CoreMark benchmark measures performance of MCUs and CPUs used in embedded systems. combined with ample memory, graphics and peripheral functions optimised to address diverse graphics display solutions, and Voice/Vision Multimodal AI requirements for a range of applications in building automation, home appliances, smart home, consumer, and medical market segments.

All RA8 Series MCUs take advantage of the high performance of the Arm Cortex-M85 processor and Arm’s Helium technology with a vector/SIMD instruction set extension that provides up to a 4X performance boost for digital signal processor (DSP) and machine learning (ML) implementations over the Cortex-M7 core. This added performance is ideal for graphics and neural network processing and can eliminate the need for a separate hardware accelerator in some applications. They also offer advanced security including Arm TrustZone technology, Renesas Security IP (RSIP-E51A), Secure Boot with first stage bootloader in immutable storage, Octal SPI interface with Decryption-on-the-fly (DOTF), and Pointer Authentication and Branch Target Identification (PACBTI) security extension.

The new RA8D1 devices include a high-resolution graphics LCD controller with parallel RGB and MIPI-DSI interfaces to LCD display panels, a 2D graphics drawing engine, a 16-bit camera interface (CEU), multiple external memory interfaces for storage of frame buffer and graphics assets, and 176 and 224 pin packages. This feature set is combined with professional quality graphics user interface software solutions from SEGGER emWin and Microsoft GUIX fully integrated into the Renesas Flexible Software Package (FSP). Renesas also provides support for open-source Light and Versatile Graphics Library (LVGL) and a robust network of graphics and AI ecosystem partners. A full-featured graphics evaluation kit with LCD panel and camera module rounds out the solution and provides a robust development platform for graphics applications including. industrial HMI, video doorbells, patient monitors, graphics calculators, security panels, printer display panels, and appliance displays.

“There is growing demand for high-quality displays to improve user experiences. The introduction of the RA8D1 MCUs showcases the design capabilities and market knowledge that have made Renesas the world leader in MCUs,” said Daryl Khoo, Vice President of the IoT Platform Division at Renesas. “These new devices take advantage of the unprecedented performance of the Cortex-M85 core and Helium technology to meet our customers increasing requirements for better display solutions and fast-growing vision AI implementations such as people and object detection, face recognition, image classification, and pose estimation.”

“Plumerai licenses highly accurate AI solutions to customers developing smart home cameras and IoT devices,” said Roeland Nusselder, CEO of Plumerai. “We have ported our Plumerai People Detection AI software to the new RA8D1 MCU that includes the powerful Arm Cortex-M85 CPU with Helium vector extensions. The RA8D1 speeds up our software by 6.5x compared to an Arm Cortex-M7 using Arm’s CMSIS-NN kernels. There’s a big demand for our AI solutions in home security, smart buildings, home appliances and retail. Using the RA8 MCUs from Renesas, we can now fulfil this demand.”

The new RA8D1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of existing designs to the new RA8 Series devices.

The RA8D1 Group MCUs are available now, along with the FSP software. Renesas is also shipping the RA8D1 Evaluation Kit that includes example projects targeted at graphics applications. Various Renesas Ready ecosystem partners also provide production-ready solutions for the RA8D1 MCUs. Renesas welcomes other partners who would like to port their software solutions to take advantage of the Cortex-M85 core and Helium. Information on all these offerings is available at renesas.com/RA8D1. Samples and kits can be ordered either on the Renesas website or through distributors.

https://renesas.com/MCUs.

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ST eases bare-metal development on single-core MPUs with extensions to familiar STM32Cube environment

STMicroelectronics is helping engineers raise the performance of embedded-system designs to the next level with new software for migrating STM32 microcontroller code to more powerful STM32MP1 microprocessors.

As end-users constantly demand more features and faster response from the technology that powers their daily lives and work, brands need effective solutions to boost product performance. Industrial real-time applications are typical. Increasingly, the latest process equipment, factory-automation systems, logistics and retail technology, IoT devices, and digital signage demand greater host-system performance than microcontrollers (MCUs) typically provide.

ST’s STM32MP1 microprocessors (MPUs) address these trends, bringing a powerful Arm Cortex-A7 application-class architecture with more processing power and memory. Users can now take advantage of the new software pack, STM32CubeMP13, to migrate code originally designed for smaller, simpler MCUs and unleash the higher-performance MPU’s extra capabilities in their next-generation products.

STM32CubeMP13 enables an embedded bare-metal application or RTOS on STM32MP13 SoCs, giving an alternative to OpenSTLinux that ensures faster execution times compared to typical microcontrollers. Users can also ensure ported code continues to meet the original implementation’s hard real-time specifications, such as interrupt times and latency. Moreover, an RTOS can leverage the MPU’s larger memory while preserving low power consumption.

Fully integrated in the STM32Cube ecosystem, STM32CubeMP13 lets designers already using ST’s STM32 embedded microcontrollers move up to higher-performance MPU-based projects within the same, familiar development environment. This includes the STM32CubeMX device configurator, STM32CubeIDE development tools, and STM32CubeProgrammer.

STM32CubeMP13 comes with all necessary components needed to run embedded code on STM32MP13 Arm Cortex-A7 MPUs, including the board support package (BSP) and hardware abstraction layer (HAL). Azure RTOS (moving to Eclipse ThreadX) comes pre-integrated as an example real-time operating system. Also, code samples are provided that help embedded developers handle the extra complexity of MPU-based systems, including booting from external memory and power management including DDR-RAM self-refresh control.

Entry-level applications leveraging STM32MP13, targeted at industrial, smart city, smart home, retail, medical, health, and wellness markets, can still be developed using the established ecosystem and OpenSTLinux distribution.

The software is available free of charge and ready to download now from https://www.st.com/en/embedded-software/stm32cubemp13.html

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ST reveals a new global-shutter image sensor that offers high resolution and low power consumption

ST is enhancing smart computer vision with its latest global-shutter image sensor. The global-shutter sensor technology is particularly useful for capturing distortion-free images when the scene is moving or when near-infrared illumination is used.

“Our new global-shutter image sensor provides superb resolution in an extremely small die suitable for use in equipment like smart glasses and AR/VR headsets. It’s also well suited to personal and industrial robotics and smart-home devices. All these applications benefit from the sensor’s high performance, small size, ultra-low power consumption, and optimised cost,” said Alexandre Balmefrezol, Executive Vice President, Imaging Sub-Group General Manager, STMicroelectronics.

The sensor is small, measuring just 2.7mm x 2.2mm, and has a native resolution of 800 x 700 pixels. Its low power consumption means it can be used with smaller batteries, and its imaging performance is exceptional, with high contrast and superior image clarity.

The sensor also offers event-like image streaming, making it ideal for eye-tracking and other motion-estimation use cases.

This new global-shutter image sensor also comes with innovative embedded features. These features include native background removal, which reduces the post-processing workload for the host. The sensor also has an ‘always-on’ 1mW autonomous mode that allows continuous awareness even when the host is turned off, saving power. The system wakes up when a movement or scene change is detected.

ST’s new VD55G1 is sampling now, with volume production slated for March 2024.

For more information, please go to https://www.st.com/en/imaging-and-photonics-solutions/vd55g1.html

 

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Press-fit terminal power modules for a solder-free solution in high-volume manufacturing

The E-Mobility, sustainability and data centre markets require products that are conducive to high-volume manufacturing. To better automate the installation process, Press-Fit terminals are often used because they offer a solder-free solution to mount power modules to the PCB. Microchip Technology has announced its expansive portfolio of SP1F and SP3F power modules are now available with Press-Fit terminals for high-volume applications.

Solder-free Press-Fit power module terminals allow for automated or robotic installation, which simplifies and speeds up the assembly process to reduce manufacturing costs. The high accuracy of the terminal locations and the novel Press-Fit pin design in the SP1F and SP3F power modules enables high-reliability contact with the printed circuit card. Overall, a Press-Fit power module solution can save valuable time and production costs.

There are over 200 variants available in Microchip’s SP1F and SP3F power modules portfolio, with options to use mSiC technology or Si semiconductors and an array of topologies and ratings. The SP1F and SP3F are offered in voltage range of 600V-1700V and up to 280A.

With Press-Fit technology, the power module pins are not soldered to the PCB. Instead, the electrical connection is made by pressing the pins into properly sized PCB holes. A key advantage of a Press-Fit power module solution is it eliminates the need for wave soldering. This is especially important when the PCB is made to also include Surface-Mount Technology (SMT) components.

“Our power modules with Press-Fit terminals offer customers the flexibility to fully customise their design and are cost-effective power solutions for high-volume production,” said Leon Gross, vice president of Microchip’s discrete products group. “This type of plug-and-play power solution also provides a highly reliable mounting solution for automated or robotic assembly.”

The highly configurable SP1F and SP3F power modules are fully compliant with the Restriction of Hazardous Substances Directive (RoHS).

https://www.microchip.com

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