ICs & Semiconductors Archives - Page 45 of 230

ST eases bare-metal development on single-core MPUs with extensions to familiar STM32Cube environment

Tue, Dec 12, 2023

STMicroelectronics is helping engineers raise the performance of embedded-system designs to the next level with new software for migrating STM32 microcontroller code to more powerful STM32MP1 microprocessors.

As end-users constantly demand more features and faster response from the technology that powers their daily lives and work, brands need effective solutions to boost product performance. Industrial real-time applications are typical. Increasingly, the latest process equipment, factory-automation systems, logistics and retail technology, IoT devices, and digital signage demand greater host-system performance than microcontrollers (MCUs) typically provide.

ST’s STM32MP1 microprocessors (MPUs) address these trends, bringing a powerful Arm Cortex-A7 application-class architecture with more processing power and memory. Users can now take advantage of the new software pack, STM32CubeMP13, to migrate code originally designed for smaller, simpler MCUs and unleash the higher-performance MPU’s extra capabilities in their next-generation products.

STM32CubeMP13 enables an embedded bare-metal application or RTOS on STM32MP13 SoCs, giving an alternative to OpenSTLinux that ensures faster execution times compared to typical microcontrollers. Users can also ensure ported code continues to meet the original implementation’s hard real-time specifications, such as interrupt times and latency. Moreover, an RTOS can leverage the MPU’s larger memory while preserving low power consumption.

Fully integrated in the STM32Cube ecosystem, STM32CubeMP13 lets designers already using ST’s STM32 embedded microcontrollers move up to higher-performance MPU-based projects within the same, familiar development environment. This includes the STM32CubeMX device configurator, STM32CubeIDE development tools, and STM32CubeProgrammer.

STM32CubeMP13 comes with all necessary components needed to run embedded code on STM32MP13 Arm Cortex-A7 MPUs, including the board support package (BSP) and hardware abstraction layer (HAL). Azure RTOS (moving to Eclipse ThreadX) comes pre-integrated as an example real-time operating system. Also, code samples are provided that help embedded developers handle the extra complexity of MPU-based systems, including booting from external memory and power management including DDR-RAM self-refresh control.

Entry-level applications leveraging STM32MP13, targeted at industrial, smart city, smart home, retail, medical, health, and wellness markets, can still be developed using the established ecosystem and OpenSTLinux distribution.

The software is available free of charge and ready to download now from https://www.st.com/en/embedded-software/stm32cubemp13.html

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ST reveals a new global-shutter image sensor that offers high resolution and low power consumption

Fri, Dec 08, 2023

ST is enhancing smart computer vision with its latest global-shutter image sensor. The global-shutter sensor technology is particularly useful for capturing distortion-free images when the scene is moving or when near-infrared illumination is used.

“Our new global-shutter image sensor provides superb resolution in an extremely small die suitable for use in equipment like smart glasses and AR/VR headsets. It’s also well suited to personal and industrial robotics and smart-home devices. All these applications benefit from the sensor’s high performance, small size, ultra-low power consumption, and optimised cost,” said Alexandre Balmefrezol, Executive Vice President, Imaging Sub-Group General Manager, STMicroelectronics.

The sensor is small, measuring just 2.7mm x 2.2mm, and has a native resolution of 800 x 700 pixels. Its low power consumption means it can be used with smaller batteries, and its imaging performance is exceptional, with high contrast and superior image clarity.

The sensor also offers event-like image streaming, making it ideal for eye-tracking and other motion-estimation use cases.

This new global-shutter image sensor also comes with innovative embedded features. These features include native background removal, which reduces the post-processing workload for the host. The sensor also has an ‘always-on’ 1mW autonomous mode that allows continuous awareness even when the host is turned off, saving power. The system wakes up when a movement or scene change is detected.

ST’s new VD55G1 is sampling now, with volume production slated for March 2024.

For more information, please go to https://www.st.com/en/imaging-and-photonics-solutions/vd55g1.html

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Press-fit terminal power modules for a solder-free solution in high-volume manufacturing

Thu, Dec 07, 2023

The E-Mobility, sustainability and data centre markets require products that are conducive to high-volume manufacturing. To better automate the installation process, Press-Fit terminals are often used because they offer a solder-free solution to mount power modules to the PCB. Microchip Technology has announced its expansive portfolio of SP1F and SP3F power modules are now available with Press-Fit terminals for high-volume applications.

Solder-free Press-Fit power module terminals allow for automated or robotic installation, which simplifies and speeds up the assembly process to reduce manufacturing costs. The high accuracy of the terminal locations and the novel Press-Fit pin design in the SP1F and SP3F power modules enables high-reliability contact with the printed circuit card. Overall, a Press-Fit power module solution can save valuable time and production costs.

There are over 200 variants available in Microchip’s SP1F and SP3F power modules portfolio, with options to use mSiC technology or Si semiconductors and an array of topologies and ratings. The SP1F and SP3F are offered in voltage range of 600V-1700V and up to 280A.

With Press-Fit technology, the power module pins are not soldered to the PCB. Instead, the electrical connection is made by pressing the pins into properly sized PCB holes. A key advantage of a Press-Fit power module solution is it eliminates the need for wave soldering. This is especially important when the PCB is made to also include Surface-Mount Technology (SMT) components.

“Our power modules with Press-Fit terminals offer customers the flexibility to fully customise their design and are cost-effective power solutions for high-volume production,” said Leon Gross, vice president of Microchip’s discrete products group. “This type of plug-and-play power solution also provides a highly reliable mounting solution for automated or robotic assembly.”

The highly configurable SP1F and SP3F power modules are fully compliant with the Restriction of Hazardous Substances Directive (RoHS).

https://www.microchip.com

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ST introduces AI-enabled automotive inertial measurement unit for always-aware applications up to 125°C

Tue, Dec 05, 2023

ST’s ASM330LHHXG1 inertial measurement unit (IMU) for automotive applications combines in-sensor AI with enhanced low-power operation and 125°C operating temperature range for reliability in harsh environments.

ST’s new automotive IMU contains a 3-axis accelerometer and 3-axis gyroscope and draws less than 800µA with both sensors running, cutting the system power budget and encouraging use in always-aware applications. In-sensor AI leverages the built-in machine-learning core (MLC) and finite state machine (FSM), offloading the host processor and enabling low-latency, energy-efficient event detection and classification. The extended temperature range gives flexibility to deploy smart sensors containing the ASM330LHHXG1 in harsh locations including near engine components, in direct sunlight, or whenever on-board power dissipation might increase the temperature above standard operating levels.

With the integrated MLC and FSM, the ASM330LHHXG1 handles applications that need fast and deterministic response with minimal power demand. These include navigation assistance and telematics, theft prevention, impact detection, and motion-activated functions.

ST’s MEMS ecosystem helps accelerate evaluation, prototyping and development with the ASM330LHHXG1, leveraging Unico-GUI and AlgoBuilder tools and MEMS-sensor adapter boards (STEVAL-MKI243A). Also, engineers can find ready-to-use application examples at ST’s GitHub repository area. The MLC repository contains use cases such as tilt, towing, and vehicle-status detection. The FSM repository has further inspiration including motion/stationary detection and shake detection.

While the IMU has dual operating modes that let designers optimise the data-update rate and power consumption, the accelerometer and gyroscope maintain high stability over time and temperature. The accelerometer has a selectable full-scale range of ±2/±4/±8/±16g, while the gyroscope’s angular rate can be set to ±125, ±250, ±500, ±1000, ±2000, or ±4000 degrees per second.

The ASM330LHHXG1 is AEC-Q100 qualified and in production now. It is available in an over-molded 14-lead plastic land grid array (LGA) package.

For more information, please visit http://www.st.com/automotive-experience

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ST eases bare-metal development on single-core MPUs with extensions to familiar STM32Cube environment

ST reveals a new global-shutter image sensor that offers high resolution and low power consumption

Press-fit terminal power modules for a solder-free solution in high-volume manufacturing

ST introduces AI-enabled automotive inertial measurement unit for always-aware applications up to 125°C

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