TI debuts new automotive chips at CES, enabling automakers to create smarter, safer vehicles

Texas Instruments has introduced new semiconductors designed to improve automotive safety and intelligence. The AWR2544 77GHz millimeter-wave radar sensor chip is the industry’s first for satellite radar architectures, enabling higher levels of autonomy by improving sensor fusion and decision-making in ADAS. TI’s new software-programmable driver chips, the DRV3946-Q1 integrated contactor driver and DRV3901-Q1 integrated squib driver for pyro fuses, offer built-in diagnostics and support functional safety for battery management and powertrain systems. TI is demonstrating these new products at the 2024 Consumer Electronics Show (CES).

Many automakers are adding more sensors around the car to improve vehicle safety and autonomy. TI’s AWR2544 single-chip radar sensor is the industry’s first designed for satellite architectures. In satellite architectures, radar sensors output semi-processed data to a central processor for ADAS decision-making using sensor fusion algorithms, taking advantage of the 360-degree sensor coverage to achieve higher levels of vehicle safety.

The AWR2544 single-chip radar sensor is also the industry’s first with launch-on-package (LOP) technology. LOP technology helps reduce the size of the sensor by as much as 30% by mounting a 3D waveguide antenna on the opposite side of the printed circuit board. LOP technology also enables sensor ranges to extend beyond 200m with a single chip. In satellite architectures, these features enable automakers to increase ADAS intelligence for higher vehicle autonomy levels to make smarter decisions from farther away. The AWR2544 is the latest in TI’s radar sensor portfolio, which supports a wide range of ADAS applications and architectures with sensors developed for corner, front, imaging, side and rear radar systems.

Supporting the trend toward software-defined vehicles is challenging designers to develop smarter, more advanced battery management systems (BMS). Two new highly integrated, software-programmable driver chips from TI address requirements for safer and more efficient control of high-voltage disconnect circuits in a BMS or other powertrain system. Both drivers are International Organization for Standardization (ISO) 26262 functional safety-compliant and offer built-in diagnostics and protection to reduce automotive engineers’ development time.

For BMS and other powertrain systems, the DRV3946-Q1 is the industry’s first fully integrated contactor driver. It includes a peak-and-hold current controller that helps automakers increase system power efficiency. The device also implements safety diagnostics to monitor the condition of the contactor.

TI’s DRV3901-Q1 fully integrated squib driver enables an intelligent pyro fuse disconnect system by using built-in circuitry to monitor the pyro fuse and provide diagnostic information to the system microcontroller. This gives hybrid electric vehicle (HEV) and EV BMS designers flexibility to use a pyro fuse instead of traditional melting fuse systems while minimizing design complexity.

https://www.ti.com/

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u-blox module unlocks new automotive use cases

u-blox has announced JODY-W6, a concurrent dual-band Wi-Fi 6E module with Bluetooth 5.3, including LE Audio, in a compact size (13.8 x 19.8 x 2.5 mm). The new module targets automotive use cases in infotainment and navigation, advanced telematics, as well as OEM telematics.

According to the TSR (Techno Systems Research CO. LTD.) Wireless Connectivity Market Report, Wi-Fi 6 and 6E technologies are experiencing significant and promising growth in the automotive industry. Wi-Fi 6 focuses on efficiency, with reduced data congestion, improved network capacity, and lower overall power consumption. Instead, Wi-Fi 6E focuses on spectrum, enabling more concurrent users, reduced congestion, and enhanced security.

Not only does the u-blox JODY-W6 deliver the benefits of Wi-Fi 6E, but it also features dual-mode Bluetooth with LE Audio. JODY-W6 is globally certified and can withstand operating temperatures from -40 °C up to 105 °C.

The module is available with either two or three antennas. Upon request, it can also integrate an LTE filter. An EVK and an M.2 card will be available for the JODY-W6 series. Furthermore, its compatibility with previous JODY modules to ensure seamless scalability.

“JODY-W6 is a smart and reliable solution that helps overcome congestion and fulfils scalability requirements through its highly adaptable compact size. Specific use cases include support for AppleCarPlay and AndroidAuto, personalised entertainment, data off-loading, and smart/roof-integrated antennas.

The u-blox JODY-W6 comes equipped with an embedded NXP Semiconductors AW693 chipset.

“The AW693 SoC (System-on-Chip) embedded in the automotive JODY-W6 SoM (System-on-Module) leverages the latest concurrent dual-band Wi-Fi 6E and Bluetooth LE audio technologies to unlock new opportunities for a wide variety of use cases and businesses in the automotive domain. The AW693 chipset is packed with advanced features, including MU-MIMO, OFDMA, and target wake time (TWT), allowing the u-blox JODY-W6 compact module to benefit from the synergy of our gold partnership,” says Larry Olivas, Vice President and General Manager of Wireless Connectivity Solutions, NXP Semiconductors.

https://www.u-blox.com

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Ceva extends its Connect IP Portfolio with Wi-Fi 7 platform for high-end consumer and industrial IoT

Ceva has announced the general release of its next generation RivieraWaves Wi-Fi 7 IP platform, further expanding its widely-licensed portfolio of connectivity IP, targeting high-end consumer and industrial applications including gateways, TVs, set-top-boxes, streaming media devices, AR/VR headsets, personal computing and smartphones. The RivieraWaves Wi-Fi 7 IP leverages all the latest advanced features of the IEEE 802.11be standard to deliver a premium high performance, cost- and power-optimised Wi-Fi solution for integration into the next wave of Wi-Fi Access Point (AP) and Station (STA) products.

According to global technology intelligence firm ABI Research, annual Wi-Fi enabled chipset shipments will exceed 5.1 billion by 2028, with more than 1.7 billion of these chipsets supporting the Wi-Fi 7 standard. As Wi-Fi enabled device shipments continue to grow, increasing numbers of semiconductor companies and OEMs are choosing to integrate Wi-Fi connectivity into their chip designs, and need access to high quality Wi-Fi IP to reduce the development costs and risks. Spanning Wi-Fi 4/5/6 over the past decade, Ceva has already established a considerable leadership position in Wi-Fi IP licensing, with more than 40 licensees for its RivieraWaves Wi-Fi 6 IP family, serving a wide range of end markets and applications, from end points to access points, across the IoT sphere. Expanding on this leadership position, Ceva’s RivieraWaves Wi-Fi 7 IP provides a unique, comprehensive 802.11be MAC and PHY solution for integration into the next generation of Wi-Fi SoC products.

Andrew Zignani, Senior Research Director, ABI Research, commented: “Ceva’s wireless connectivity IPs play an integral role in the proliferation of connectivity standards in the broad IoT markets, as is evident from their customer’s success in shipping more than 1 billion connectivity chips annually. With the introduction of their RivieraWaves Wi-Fi 7 IP platforms, semiconductor companies and OEMs have a trusted partner to develop differentiated, high-performance Wi-Fi 7 chipsets for their connectivity roadmaps, with lower risk and a lower cost of ownership.”

Tal Shalev, Vice President and General Manager of the Wireless IoT BU at Ceva, stated: “The relentless expansion of Wi-Fi usage has pushed the Wi-Fi 7 standard to offer enhanced data throughput, improved latency and support more spectrum in the face of mounting network congestion. Achieving this requires highly complex, cutting-edge functionalities like 4K QAM modulation, Multi Link Operation and Multi Resource Unit to optimize link efficiency across the available bands. Our RivieraWaves Wi-Fi 7 IP platform incorporates all the features of this latest-generation, wireless standard, dramatically simplifying development and time-to-market for companies looking to add Wi-Fi 7 connectivity to their products.”

Wi-Fi 7’s 4K QAM modulation scheme is a substantial increase on the previous 1K QAM of Wi-Fi 6, while Multi Link Operation (MLO) introduces dynamic channel aggregation, seamlessly combining heterogenous channels from the same or different bands to navigate interference and boost throughput. Similarly, Multi Resource Units (MRU) enables the creation of larger channel bandwidths by intelligently stitching together punctured or disjointed Resource Units within the same band. The outcome is not only a remarkable up to 5 times increase in raw speeds but also significantly reduced latency, thanks to diminished contentions and retries.

visit https://www.ceva-ip.com/product/rivierawaves-wi-fi-platforms/.

 

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Mouser signs global distribution agreement with Ambiq to deliver ultra-low power AI microcontrollers

Mouser has announced a new global distribution agreement with Ambiq, a leading supplier of low-powered, AI-enabled microcontrollers for wearables, hearables, IoT, edge devices and mobile edge computing applications.

“We are pleased to announce our partnership with Ambiq, which furthers our commitment to providing the latest products and technologies to our customers worldwide,” said Kristin Schuetter, Vice President of Supplier Management at Mouser Electronics. “We look forward to providing engineers and buyers worldwide with their innovative embedded solutions, backed by Mouser’s best-in-class logistics and unsurpassed customer service.”

“Mouser is well-known for its worldwide distribution and support system,” said Mike Kenyon, Vice President of Sales and Business Development at Ambiq. “We are excited to enter into this relationship. With distribution through Mouser, we can draw on their expertise in delivering leading-edge technologies and expand our global customer base.”

Among the Ambiq products now available from Mouser are the Ambiq Apollo4 Blue Lite system-on-chip (SoC) and the Ambiq Apollo4 Blue Lite evaluation board. The Apollo4 Blue Lite SoC features a 32-bit Arm® Cortex®-M4 core with a Floating-Point Unit, along with a Bluetooth® Low Energy 5.1 radio with robust RF connectivity. This SoC is ideal for use in battery-powered endpoint devices, including smartwatches, fitness bands, animal trackers, voice-activated remotes and digital health products. The Ambiq Apollo4 Blue Lite evaluation board offers a complete demonstration and development platform for the Apollo4 Blue Lite device.

Mouser also offers the Apollo3 Blue Plus evaluation board and the Apollo3 Blue Plus SoC. The Apollo3 Blue Plus device is based on Ambiq’s Voice-on-SPOT (VoS) platform, making it the perfect microprocessor for enabling always-on voice assistant integration and command. The Apollo3 Blue Plus evaluation board enables quick and easy prototyping of the SoC. The Apollo3 Blue Plus Voice-on-SPOT kit, also available from Mouser, facilitates demos, evaluation, and the development of ultra-low power audio and voice capabilities on the Apollo3 Blue Plus SoC. The kit provides always-on voice capability with options for one or two microphones, signal processing, wake word/command detection, codec, and Bluetooth Low Energy communication.

The Artasie AM1805 evaluation board offers an easy method to measure and evaluate Ambiq’s AM18x5 real-time clocks. The evaluation board includes on-chip oscillators to provide minimum power consumption, full RTC functions including battery backup and programmable counters and alarms for timer and watchdog functions, and a PC serial interface for communication with a host controller.

To learn more about Ambiq products available from Mouser, visit https://www.mouser.com/manufacturer/ambiq/.

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