ST reveals high-performance wireless microcontrollers

ST has revealed the next generation of its short-range wireless microcontrollers. These all-in-one components enable wearables and smart objects including smart home devices, health monitors, and smart appliances to become ever more miniaturised, easy to use, secure and affordable.

Short-range wireless technologies like Bluetooth LE, Zigbee and Thread (popular in smart meters and smart buildings) are the fabric connecting smart devices to home bridges, gateways, and controllers including smartphones. As we all seek solutions for making life more economical, sustainable, and comfortable, vendors are looking to bring creative and high-performing new solutions to market more quickly, within tight cost constraints. They need to be stylish, too: tiny, low-profile, or even embedded out of sight in other equipment, such as in smart bulbs. Going wireless is a part of this trend, for freedom, flexibility, and fashion.

Wireless microcontrollers like ST’s new STM32WBA5 product line allow a one-chip solution that’s extremely compact, reduces the bill of materials, and shortens the time to market by relieving wireless design challenges. Also, being compatible with the development tools and software packs of the STM32 microcontroller development ecosystem, the new line simplifies migrating existing products designed for wired connections.

The new series’ flagship STM32WBA55 microcontroller can communicate using multiple wireless standards concurrently, including low-energy Bluetooth LE 5.4, Zigbee, Thread, and Matter (Thread RCP). Matter border router is a perfect match with the STM32WBA5 for this new open-source connectivity standard for smart-home and IoT (Internet of Things) devices. In this way, the STM32WBA55 supports a great user experience while simplifying hardware and software engineers’ development journey, aiding affordability and time to market for the new product.

With this new generation, ST has also introduced support for the recently completed Bluetooth LE Audio specifications that enable exciting and innovative new products for richer listening and hearing experiences. These include the new Bluetooth Auracast feature, which opens the door to a new world of audio broadcasting applications.

The STM32WBA series is the first wireless MCU in the market to achieve the important SESIP (Security Evaluation Standard for IoT Platforms) Level 3 security certification. With this, smart devices containing STM32WBA microcontrollers are ready to satisfy the US Cyber Trust Mark and EU Radio Equipment Directive (RED) regulations due to become mandatory in 2025.

The new STM32WBA5 product line will be available on st.com on March 12. Sample requests and pricing information are available from local ST sales offices. ST will introduce a ready-to-use module containing the STM32WBA, integrated with necessary external components including power-supply and antenna-balancing circuitry, in June 2024.

https://www.st.com/stm32wba

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Nexperia unveils next gen low-voltage analog switches

Nexperia, has introduced a new series of 4- and 8-channel analog switches designed to monitor and protect 1.8 V electronic systems. This series of multiplexers includes AEC-Q100 qualified variants intended for use in automotive applications as well as standard versions suitable for a broader range of consumer and industrial applications including sensor monitoring and diagnostics, enterprise computing and domestic appliances.

When using analogue switches, designers commonly require additional voltage translators because the control circuitry cannot operate from the voltage level used to supply power to the switch. By contrast, the control pins in the NMUX1308 and NMUX1309 switches operate independently of their power supply voltage range, negating the need to use additional components to perform level-shifting and thus saving board-space and reducing costs.

Nexperia has designed this series of switches to include additional features which enhance overall system safety. Fail-safe logic permits control pins to be biased prior to system power-up and remain biased even after the system has powered down. This eliminates the requirement for power sequencing between the analog switch and the system microcontroller unit (MCU). A power-off protection feature allows analog pins to be biased prior to system power-up and to remain biased after system power-down. This removes the restrictions associated with power sequencing for the analog switch and various power rails which support analog signals and ADC circuitry further down the signal-chain. The combination of both features in the NMUX130X prevents back-power of the supply rail through any pin of the analog switch.

These devices integrate injection current control circuitry, limiting output voltage shifts on the active channel to under 5 mV when an overvoltage event happens on disabled signal channels. This eliminates the need for external diode and resistor networks, saving board-space and reducing cost.

The NMUX1308 and NMUX1309 switches include 8-channel and dual 4-channel devices, in standard (-40 °C to +85 °C) and automotive-qualified (-40 °C to +125 °C) versions and are available in leaded and leadless options, including a leadless package which support AOI (Automated Optical Inspection) for automotive applications.

https://www.nexperia.com/analogswitches

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Renesas unveils powerful single-chip MPU for next-gen robotics

Renesas Electronics Corporation, has expanded its popular RZ Family of microprocessors (MPUs) with a new device targeting high-performance robotics applications, the RZ/V2H enables both vision AI and real-time control capabilities.

The device comes with a new generation of Renesas proprietary AI accelerator, DRP (Dynamically Reconfigurable Processor)-AI3, delivering 10 TOPS/W power efficiency, a 10-fold improvement over previous models. Additionally, pruning technology employed in the DRP-AI3 accelerator significantly improves AI computing efficiency, boosting AI inference performance up to 80 TOPS. This performance boost allows engineers to process vision AI applications directly at edge AI devices without relying on cloud computing platforms.

The RZ/V2H incorporates four Arm Cortex-A55 CPU cores with a maximum operating frequency of 1.8 GHz for Linux application processing, two Cortex-R8 cores running at 800 MHz for high-performance real-time processing, and one Cortex-M33 as a sub core. By integrating these cores into a single chip, the device can effectively manage both vision AI and real-time control tasks, making it ideal for demanding robotics applications of the future. Since the RZ/V2H consumes less power, it eliminates the need for cooling fans and other heat-dissipating components. This means engineers can design systems that are smaller in size, less expensive, and more reliable.

Renesas has applied its proprietary DRP technology to develop the OpenCV Accelerator that speeds up the processing of OpenCV, an open-source industry standard library for computer vision processing. The resulting speed improvement is up to 16 times faster compared to CPU processing. The combination of the DRP-AI3 and the OpenCV Accelerator enhances both AI computing and image processing algorithms, enabling the power-efficient, real-time execution of Visual SLAM used in applications such as robot vacuum cleaners.

To accelerate development, Renesas also released AI Applications, a library of pre-trained models for various use cases, and the AI SDK (Software Development Kit) for rapid development of AI applications. By running these software on the RZ/V2H’s evaluation board, engineers can evaluate AI applications easily and earlier in the design process, even if they do not have extensive knowledge of AI.

https://www.renesas.com/rzv2h

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Nexperia broadens its range of discrete FET solutions at APEC 2024

Nexperia bringing its product innovations to APEC and has announced the release of several new MOSFETs to further broaden its range of discrete switching solutions for use in various applications across multiple end markets. This release includes 100 V application specific MOSFETs (ASFETs) for PoE, eFuse and relay replacement in 60% smaller DFN2020 packaging, and 40 V NextPowerS3 MOSFETs with improved electromagnetic compatibility (EMC) performance.

PoE switches typically have up to 48 ports, each requiring 2 MOSFETs for protection. With up to 96 MOSFETs on a single PCB, any reduction in device footprint is attractive. For this reason, Nexperia has released 100 V PoE ASFETs in 2 mm x 2 mm DFN2020 packaging which occupies 60% less space than previous versions in LFPAK33 packaging. A critical function of these devices is to protect PoE ports by limiting inrush currents while safely managing fault conditions. To manage this scenario, Nexperia has enhanced the safe operating area (SOA) of these devices by up to 3x with only a minimal increase in RDS(on). These ASFETs are also suitable for battery management, Wi-Fi hotspot, 5G picocell and CCTV applications and can serve as replacements for mechanical relays in smart thermostats, for example.

EMC-related issues caused by MOSFET switching usually only emerge late in the product development life cycle and resolving them can incur additional R&D costs and delay market release. Typical solutions include using significantly more expensive MOSFETs with lower RDS(on) (to slow down switching and absorb excessive voltage ringing) or to fit an external capacitive snubber circuit but this approach has the disadvantage of increasing component count. Nexperia has optimised its 40 V NextPowerS3 MOSFETs to offer similar EMC performance as that which can be achieved using an external snubber circuit, while also offering higher efficiency. These MOSFETs are suitable for use in switching converters and motor controllers across various applications and are available in LFPAK56 packaging.

To learn more about Nexperia’s PoE ASFETs visit: https://nexperia.com/asfets-for-poe
To learn more about Nexperia’s NextPowerS3 MOSFETs visit: https://nexperia.com/nextpowers3

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