ICs & Semiconductors

ST releases energy-efficient autonomous inertial measurement unit

Thu, Jun 06, 2024

The STMicroelectronics ISM330BX 6-axis inertial measurement unit (IMU) combines edge-AI processing, an analog hub for sensor expansion, and ST’s Qvar electric charge variations sensing with product-longevity assurance for energy-efficient industrial sensing and motion tracking applications.

The IMU contains a 3-axis gyroscope and a 3-axis accelerometer with a low-noise architecture and bandwidth up to 2kHz, suitable for vibration sensing in machine-tool condition-monitoring applications. Additional use cases include industrial and domestic robots and automated guided vehicles (AGV), intelligent appliances, and motion trackers.

Also integrating ST’s edge-processing engine that teams a machine-learning core (MLC) with AI algorithms and a finite state machine (FSM), the ISM330BX offloads the host processor and saves system power. The IMU also embeds ST’s Sensor Fusion Low-Power (SFLP) algorithm for 3D orientation tracking, which can enhance energy efficiency in applications like robotics and smart safety helmets. Leveraging adaptive self-configuration (ASC), the sensor can also automatically optimise its settings in real-time for best performance and power.

With its autonomous capabilities, the ISM330BX alleviates data transmission between the IMU and host system, as well as offloads the main processor, ensuring low latency and low power consumption. The integrated analog hub provides more opportunities for energy-efficient system integration by directly connecting external analog sensors to the edge-processing engine for data filtering and AI inference. The many power-saving aspects of the ISM330BX help engineers realize innovative industrial sensors and other battery powered smart devices that can be used also to upgrade existing industrial assets making them smarter and ready for industry 5.0

With ST’s Qvar electric charge variation detector also built-in, the IMU can integrate touch and close-proximity detection, or value-added functionality such as water leak sensing, to boost system integration and energy efficiency.

https://www.st.com/ism330bx

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u-blox launches Bluetooth Angle-of-Arrival solution to enable indoor asset tracking

Tue, Jun 04, 2024

u-blox has announced u-locate, a complete indoor positioning solution, offering the optimal combination of accuracy, cost and power consumption. Based on Bluetooth LE AoA (Angle-of-Arrival), u-locate delivers positioning accuracy levels down to 10 centimetres while ensuring extended tag battery lifetimes at an affordable price point.

The flexible and modular u-locate solution targets RTLS (real-time location system) solution providers and systems integrators, with end-user indoor tracking applications in warehousing, manufacturing, healthcare and many more. The easy-to-configure mobile application includes an extensive management support tool and anchors with self-aware orientation, removing the pain of complex solution installations and ensuring reduced times to market.

u-locate’s AoA positioning algorithms deliver accuracy while reducing the cost of tracking assets, enabling a wider range of use cases. The combination of Bluetooth 5.1 technology with the optimised antenna configuration of u-locate delivers positioning accuracy, without compromising power consumption. The u-locate solution scales easily as the end-user installation grows, and futureproofing is underpinned with OTA (over-the-air) software updates ensuring continuous access to new features and updates.

The flexible solution can be tailored according to the needs of the application, and consists of a positioning middleware (u-locateHub), a positioning engine (u-locateEngine), anchor points (u-locateAnchor) and tags (u-locateTag). It can be complemented with GNSS (Global Navigation Satellite System) products from u-blox, to guarantee seamless indoor and outdoor localisation.

u-locateHub complies with the omlox global interoperability standard and its well-documented API platform contains various APIs, supporting integration with multiple vendor solutions. By joining omlox, u-blox recognises the importance of contributing to a growing ecosystem, and promoting global interoperability of positioning solutions.

https://www.u-blox.com

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Microchip adds 12 Products to its wireless portfolio that reduce barriers to Bluetooth integration

Fri, May 31, 2024

System designers face many barriers when adding Bluetooth functionality to their products, from skill and resource limitations to budget constraints to time-to-market pressures to challenging performance and integration requirements. Microchip has expanded its Bluetooth Low Energy portfolio with 12 new products, aimed at providing designers with an extensive array of choices to tackle their unique challenges, effectively lowering barriers across designs spanning from the simplest to the most advanced. These additions include the RF-ready WBZ350 module and the PIC32CX-BZ3 SoC that offers the lowest entry point available for integrating a Bluetooth Low Energy microcontroller (MCU) into product designs. For a list of all 12 products see Microchip’s Bluetooth Low Energy webpage.

In addition to its Bluetooth MCUs, Microchip introduced the RNBD350 plug-and-play module that reduces the cost and complexity barriers to adding Bluetooth Low Energy connectivity to product designs. These modules minimise the time, money and engineering resources required for RF design optimisation, regulatory certification and software development.

Sample applications for Microchip’s Bluetooth Low Energy parts include IoT smart home and building systems, Industrial IoT (IIoT) solutions and automotive designs.

Designers using the newly expanded Bluetooth Low Energy portfolio for entry-level applications benefit from an easy development process, including in-house support services and development tools, without compromising Bluetooth functionality.

Developers can also tap into Microchip’s expanding wireless portfolio for end-to-end solutions. The portfolio offers a range of products in popular wireless technologies like Wi-Fi, Zigbee, Thread and sub-GHz that are designed to work seamlessly with the Bluetooth portfolio.

https://www.microchip.com.

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Infineon announces next generation CoolGaN transistor families

Thu, May 30, 2024

Infineon has announced two new generations of high voltage (HV) and medium voltage (MV) CoolGaN devices which now enable customers to use Gallium Nitride (GaN) in voltage classes from 40 V to 700 V in a broader array of applications that help drive digitalisation and decarbonisation. These two product families are manufactured on high performance 8-inch in-house foundry processes in Kulim (Malaysia) and Villach (Austria). With this, Infineon expands its CoolGaN advantages and capacity to ensure a robust supply chain in the GaN devices market, which is estimated to grow with an average annual growth rate (CAGR) of 46 percent over the next five years according to Yole Group.

The new 650 V G5 family addresses applications in consumer, data centre, industrial and solar. These products are the next generation of GIT-based high voltage products from Infineon. The second new family manufactured on the 8-inch process is the medium voltage G3 devices which include CoolGaN Transistor voltage classes 60 V, 80 V, 100 V and 120 V; and 40 V bidirectional switch (BDS) devices. The medium voltage G3 products are targeted at motor drive, telecom, data centre, solar and consumer applications.

https://www.infineon.com

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