ICs & Semiconductors

Microchip adds ECC20x and SHA10x families of secure authentication ICs to TrustFLEX platform

Thu, Aug 15, 2024

Secure key provisioning is vital to protect sensitive keys against third-party tampering and malicious attacks. For securing consumer, industrial, data centre and medical applications, secure key storage is essential but the process to develop and document secure key provisioning can be complex and costly. To lower the barrier of entry into secure key provisioning and enable more rapid prototyping, Microchip Technology has added the ECC204, SHA104 and SHA105 CryptoAuthentication ICs to its TrustFLEX portfolio of devices, services and tools.

ECC20x and SHA10x ICs are hardware-based, secure storage devices that are designed to keep secret keys hidden from unauthorised attacks. As part of the TrustFLEX platform, ECC204, SHA104 and SHA105 ICs are preconfigured with defined use cases, customisable cryptographic keys and code examples to streamline the development process.

“Adding the ECC20x and SHA10x pre-configured devices to our TrustFLEX platform will facilitate leveraging Microchip’s secure provisioning services for a broader set of applications,” Nuri Dagdeviren, corporate vice president of Microchip’s secure computing group. “With this platform expansion, Microchip is continuing to strengthen its portfolio, making security authentication ICs more accessible and more specifically optimised for high-volume, cost-sensitive applications.”

ECC20x and SHA10x devices meet Common Criteria Joint Interpretation Library (JIL) High rated secure key storage requirements and have been certified by the NIST Entropy Source Validation (ESV) and Cryptographic Algorithm Validation Program (CAVP) in compliance with the Federal Information Processing Standard (FIPS). The secure IC families are designed to implement trusted authentication to maintain the confidentiality, integrity and authenticity of data and communications in a wide range of systems and applications.

Microchip’s CryptoAuthentication ICs are small, low-power devices that are designed to be compatible with any microprocessors (MPUs) or microcontrollers (MCUs). They provide flexible solutions for securing industrial, medical devices, battery powered equipment and disposable applications. Additionally, the ECC204 is a Wireless Power Consortium (WPC) approved Qi authentication Secure Storage Subsystem (SSS).

ECC20x and SHA10x ICs are supported by Microchip’s Trust Platform Design Suite, which provides code examples and learning materials and enables the secure transfer of credentials to more easily leverage Microchip’s secure key provisioning services. The devices are also supported by the MPLAB X Integrated Development Environment (IDE), product-specific evaluation boards and CryptoAuthLib library support.

https://www.microchip.com

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Taiwan Semi’s new ESD protection devices are optimised for high-density electronics

Thu, Aug 15, 2024

Taiwan Semiconductor has introduced a new series of new ultra-small ESD protection devices optimised for wearables and other high-density electronic products. All DFN0603-packaged models in the 3.3V and 5.0V TESDx Series exceed the 8kV IEC61000-4-2 20kV contact discharge standard as well as IEC6100-4-5 4A peak pulse current, with margin. TESDx Series devices utilise Taiwan Semiconductor’s proprietary clamping cells to prevent overvoltage damage from ESD and lightning on control, power and data lines. Additionally, their industry’s lowest capacitance allows for full USB 3.0 data rates without compromise.

Applications for the new 3.3V/5.0V ESD protection series include wearable products, portable medical and test and measurement instrumentation and IoT and IIOT devices. Other applications include consumer electronics, computing, networking, peripherals, USB3.X ports and any application where ESD protection is needed — and where size is a top-of-mind concern.
The TESDx Series offers three models to choose from:
• TESDH3V3B03P1Q0 3.3V/40W 0.2pF
• TESDL3V3B23P1Q0 3.3V/70W 17pF
• TESDH5V0B03P1Q0 5.0/100W 0.2pF
“For wearables and other high-density electronic products, the devices used for ESD protection should be as small and thin as possible, so our new DFN0603-packaged devices are an ideal choice,” said Sam Wang, vice president, TSC Products. “The 3.3- and 5.0-volt models in the series provide full-compliance electrostatic discharge and electronic fast-transient protection, with margin. When protecting high-speed data signals, they also offer extremely low capacitance to ensure that the signal integrity in the application remains within spec and uncompromised.”

https://www.taiwansemi.com/en/

 

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Infineon expands its Bluetooth portfolio with eight new parts

Wed, Aug 14, 2024

Infineon has announced the expansion of its Bluetooth portfolio by eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, featuring Systems-on-Chip (SoCs) and modules optimised for industrial, consumer, and automotive use cases. The high integration of the CYW20829 product family allows designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and others. Product designers also benefit from Infineon’s development infrastructure and commitment to robust security, with support for secure boot and execution environments and cryptography acceleration to safeguard sensitive data.

The latest automotive part in the product family, the AIROC CYW89829 Bluetooth Low-Energy MCU, is ideal for car access and wireless battery management systems (wBMS) applications, due to its robust RF performance, long range and latest Bluetooth 5.4 features including PAwR (Periodic Advertising with Responses). The dual ARM Cortex core design of the chip family features separate application and Bluetooth Low Energy subsystems that deliver full featured support for Bluetooth 5.4, low-power, 10 dBm output power without a PA, integrated flash, CAN FD, crypto accelerators, high security including Root of Trust (RoT), and is PSA level 1 ready.

https://www.infineon.com

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Sondrel’s SFA 100 is ideal for AI at the Edge

Thu, Aug 01, 2024

Sondrel has optimised its SFA 100 to make it ideal for battery-powered, AI at the Edge applications. The SFA 100 is one of the five architectural platforms in the company’s Architecting the Future chip design platform which provides a ready-made design baseline that the company uses to build a bespoke solution for every customer.

The SFA 100 uses an Arm subsystem with a choice of Arm cores and the option of a security subsystem. Its low power requirement makes it the ideal platform for battery-powered edge AI applications such as smart home, smart factory, and sensor fusion devices. The device provides the ability to integrate a machine-learning engine supporting a variety of inference based ‘smarts’ such as voice activation, image classification, gesture recognition, filtering, etc. A radio subsystem such as a Bluetooth IP block or WiFi can also be added if required. Customer’s IP and any third-party IP can be included as Sondrel has the ability to wrap IP blocks so that they have all the necessary interfaces to just drop onto the chassis. More powerful solutions can be created by using the SFA 200 or SFA 300 as starting points.

The Edge AI market is predicted to expand at a CAGR of 33.5% to reach $76 billion by 2031 according to a report by Transparency Market Research. The key is the drive to process data locally and thus eliminate the latency from transmitting the data to a centralised cloud server for processing. Applications range from industry 4.0, where it is used to provide real-time decision making, to devices such as drones, smartphones, cars, etc.

https://www.sondrel.com/

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