Infineon has announced the release of a comprehensive evaluation kit for embedded, Edge AI and Machine Learning (ML) system designs. The new PSoC 6 AI Evaluation Kit provides all the tools required to build intelligent consumer, smart home and IoT applications. The solution executes inferencing next to the sensor data source, providing such user benefits as enhanced real-time performance and power efficiency compared to cloud-centric solution architectures. Its small 35 mm x 45 mm form factor, affordable cost and broad range of integrated sensors and connectivity make it the perfect choice for in-field data collection, rapid prototyping, model evaluation and solution creation.
The PSoC 6 AI Evaluation Kit also leverages Infineon’s advanced microcontroller (MCU), sensor and connectivity portfolios and powerful software development environments, including the Infineon ModusToolbox and the company’s Imagimob Studio offering for custom ML models, as well as off-the-shelf Ready Models.
“Infineon is helping drive the evolution of Edge AI, which requires the real-time compute capability and power-efficiency that distinguish our hardware portfolio, along with development tools that simplify and speed application development,” said Steve Tateosian, SVP of IoT, industrial and consumer microcontrollers, Infineon Technologies. “With our newest evaluation kit, we are offering access to a complete, easy-to-use ecosystem of Infineon hardware and software that will accelerate development and deployment of intelligent solutions in consumer, smart home, commercial and industrial IoT applications.”
ICs & Semiconductors
ST releases 750W motor-drive reference board in tiny outline
The EVLDRIVE101-HPD (High Power Density) motor-drive reference design by ST packs a 3-phase gate driver, STM32G0 microcontroller, and 750W power stage on a circular PCB just 50mm in diameter. The board features extremely low power consumption in sleep mode, below 1uA, and its tiny outline can fit directly in equipment like hairdryers, handheld vacuums, power tools, and fans. It also fits easily into drones, robots, and drives for industrial equipment such as pumps and process-automation systems.
Built with ST’s STDRIVE101 3-phase gate driver, the reference design gives flexibility to choose the motor-control strategy, such as trapezoidal or field-oriented control (FOC), with sensored or sensorless rotor-position detection. The STDRIVE101 IC contains three-half bridges with 600 mA source/sink capability and operates from 5.5V to 75V to handle any low-voltage application. The chip integrates voltage regulation for the high-side and low-side gate drivers and configurable drain-source-voltage (Vds) monitoring protection. It also provides an external pin for choosing direct high-side and low-side gate inputs or PWM control.
Developers can take advantage of the STM32G0 single-wire debug (SWD) interface to interact with the microcontroller, while support for direct firmware update allows applying bug fixes and new features.
The power stage of the EVLDRIVE101-HPD reference design features STL220N6F7 60V STripFET F7 MOSFETs, which preserve efficiency with their 1,2mΩ typical Rds(on), easing plug-and-play connection of the motor. Additional features include fast-acting power-on circuitry that disconnects the power source when idle to save energy and extend operation in battery-powered applications. Protection built into the driver IC ensures system safety and efficiency, including the Vds monitoring of the power-stage MOSFETs, as well as under-voltage lockout (UVLO), overtemperature protection, and cross-conduction prevention.
TI pioneers new magnetic packaging technology for power modules
TI has introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI’s proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% compared to competing modules, enabling designers of industrial, enterprise and communications applications to achieve previously impossible performance levels. Three of the six new devices, the TPSM82866A, TPSM82866C and TPSM82816, are the industry’s smallest 6A power modules, supplying an industry-leading power density of nearly 1A per 1mm2 of area.
In power design, size matters. Power modules simplify power designs and save valuable board space by combining a power chip with a transformer or inductor in one package. By leveraging TI’s exclusive 3D package moulding process, MagPack packaging technology maximises the height, width and depth of the power modules to push more power in a smaller space.
The magnetic packaging technology includes an integrated power inductor with proprietary, newly engineered material. As a result, engineers can now achieve best-in-class power density and reduce temperature and radiated emissions while minimising both board space and system power losses. These benefits are especially important in applications such as data centres, where electricity is the biggest cost factor, with some analysts predicting a 100% increase in demand for power by the end of the decade.
ST reveals new single-zone direct-ToF sensor with extended operating temperature
ST has introduced the VL53L4ED single-zone Time-of-Flight (ToF) sensor, which has an extended operating temperature range from -40°C to 105°C. Ready for harsh environments, the VL53L4ED enhances proximity detection and ranging under high ambient light conditions in applications such as industrial tools, smart-factory equipment, robot guidance systems, outdoor lighting controls, and security systems.
The VL53L4ED integrates a laser emitter and a single-photon avalanche-diode (SPAD) detector array in a convenient all-in-one module which ensures reliable measurement even in extreme temperature conditions. The next-generation laser provides enhanced performance in high ambient light environments and excellent short-distance ranging accuracy. In addition, the sensors embed a processor that allows power-saving autonomous operation and lowers demand for host-system resources.
ST’s new ToF sensor provides high-accuracy distance measurement to objects up to 1150mm away, throughout the entire field of view and over the full extended temperature range. Special settings allow accurate distance measurement up to 800mm under strong ambient light conditions. The VL53L4ED sensor maintains distance-measurement linearity down to 1mm and supports ranging frequency up to 100Hz.
Developers can take advantage of the X-CUBE-TOF1 expansion software package for the STM32Cube ecosystem to accelerate projects using the VL53L4 sensor family. Ready-to-use software includes as well the STSW-IMG034 driver that lets an interrupt command turn the VL53L4ED or VL53L4CD into an ultra-low-power proximity detector for user detection, system activation, and touchless control. In addition, the STSW-IMG039 software pack contains code examples for liquid-level monitoring. Hardware includes the X-NUCLEO-53L4A3 expansion board for the NUCLEO-F401RE microcontroller board, which eases running code examples and building applications, as well as the SATEL-VL53L4ED breakout board for prototyping.
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