Two Xeon processor additions target HPC and AI

Intel announces two member of its Xeon processor portfolio. The Cascade Lake advanced performance processor is expected to be released the first half of 2019 and the Intel Xeon E-2100 processor for entry-level servers is available now.

Cascade Lake represents a new class of Intel Xeon Scalable processors designed for the most demanding high-performance computing (HPC), artificial intelligence (AI) and infrastructure-as-a-service (IaaS) workloads. The processor incorporates a performance optimised multi-chip package to deliver up to 48 cores per CPU and 12 DDR4 memory channels per socket.

Cascade Lake advanced performance processors will deliver both core CPU performance gains and leadership in memory bandwidth constrained workloads, promises Intel. Performance estimates include Linpack up to 1.21x versus Intel Xeon Scalable 8180 processor and 3.4×2 versus AMD EPYC 7601; Stream Triad up to 1.83x versus Intel Scalable 8180 processor and 1.3×2 versus AMD EPYC 7601;

AI/deep learning inference up to 17x images-per-second versus Intel Xeon Platinum processor at launch.

Intel SGX on the Intel Xeon E-2100 processor family delivers hardware-based security to secure customer data and applications. This feature allows new entry-level servers featuring an Intel Xeon E-2100 processor to provide an additional layer of hardware-enhanced security measures when used with properly enabled cloud applications.

The Xeon E-2100 processor is targeted at small- and medium-size businesses and cloud service providers. It supports workloads suitable for entry-level servers as well as any computing applications requiring enhanced data protection for sensitive workloads.

The Intel Xeon E-2100 processor-based servers will support the latest file-sharing, storage and backup, virtualisation, and employee productivity solutions.

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600V GaN FET supports applications up to 10kW

Claimed to double power density in industrial and telecomms applications, the LMG341x family of high-voltage GaN FETs has been announced by Texas Instruments.

The 600V GaN FETs of 50 and 70-mOhm power stages support applications from sub 100W to 10kW. The FETs enable designers to create smaller, more efficient and higher-performing designs compared to silicon FETs in AC/DC power supplies, robotics, renewable energy, grid infrastructure, telecomms and personal electronics applications.

The LMG341x family devices provide an alternative to traditional cascade and standalone GaN FETs by integrating functional and protection features to simplify design, says TI. This enable greater system reliability and optimisation of the performance of high-voltage power supplies. With integrated current limiting of up to 100 nanoseconds and over-temperature detection, the devices protect against unintended shoot-through events and prevent thermal runaway. System interface signals enable a self-monitoring capability.

TI’s integrated GaN power stage doubles power density and reduces losses by 80 per cent compared to silicon MOSFETs, explains TI. Each device is capable of fast, 1MHz switching frequencies and slew rates of up to 100V/nanoseconds.

The family of GaN FETs is backed by 20 million hours of device reliability testing, including accelerated and in-application hard switch testing.

The LMG3410R050, LMG3410R070 and LMG3411R070are available now in 8.0 x 8.0mm split-pad, quad flat no-lead (QFN) packaging.

Visitors to the Texas Instruments stand C4-131 at electronica (13 – 16 November at Messe Munchen, Germany) will see a 10kW cloud-enabled grid link demonstration, jointly developed by TI and Siemens. The demonstration uses TI’s LMG3410R050 600V GaN FET with integrated driver and protection, enabling engineers to achieve 99 per cent efficiency and up to 30 per cent reduction in power component size compared to a traditional silicon design.

Texas Instruments is a semiconductor design and manufacturing company that develops analogue integrated circuits (ICs) and embedded processors.

http://www.TI.com

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AC/DC converter in tablet configuration enables high density racks

A three-phase, AC/DC converter module, the RFM, from Vicor, is capable of delivering 10kW of regulated 48V DC in a power tablet configuration measuring 9.4 x 5.9 x 0.6-inches (240 x 150 x 15mm).

The RFM provides a power-factor-corrected, regulated, and isolated DC output with integrated filtering and built-in fault protection for redundant operation. It can be configured to accept worldwide three-phase AC mains from 200 to 480V AC.

The low-profile power tablet design aids power density and thermal management, says Vicor. For example, four RFMs in parallel, including input-disconnect circuitry, rectification and hold-up energy storage at 48V, can supply 40kW of power within 1U of rack space.

The RFM power tablet package provides thermal management for advanced cooling, including liquid cooling, of high-power server racks for demanding high performance computing (HPC) and artificial intelligence (AI) inference and learning applications.

Vicor explains that 48V (including 54V DC) distribution is the emerging standard in high-power racks using smaller-gauge wiring. It achieves substantially lower distribution losses, than legacy 12V DC distribution. In combination with Vicor 48V Power-on-Package (PoP) and 48V Direct-to-PoL solutions, the RFM enables dense and efficient end-to-end power system solutions, from three-phase AC to sub-1.0V AI processors at the point-of-load, confirms Vicor.

The 10kW power tablet RFM is the first in a new series of single and three-phase AC/DC modules featuring power outputs from 150 to 15kW.

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Low-power microcontrollers secure the IoT

Building on Arm TrustZone hardware-based cyber protection for resource-constrained connected devices, the STM32L5 microcontroller has an Arm Cortex-M33 core.

The Cortex-M33 boosts protection for small devices by integrating Arm’s TrustZone hardware-based security, explains ST. The STM32L5-series microcontrollers add further enhancements including software isolation, secure boot, key storage, and hardware cryptographic accelerators. They also provide rich functionality, says the company, and long run-times powered by coin cells or energy harvesting.

They consume as little as 33nA in shutdown mode and achieving 402 ULPMark-CP in the EEMBC ULPBench. The microcontrollers also integrate low power techniques such as adaptive voltage scaling, real-time acceleration, power gating, and multiple reduced-power operating modes.

Integrated digital and analogue peripherals, and consumer and industrial interfaces such as CAN FD, USB Type-C, and USB Power Delivery, the STM32L5 microcontrollers can be used for products such as industrial sensors or controls, home-automation devices, smart meters, fitness trackers, smart watches, medical pumps or meters.

The TrustZone IP integrated in the STM32L5 series microcontrollers implements trusted-computing principles for authenticating devices connected to a network. There is the freedom to include or exclude each I/O, peripheral, or area of flash or SRAM from TrustZone protection, allowing sensitive workloads to be fully isolated for maximum security. ST has engineered TrustZone to ensure support for secure boot, special read-out and write protection for integrated SRAM and flash, and cryptographic acceleration including AES 128/256-bit key hardware acceleration, private key acceleration (PKA), and AES-128 On-The-Fly Decryption (OTFDEC) to protect external code or data. Active tamper detection and support for secure firmware install are also included.

In addition to the flexible power-saving operating modes and ST’s low-power technologies, the STM32L5 series also features a switched-mode step-down regulator that improves low-power performance when the VDD voltage is high enough and can be powered up or down on-the-fly.

The microcontrollers achieve up to 165 DMIPS/427 CoreMark using the ST ART Accelerator at 110MHz. The ST ART Accelerator now supports both internal flash and external memory with an 8kbyte instruction cache for greater efficiency in case the software runs out of external memory.

512kbyte dual-bank flash allows read-while-write operation to aid device management and ensures a high level of safety by supporting error correction code (ECC) with diagnostics. There is also a 256kbyte-SRAM and features to support high-speed external memory including single, dual, quad, or octal SPI and Hyperbus Flash or SRAM, and an interface for SRAM, PSRAM, NOR, NAND or FRAM.

The STM32L5 series also introduces new digital peripherals including USB Full Speed with dedicated supply allowing customers to keep USB communication even when the system is powered at 1.8V. There is also a UCPD controller compliant with USB Type-C Rev. 1.2 and USB Power Delivery Rev. 3.0 specifications.

Analog features include an ADC, two power-gated DACs, two low-power comparators, and two operational amplifiers with external or internal follower routing and programmable-gain amplifier (PGA) capability.

The STM32L5 series is available in standard temperature grade for consumer and commercial applications, or high-temperature grade specified from -40 to +125 degree C.

STM32L5-series microcontrollers are sampling now and scheduled to begin production in Q2 2019.

http://www.st.com/stm32l5

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