ICs & Semiconductors Archives - Page 210 of 231

PoE chipset exploits IEEE 802.3bt specificiation

Thu, Apr 04, 2019

Reliable and space-efficient powered devices (PDs) can be built to take advantage of the latest IEEE 802.3bt Power-over-Ethernet (PoE) specification, says STMicroelectonics, on the introduction of the PM8804 and PM8805.

The PM8804 and PM8805 provide the PoE-converter circuitry for PDs up to class-eight, which defines a usable power budget of 71W. According to STMicroelectronics, the chipset saves space, enhances reliability, and cuts time to market for 5G small cells, WLAN access points, switches, and routers. The PoE chipset also targets smart-building and smart office applications such as IP cameras, access-control systems, display panels, lighting, curtain or shutter controllers, video-call systems, IP phones, and tabletop consoles.

The PM8804 implements a PWM controller for a 48V isolated flyback or forward converter, including dual low-side gate drivers for high-efficiency forward active-clamp topologies. The operating frequency is selectable up to 1MHz, allowing the use of small external filter and decoupling components for high power density. The PM8804 is a high-voltage start-up regulator with 20mA output capability to help save on board space and bill of materials.

The PM8805 companion chip contains two active bridges, a charge pump for driving high-side MOSFETs, a hot-swap FET, and the IEEE 802.3bt compliant interface. Integrating the active bridges saves the real estate otherwise occupied by eight discrete MOSFETs and their driving circuitry, explains STMicroelectronics. The PM8805 generates a power-good signal for enabling the PM8804 and other circuitry such as an LED driver, and supports maintain power signature (MPS) current control that allows the PD to enter power-saving standby without being disconnected.

Both devices are in production now. The PM8804 is packaged as a 3.0 x 3.0mm, 0.5mm-pitch VFQFPN-16. The PM8805 in 8.0 x 8.0mm thermally enhanced VFQFPN-43 featuring exposed pads.

This news story is brought to you by softei.com, the specialist site dedicated to delivering information about what’s new in the electronics industry, with daily news updates, new products and industry news.

To stay up-to-date, register to receive our weekly newsletters and keep informed of the latest technology news and new products from around the globe. Simply click this link to register here: softei.com

http://www.st.com

> Read More

FPGA provides customised solutions for data0centric business

Wed, Apr 03, 2019

FPGAs that will provide customised solutions for data-centric challenges in embedded, network and data centre sectors have been released by Intel. The Agilex FPGAs deliver customised connectivity and acceleration and performance and power improvements for diverse workloads, says Dan McNamara, Intel senior vice president, Programmable Solutions Group.

The Agilex FPGA is believed to be the first FPGA to support Compute Express Link, a cache and memory coherent interconnect to future Intel Xeon Scalable processors. The FPGA’s second generation HyperFlex architecture provides up to 40 per cent higher performance, or up to 40 per cent lower total power compared with Intel Stratix 10 FPGAs, notes Intel.

It is also believed to be the only FPGA supporting hardened BFLOAT16 and up to 40TFLOPS of DSP performance (FP16) and it has Gen 5 PCIe for higher bandwidth that PCIe Gen 4.

The Agilex FPGA supports data transfer rates of up to 112Gbits per second and has advanced memory support with DDR5, HBM and Intel Optane DC persistent memory support.

The Agilex FPGA fabric is built on Intel’s 10nm process with heterogeneous 3D SiP technology. This provides the capability to integrate analogue, memory, custom computing, custom I/O, and Intel eASIC device tiles into a single package with the FPGA fabric. Intel delivers a custom logic continuum with reusable IPs through a migration path from FPGA to structured ASIC. One application program interface (API) provides a software-friendly heterogeneous programming environment, enabling software developers to access acceleration via the use of FPGAs, maintains Intel.

The FPGAs have been developed to support customers in aggregating and processing increasing amounts of data traffic for emerging, data driven industries like edge computing, networking and the cloud. Intel Agilex FPGAs can be used in edge analytics for low-latency processing, virtualised network functions to improve performance, or data centre acceleration for greater efficiency, says Intel. They are built to deliver customised solutions for applications from the edge to the cloud.

The Agilex FPGAs have the flexibility to meet the hardware system challenges presented by advances in artificial intelligence (AI) analytics at the edge, network and the cloud, explains Intel.

http://www.intel.com

> Read More

FPGA provides customised solutions for data0centric business

Wed, Apr 03, 2019

FPGAs that will provide customised solutions for data-centric challenges in embedded, network and data centre sectors have been released by Intel. The Agilex FPGAs deliver customised connectivity and acceleration and performance and power improvements for diverse workloads, says Dan McNamara, Intel senior vice president, Programmable Solutions Group.

The Agilex FPGA is believed to be the first FPGA to support Compute Express Link, a cache and memory coherent interconnect to future Intel Xeon Scalable processors. The FPGA’s second generation HyperFlex architecture provides up to 40 per cent higher performance, or up to 40 per cent lower total power compared with Intel Stratix 10 FPGAs, notes Intel.

It is also believed to be the only FPGA supporting hardened BFLOAT16 and up to 40TFLOPS of DSP performance (FP16) and it has Gen 5 PCIe for higher bandwidth that PCIe Gen 4.

The Agilex FPGA supports data transfer rates of up to 112Gbits per second and has advanced memory support with DDR5, HBM and Intel Optane DC persistent memory support.

The Agilex FPGA fabric is built on Intel’s 10nm process with heterogeneous 3D SiP technology. This provides the capability to integrate analogue, memory, custom computing, custom I/O, and Intel eASIC device tiles into a single package with the FPGA fabric. Intel delivers a custom logic continuum with reusable IPs through a migration path from FPGA to structured ASIC. One application program interface (API) provides a software-friendly heterogeneous programming environment, enabling software developers to access acceleration via the use of FPGAs, maintains Intel.

The FPGAs have been developed to support customers in aggregating and processing increasing amounts of data traffic for emerging, data driven industries like edge computing, networking and the cloud. Intel Agilex FPGAs can be used in edge analytics for low-latency processing, virtualised network functions to improve performance, or data centre acceleration for greater efficiency, says Intel. They are built to deliver customised solutions for applications from the edge to the cloud.

The Agilex FPGAs have the flexibility to meet the hardware system challenges presented by advances in artificial intelligence (AI) analytics at the edge, network and the cloud, explains Intel.

http://www.intel.com

> Read More

Platform protects comms between smart factory and the cloud

Thu, Mar 28, 2019

At the Hannover Fair next week, Infineon Technologies will present what it claims is the world’s first Trusted Platform Module (TPM) specifically for industrial applications. The Optiga TPM SLM 9670 protects the integrity and identity of industrial PCs, servers, industrial controllers or edge gateways, explains Infineon. It controls access to sensitive data in key positions in a connected, automated factory as well as at the interface to the cloud.

The TPM protects sensitive data in connected devices and lowers the risk of data and production losses due to cyber attacks. It also shortens time to market and reduces costs, claims Infineon. Using Infineon’s audited and certified TPMs, manufacturers of industrial devices can achieve higher security levels of the IEC 62443 standard and accelerate their certification processes. Infineon says they can also cut costs for maintenance of the devices through secured remote software updates.

The Optiga TPM SLM 9670 meets the TPM 2.0 standard of the Trusted Computing Group and is certified by an independent test lab in accordance with Common Criteria. Service life is 20 years firmware can be updated on the chip to meet long-term security risks that may be encountered in an industrial environment. The Optiga TPM SLM 9670 has an extended temperature range of -40 to +105 degrees C and is qualified according to the industrial JEDEC JESD47 standard.

The Optiga TPM SLM 9670 is manufactured at Infineon’s security-certified facilities in Germany and will be available in large volumes from the second half of 2019.

Infineon offers application-specific solutions for business PCs and routers, connected vehicles, or cloud applications. The Optiga TPM SLM 9670 will be presented for the first time at this year’s Hannover Messe (1 to 4 April). Infineon will run a demonstrator for energy-efficient and secured smart factories at the stand of Amazon Web Services (Hall 6, Stand F46).

http://www.infineon.com

> Read More

PoE chipset exploits IEEE 802.3bt specificiation

FPGA provides customised solutions for data0centric business

FPGA provides customised solutions for data0centric business

Platform protects comms between smart factory and the cloud

About Smart Cities