SECORA Pay Bio enhances convenience and trust of biometric contactless payment

As the payment world moves towards digitalisation, the need to protect digital identities and transactions has never been more important. In addition to standard contactless payment cards, biometric payment cards are a promising development in this area and are gaining in popularity. Against this backdrop, Infineon has announced SECORA Pay Bio, an all-in-one biometric payment card solution that complies with Visa and Mastercard specifications. It integrates Infineon’s enhanced SLC39B system-on-chip (SoC) Secure Element and the FPC1323 sensor by Fingerprint Cards AB (Fingerprints) into the Infineon Biometric Coil on Module (BCoM) package, leveraging the key advantages of inductive coupling technology. The solution uses the fingerprint credentials securely stored on the card as a second authentication factor, enabling a convenient and trusted contactless payment experience.

In an optimistic scenario, ABI Research expects the market for biometric cards to grow to 113.3 million units by 2028. This market trend is driven by further optimisation of the price-performance ratio, including the producibility and cost of biometric payment cards, as well as by consumer demand for more convenient and secured biometric authentication in personal payment transactions. Furthermore, biometric payment cards could offer an additional barrier against lost-and-stolen fraud and PIN phishing fraud.

SECORA Pay Bio extends Infineon’s SECORA Pay solution family. The solution integrates Fingerprints’ sensor and Infineon’s SLC39B SoC Secure Element into a single dual-interface package, the innovative Infineon Biometric Coil on Module (BCoM). The SLC39B Secure Element with an integrated power source offers large memory size and various peripherals, as well as excellent contactless performance. Based on innovative inductive coupling technology without wire connection from the BCoM module to the card antenna, manufacturing complexity can be drastically reduced, and the card robustness and long-term reliability can be significantly improved. In addition, the biometric sensor card production can now be implemented on existing dual interface card manufacturing equipment with only minor operational changes. As the SECORA Pay Bio solution complies with both Mastercard and Visa specifications, the use of BCoM technology would not require additional performance testing, enabling a flexible and rapid rollout with outstanding performance and a frictionless onboarding process.

SECORA Pay Bio supports a wide range of enrolment options, including sleeves, smartphone apps and in-field enrolment. The innovative SECORA Pay Bio enrolment sheet makes fingerprint enrolling via smartphone easier than ever before. In addition, SECORA Pay Bio is the first biometric payment solution to support in-field enrolment. This allows cardholders to use biometric payment cards without any additional effort or devices. Moreover, with these new biometric cards, the fingerprint template is trained with each payment transaction, improving the user experience even further.

Availability
The SECORA Pay Bio solution supports the latest payment applications according to EMV specifications. The pilot proven product is available with full design-in package and ready for mass-production. More information is available at https://www.infineon.com/secorapaybio

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Infineon introduces the XENSIV PAS CO2 5V sensor for higher energy efficiency

In order to further drive decarbonisation, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions. Innovative solutions are needed to optimise energy consumption while ensuring a healthy indoor environment. Infineon is addressing this need with the introduction of the new XENSIV PAS CO2 5V sensor. It is based on the Photoacoustic Spectroscopy (PAS) technology and improves energy efficiency by adapting ventilation to actual occupancy, thereby reducing the carbon footprint of buildings. This makes the device suitable for applications such as heating, ventilation, and air conditioning (HVAC) systems as well as room controller and thermostat units in commercial and residential buildings. It can also be used for IoT and consumer devices such as smart lighting, air purifiers, conferencing systems, and smart speakers, as well as emerging applications such as smart horticulture and smart refrigerators.

“Environmental sensing is an important pillar of Infineon’s sensor portfolio,” said Andreas Kopetz, VP Ambient Sensing at Infineon. “CO2 sensors play an increasingly important role in smart homes and buildings by continuously monitoring indoor air quality and adjusting ventilation systems accordingly. Our XENSIV PAS CO2 5V is a sensor solution that ensures a healthier living environment for occupants and enables significant energy savings for greater sustainability.”

The XENSIV PAS CO2 5V provides accurate air quality data in real time. Its miniaturised form factor of 14×13.8×7.5 mm³ is identical to the size of the XENSIV PAS CO2 12V sensor and allows seamless integration into a wide range of applications. This makes it easy to adopt dual designs or maintain the same design strategy for both product variants. Compared to the 12V sensor, the 5V version comes with a 5V power supply which further simplifies installation. Moreover, it offers a significantly faster response time of 55 seconds, down from 90 seconds (12 V). This improvement enhances efficiency across various applications, allowing for quicker data acquisition and more responsive performance in dynamic environments. The sensor’s design is dust-proof in accordance with ISO 20653:2013-02, which extends the lifetime of the device in dusty environments and minimises maintenance requirements. In addition, the UART, I²C and PWM interfaces enable seamless integration with microcontrollers and other digital systems, simplifying the design and development process. Ultimately, with its robust performance, the sensor meets the performance criteria of the internationally recognised WELL Green Building Standard, enhancing both environmental sustainability and property value.

All major components of the XENSIV PAS CO2 5V sensor are developed in-house according to Infineon’s high-quality standards. Among others, this includes a dedicated microcontroller that runs advanced compensation algorithms to provide direct and reliable ppm readouts of real CO2 levels. The available configuration options make the sensor one of the most versatile plug-and-play CO2 sensors on the market. They include a dedicated ABOC (Automatic Baseline Offset Calibration), pressure compensation, signal alarm, sample rate and early measurement notification, which are especially useful for power consumption management. The SMD package, delivered in tape and reel, allows for easy assembly, even in high-speed, high-volume manufacturing.

https://www.infineon.com/co2

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Rutronik now offers the nRF9151 from Nordic Semiconductor

The nRF9151 from Nordic Semiconductor is a new addition to the Rutronik Wireless portfolio: an energy-efficient system-in-package (SiP) with integrated LTE-M, NB-IoT, GNSS, and DECT NR+ radio modem. Currently the smallest and most power-efficient device of its kind, the nRF9151 sets a new standard for highly integrated and compact SiP solutions. Also available is the nRF9151 DK, a specially developed, cost-effective and pre-certified single-board development kit for initial evaluation and development purposes. As a fully integrated, pre-certified SiP with an application MCU, the nRF9151 is suitable for the development of extensive applications or for use as a stand-alone cellular modem. This simplifies the development and deployment of scalable products in numerous IoT markets, including industrial automation, asset tracking, smart city, smart metering and smart agriculture.
The nRF9151 represents a significant advance in cellular IoT technology and offers a cost-effective and globally accessible solution. The comprehensive and compact solution includes hardware with a programmable application processor, software, cloud services, development tools and world-class support.

The nRF9151 achieves its unrivalled performance and versatility through the use of low-power LTE technology, advanced processing capabilities, and robust security features. 3GPP Release 14 LTE-M/NB-IoT and DECT NR+ are supported.

Benefits at a glance:
• Fully integrated SiP with 64 MHz Arm Cortex-M33 and multimode LTE-M/NB-IoT modem with DECT NR+ support and GNSS 700-2200 MHz LTE band support
• Power Class 5 20 dBm
• Power Class 3 23 dBm
• 1.9GHz NR+ band support
• Certified for global operation
• Dedicated programmable application processor and memory
• 1 MB flash + 256 KB RAM
• Arm TrustZone + Arm CryptoCell 310

Application examples:
• Asset Tracking
• Smart Metering
• Smart City
• Smart Agriculture
• Predictive maintenance
• Portable Medical Devices
• Industry 4.0

https://www.rutronik24.com

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Silicon Labs wireless Gecko SoCs streamline energy harvesting for battery-free IoT devices

Mouser Electronics, is now stocking the EFR32xG22E wireless Gecko system-on-chip (SoC) series from Silicon Labs. The EFR32xG22E is Silicon Lab’s most energy-efficient wireless SoC to date, designed to operate in the ultra-low-power envelope required for battery-free energy harvesting. The Silicon Labs EFR32xG22E wireless Gecko SoCs allow users to develop Bluetooth Low Energy (LE), 802.15.4-based or proprietary 2.4GHz wireless devices for IoT applications that harvest energy from external sources.
The Silicon Labs EFR32xG22E wireless Gecko SoC family consists of three variants: the EFR32BG22E, the EFR32MG22E, and the EFR32FG22E. Each variant features an integrated Arm Cortex M4 MCU and a high-performance 2.4GHz radio. The EFR32xG22 SoCs are ideal for devices that require immediate activation and efficient power management, featuring EM4 wake-up of 1.83 milliseconds and power consumption of just 16.6 microjoules (µJ). The SoCs also support multiple power sources and power management devices, allowing users to explore new battery technologies such as supercapacitors.
The EFR32BG22E wireless SoC enables Bluetooth 5 networking in IoT devices that demand fast startup, including asset tags and beacons, consumer electronics, and Bluetooth Mesh low-power nodes. The EFR32BG22E also offers a Bluetooth 5 direction-finding feature. The EFR32MG22E SoC is designed for Zigbee® green power and home automation, lighting and building controls, and smart building sensors. The optimised Zigbee SoC includes a 12-channel peripheral reflex system that allows for autonomous interaction among MCU peripherals, reducing latency and power consumption. The EFR32FG22E proprietary wireless 2.4 SoC features RFSense and delivers energy efficiency and increased lifespan for products with limited battery resources. The proprietary wireless 2.4 SoC is a single-die solution for electronic shelf labels, home and building automation, and commercial lighting.
The Silicon Labs EFR32xG22E wireless Gecko SoCs are supported by the xG22 Development Tools: the EFR32xG22E wireless Gecko radio boards and starter kit. The xG22 tools provide developers with everything they need to evaluate the EFR32xG22E wireless Gecko SoCs and build scalable wireless IoT applications.

https://www.mouser.com

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