ICs & Semiconductors

Power management IC reduces size of smart appliances

Fri, Apr 26, 2019

Rohm Semiconductor has introduced the BD71847AMWV, a power management IC (PMIC) optimised for NXP Semiconductors’ i.MX 8M mini applications processors to contribute to longer operating time and to reduce the size of smart speakers, networked audio, smart displays and other smart home appliances.

The BD71847AMWV has been added to Rohm’s portfolio of PMICs designed for NXP’s i.MX application processors. The i.MX ecosystem partner introduced the PMIC last year to support the i.MX 8M Quad and Dual applications processors.

i.MX 8M Mini applications processors allow customers to incorporate voice interface to audio/video streaming devices at minimal cost, explains Rohm. They integrate up to four Arm Cortex-A53 cores operating up to 1.8GHz along with an Arm Cortex-M4 or M7 that operates at up to 400MHz for low standby power consumption. For consumer and industrial application use, there is also support for 1080p video processing, 2D/3D graphics, advanced audio functions, and a variety of high-speed interfaces.

BD71847AMWV integrates all power rails required by the processor as well as power supplies for DDR and common system IO. In addition to DC/DC converters with what the company claims is industry-leading efficiency of 95 per cent, the PMIC features programmable power sequencer for flexible power control and management, seamless hardware control interface to i.MX 8M Mini, buffered sleep clock and protection functions. Customisation and programmability help to shorten development time, lower system bill of materials and to minimise footprint, says Rohm.

The PMIC integrates six DC/DC buck converter,  six low drop out regulators, 1.8V/3.3V power switch for SDXC cards, 32kHz crystal driver and buffered output clock, monitoring and protection circuits, and programmable sequencer and power state control logic.

The 2.7 to 5.5V input voltage range supports a variety of power sources, from single-cell Li-ion battery to USB and wall adapter.

The PMIC is offered in a compact 56-pin 7.0 x 7.0mm QFN package. The pin layout is carefully designed to ensure easy connection to NXP’s i.MX 8M Mini applications processor and DDR memory. Rohm estimates that the level of integration results in the number of external parts required by 42 and mounting area by 42 per cent compared with discrete solutions (assuming Type 3 PCB for single-sided mounting). With two-sided mounting, the board size could be as small as 300mm2.

The company has announced plans to expand its product portfolio to support future members of the i.MX 8M family.

The PMIC is sampling now, with OEM quantities expected in August 2019.

https://www.rohm.com

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Murata and Cypress develop battery saving Wi-Fi-Bluetooth module

Fri, Apr 26, 2019

A collaboration between Murata and Cypress Semiconductor has led to the development of small form factor Wi-Fi and Bluetooth module. The Type 1LV (CYW43012) module is claimed to be the lowest power, small form factor Wi-Fi and Bluetooth module and to improve battery life in wearables, smart home products, and portable audio applications.

It is based on the Cypress CYW43012 combo chipset, the small dual-band Wi-Fi 11a/b/g/n/ (11ac Friendly) +Bluetooth 5.0 module which provides data transference rates up to 78Mbits per second on Wi-Fi and 3Mbits per second on Bluetooth.

The Type 1LV supports a range of popular processors including PSoC6, i.MX RT, STM32, i.MX, and IP camera platforms, as well as Linux and RTOS-based applications.

The Type 1LV uses enhanced hardware mechanisms and algorithms to ensure that Wi-Fi and Bluetooth co-existence is optimised. An embedded Ipv6 network stack can be used to keep the host processor in sleep mode while maintaining network connections.

The module also supports BLE 2Mbits per second, LE Secure Connections, LE Privacy 1.2, and LE Data Packet Length Extension. The device operates seamlessly in dual-band networks with increased energy efficiency and enhanced security providing optimal performance in Wi-Fi 5 networks, says Murata.

The module measures 10.0 x 7.2 x 1.4mm. It will have a reference antennae design for FCC/IC certifications and CE conducted test to provide a lower development cost and faster time to market.

The Type 1LV module is now in mass production.

http://www.murata.com

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Gecko series 2 scales IoT connectivity

Wed, Apr 24, 2019

SoCs and software in Wireless Gecko series 2, from Silicon Labs, are designed to optimise smart home and industrial IoT (IIoT) applications.  Initial offerings are small form factor SoCs with a dedicated security core and an on-chip radio. According to Silicon Labs, the radio delivers x2.5 the wireless range of competing solutions.

The Wireless Gecko series 2 simplifies IoT product design with integrated SoC options and reusable software that make RF communication more dependable and energy efficient, claims Silicon Labs.

The first products include EFR32MG21 SoCs supporting multi-protocol, Zigbee, Thread and Bluetooth mesh networking, and EFR32BG21 SoCs dedicated to Bluetooth Low Energy and Bluetooth mesh. These SoCs provide line-powered IoT products including gateways, hubs, lights, voice assistants and smart electric meters.

According to the company, the SoCs provide best-in-class RF performance with +20dBm output power and up to +124.5dB link budget. Improved blocking performance enables a robust radio and processing and security are assured with the 80MHz Arm Cortex-M33 core, which has TrustZone technology.

The 40nm process technology yields a low active current SoC (50.9 microA/MHz). The multi-protocol SoCs are in a 4.0 x 4.0mm QFN package.

The company has released some details of future pin- and software-compatible Wireless Gecko Series 2 SoCs and modules, which will have additional dedicated security technologies for connected products with enhanced security features, which is expected to drive mass adoption of the IoT.

Silicon Labs’ Simplicity Studio suite of tools for development support includes a unified wireless development kit, software development kits, energy profiler, patented network analysis, application demos and mobile apps. The Wireless Gecko starter kit mainboard and EFR32xG21 radio boards are also available now.

The EFR32MG21 and EFR32BG21 are available now in sample and production quantities.

http://www.silabs.com

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Renesas launches controller and GaN FET driver for satellites

Tue, Apr 23, 2019

For DC/DC power supplies in small satellites (smallsats) and launch vehicles, Renesas Electronics offers the ISL71043M and ISL71040M, believed to be the first plastic packaged, radiation-tolerant PWM controller and GaN FET driver for small satellite mega constellations in low earth orbit (LEO).

The ISL71043M single-ended current mode PWM controller and the ISL71040M is a low-side GaN FET driver for isolated flyback and half-bridge power stages, and motor control driver circuits in satellite buses and payloads. They meet the need of private ‘new space’ companies launching smallsats to form large constellations operating in multiple LEO planes. Smallsat mega-constellations provide global broadband internet links, as well as high-resolution earth observation imaging for sea, air, and land asset tracking.

The ISL71043M PWM controller provides fast signal propagation and output switching in a small 4.0 x 5.0mm SOIC plastic package, reducing PCB area up to three times compared to competing ceramic packages. The ISL71043’s 5.5mA max supply current reduces power loss by more than a factor of three. The adjustable operating frequency (up to 1 MHz) enables higher efficiency and the use of smaller passive filter components.

The ISL71043M and ISL71040M are characterisation-tested at a total ionising doze (TID) of up to 30krads(Si), and for single event effects (SEE) at a linear energy transfer (LET) of 43MeV•cm2/mg. Both devices operate over an extended temperature range of -55 to +125 degrees C.

The ISL71040M low-side GaN FET driver safely drives Renesas’ rad-hard GaN FETs in isolated topologies and boost type configurations. It operates with a supply voltage between 4.5 and 13.2V, a gate drive voltage (VDRV) of 4.5V, and it includes both inverting and non-inverting inputs. The device’s split outputs adjust the turn-on and turn-off speeds, and its high current source and sink capability enables high frequency operation. The ISL71040M ensures reliable operation when driving GaN FETs by precisely controlling the gate driver voltage to +three to five per cent over temperature and radiation. It also includes floating protection circuitry to eliminate unintentional switching.

The ISL71043M PWM controller and ISL71040M GaN FET driver can be combined with the ISL73024SEH 200V GaN FET or ISL73023SEH 100V GaN FET, and ISL71610M passive-input digital isolator to create a variety of power stage configurations.

http://www.renesas.com

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