ON Semiconductor’s digital image sensor enables AI vision systems

Intelligent vision systems for viewing and artificial intelligence (AI) can be implemented using the low power 0.3Mpixel image sensor announced by ON Semiconductor.

The ARX3A0 digital image sensor has 0.3Mpixel resolution in a 1:1 aspect ratio. It can perform like a global shutter in many conditions, with up to 360 frames per second (fps) capture rate, yet with the size, performance and response levels that relate to being a back-side illuminated (BSI) rolling shutter sensor, explains ON Semiconductor. It has a small size, square format and high frame rate, making it particularly suitable for emerging machine vision, AI and augmented reality/virtual reality (AR/VR) applications, as well as small supplemental security cameras.

To meet the demands of applications that provide still or streaming images, the ARX3A0 is designed to deliver flexible, high-performance image capture with minimal power. It consumes less than 19mW when capturing images at 30 frames per second, and just 2.5mW when capturing one frame per second.

The 1/10 in square format enables low height modules and the 3.5 mm die size helps maximise the sensor’s field of view. It can therefore be used in emerging applications where orientation is not fixed but space is limited, such as AR/VR goggles, monitoring the wearer’s eye movement. Eye movement data can be used to adjust the image viewed and possibly mitigate motion sickness. Another application is simultaneous localisation and mapping (SLAM), which can also capitalise on the ARX3A0’s size and low power.

The monochrome sensor is based on a 560 by 560 active-pixel array featuring ON Semiconductor’s NIR+ technology, giving it high sensitivity at near IR wavelengths for performance in no-light conditions or when lighting is used that is non-detectable by the human eye.

Power management features include the ability to automatically wake from a low power mode when detecting motion or lighting changes in the scene. This allows the sensor to become the main source of wake for an entire camera system saving even more system power.

Gianluca Colli, vice president and general manager, Consumer Solution Division of Image Sensor Group at ON Semiconductor said: “As we approach an era where AI is becoming an integral part of vision-based systems, it becomes clear that we now share this world with a new kind of intelligence. The ARX3A0 has been designed for that new breed of machine, where vision is as integral to their operation as it is ours.”

The ARX3A0 is available in both chip scale package and reconstructed wafer die. Evaluation boards running on ON Semiconductor’s industry leading PC-based DevWare system and prototype modules are also available through ON Semiconductor and authorised distributors.

http://www.onsemi.com

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Power Integrations introduces GaN to LYTSwitch drivers

The latest members of Power Integrations’ LED driver ICs, the LYTSwitch-6 family, use PowiGaN technology to enable designs that deliver up to 110W with 94% conversion efficiency using a simple, flexible flyback topology.

The high efficiency eliminates the need for heatsinks, reducing ballast size, weight and cooling airflow requirements, says Power Integrations. The 750V PowiGaN primary switches provide very low RDS (on) and reduced switching losses, increasing power conversion efficiency by up to three per cent compared to conventional solutions and reducing wasted heat by more than one-third.

LYTSwitch-6 ICs with PowiGaN technology employ lossless current sensing. They retain existing LYTSwitch-6 characteristics, such as fast transient response for cross regulation for parallel LED strings without the need for additional regulator hardware, and flicker-free system operation, says the company. This allows simple implementation of a pulse width modulation (PWM) dimming interface.

The LYTSwitch-6 ICs with PowiGaN technology enable designs up to 110W for smart residential and commercial fixtures and low-profile ceiling troffers. The high power density enables reduced height and weight, which is vital for space-constrained and sealed ballast applications.

The GaN-based LYTSwitch-6 LED-driver ICs are available now. A reference design (DER-801) is also available, describing a 100W three-way dimming LED ballast.

Power Integrations specialises in semiconductor technologies for high-voltage power conversion, with products that are key building blocks in the clean-power ecosystem, enabling the generation of renewable energy as well as the efficient transmission and consumption of power in applications ranging from mW to MWs.

http://www.power.com

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ON Semiconductor uses PoE to meet IoT endpoints’ power demands

Using the new IEEE 802.3bt standard, Power over Ethernet (PoE) can be used to deliver high-speed connectivity up to 90W of power over local area network (LAN) connections. ON Semiconductor has announced that controllers and MOSFETs not only support the new standard power limit, but extends it further to 100W for systems including telecommunications and digital signage.

The IEEE 802.3bt standard for PoE enables more sophisticated endpoints operating across larger networks, explains ON Semiconductor. The IEEE 802.3bt standard optimises energy management through the new Autoclass feature, which enables powered devices (PDs) to communicate specific power needs to the power sourcing equipment (PSE). This in turn allows each PSE to allocate just the right amount of power to each PD, maximising both the available energy and bandwidth.

Three times the power is available with IEEE 802.3bt (90W, compared to the 30W provided by the IEEE 802.at standard, or PoE+). IEEE 802.3bt can provide both power and connectivity to new applications that would otherwise require a dedicated and typically off-line power source. PoE will simplify network topologies and provide a more robust plug-and-play user experience, explains ON Semiconductor.

ON Semiconductor offers the NCP1095 and NCP1096 interface controllers. Both incorporate all of the features needed to implement a PoE interface, including detection, auto-classification and current limiting. The controllers employ either an external (NCP1095) or internal (NCP1096) hot-swap FET. The integrated hot-swap FET in the NCP1096 features the lowest on-resistance available in a Type 3 or Type 4 PoE controller

The controllers are complemented by the NCP1566 DC/DC controller, the FDMC8622 single MOSFET and the FDMQ8203 and FDMQ8205A GreenBridge Quad MOSFETs. These have been developed to provide a more efficient alternative to a diode bridge in PoE applications. Together, these devices enable highly efficient PoE interfaces with up to the standard limit of 90W or to a proprietary 100W.

The company believes it offers a complete family of IEEE 802.3bt-compliant products, to make the technology more accessible and enable more connected devices with guaranteed interoperability.

“PoE is one of the fastest-growing markets for power semiconductors today, with a compound average unit growth rate of 14 per cent expected from 2017 through to 2022,” said Kevin Anderson, senior analyst, power semiconductors at business information provider IHS Markit. “The additional power-delivery capability defined in IEEE 802.3bt enables new applications, such as higher-powered connected lighting, networked high-resolution surveillance cameras and high-performance wireless access points.”

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GigaDevice claims a first for open source RISC-V based 32-bit mcu

Believed to be the world’s first open source RISC-V based GD32V series 32-bit general purpose microcontroller (MCU), the GD32 family is announced by GigaDevice. The company says it offers tool chain support from MCU to software libraries and development boards, creating a strong RISC-V development ecosystem.

The first product line in the family is the GD32VF103 series RISC-V MCU. It is designed for mainstream development, says GigaDevice. There are 14 models, including QFN36, LQFP48, LQFP64 and LQFP100, compatible with existing GD32 MCUs in software development and pin packaging.

According to GigaDevice, the design accelerates the development cycle between GD32’s Arm core and RISC-V core products, making product selection and code porting flexible and simple. The GD32VF103 devices are specifically targeted for embedded applications ranging from industrial control, consumer electronics, IoT, edge computing to artificial intelligence and deep learning.

The GD32VF103 MCU series adopts the Bumblebee processor core based on the open source RISC-V instruction set architecture, jointly developed by GigaDevice and Nuclei System Technology. The Bumblebee core uses a 32-bit RISC-V open source instruction set architecture and supports custom instructions to optimise interrupt handling. It is equipped with a 64-bit wide real-time timer and can also generate timer interrupts defined by the RISC-V standard, with support of dozens of external interrupt sources, while possessing 16 interrupt levels and priorities, interrupt nesting and fast vector interrupts processing mechanism.

The low-power management unit can support two-levels of sleep mode. The core supports standard JTAG interfaces and RISC-V debug standards for hardware breakpoints and interactive debugging. The Bumblebee core supports the RISC-V standard compilation tool chain, as well as Linux/Windows graphical integrated development environment.

The core is designed with a two-stage variable-length pipeline microarchitecture with a streamlined dynamic branch predictor and instruction pre-fetch unit. The performance and frequency of the traditional architecture three-stage pipeline can be achieved at the cost of the two-stage pipeline, achieving industry-leading energy efficiency and cost advantages, claims GigaDevice.

The GD32VF103 MCU operates at up to 153DMIPS at the highest frequency and under the CoreMark test achieves 360 performance points. This is a 15 per cent performance improvement compared to the GD32 Cortex-M3 core. Dynamic power consumption is reduced by 50 per cent and the standby power consumption is reduced by 25 per cent, adds the company.

The GD32VF103 series RISC-V MCUs provide a processing frequency of 108MHz, 16kbyte to 128kbyte of on-chip flash and 6 to 32kbyte of SRAM cache, equipped with the gFlash patented technology, which supports high-speed core accesses to flash in zero wait time. The core also includes a single-cycle hardware multiplier, hardware divider and acceleration unit for advanced computing and data processing challenges.

The chip is powered by 2.6 to 3.6V and the I/O ports can withstand 5V voltage level. It is equipped with a 16-bit advanced timer supporting three-phase PWM complementary outputs and Hall acquisition interface for vector control. It also has up to four 16-bit general-purpose timers, two 16-bit basic timers, and two multi-channel DMA controllers. The interrupt controller (ECLIC) provides up to 68 external interrupts and can be nested with 16 programmable priority levels to enhance the real-time performance of high-performance control.

Peripheral resources include up to three USART, two UART, three SPI, two I2C, two I2S, two CAN2.0B, one USB 2.0 FS OTG and an External Bus Expansion Controller (EXMC). The I2C interface supports Fast Plus (Fm+) mode with frequencies up to 1MHz (1Mbits per second), which is two times faster than the previous speed, says GigaDevice. The SPI also supports four-wire system and more transmission modes, including the easy expansion to Quad SPI for high-speed NOR Flash accesses. The USB 2.0 FS OTG interface provides multiple modes such as device, host, and OTG, while the EXMC connects to external memory such as NOR Flash and SRAM.

The GD32VF103 series RISC-V MCUs also integrate two 12-bit high-speed ADCs with sampling rates up to 2.6Msamples per second, provides up to 16 reusable channels, supports 16-bit hardware oversampling filtering and resolution configurability and it has two 12-bit DAC. Up to 80 per cent of GPIOs have optional features and support port remapping.

http://www.gigadevice.com

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