Smart transceiver supports LonWorks and BACnet protocols

Multiple protocols can be used on the same network to simplify automation and control networks. According to Adesto Technologies, the FT 6050 smart transceiver’s ability to support LON, LON/IP, BACnet/IP and BACnet MS/TP protocol stacks to “revolutionise field integration for building automation and industrial control applications”.

The FT 6050 smart transceiver system on chip (SoC) enables the popular LON and BACnet industrial protocols to communicate simultaneously over the reliable and widely adopted Free Topology (FT) channel.

Adesto’s FT 6050 smart transceiver allows  BACnet workstations and LON network manager and integrator tools to natively field-configure, provision and monitor controllers as either LON or BACnet devices, or both. This enables a flexible architecture and takes advantage of the easy to install, fault tolerant and scalable FT media, points out Adesto. For OEMs, the FT 6050 can enable differentiated architectures with fewer SKUs needed in inventory. It also makes the integrator’s job easier and more flexible for both retrofits and new installations, adds the company.

The FT 6050 provides a uniform management architecture that can share data across networks and also externally to cloud systems. Adesto says it will continue to roll out further FT-based innovations across its edge devices and embedded IoT platform, exploiting the ease of interoperability between devices and integration to IoT and cloud systems.”

The FT 6050 smart transceiver SoC is supported in both LON and BACnet configurations by Adesto’s SmartServer IoT, an open and extensible industrial edge server that supports multiple protocols and applications. It enables the convergence of diverse systems into a single edge networking and compute platform.

Enhancements to the FT 6050 include native support for all BACnet features. There are also improvements to the memory architecture to allow for larger, higher fidelity applications, enabling creation of extensive systems. The FT 6050 is supported by  the SmartServer IoT’s BACnet and LON router and network managers, IzoT Net Server, an open platform software for creating and managing a network of devices and the IzoT Commissioning Tool, a GUI for creating a device network.

http://www.adestotech.com

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Skyline RFID inlays and tags can be used on metal

Rain radio frequency identification (RFID) inlays can be used on metal surfaces for and have a reading range of 6m.

The Skyline Rain RFID inlays and tags have an optimised antenna and spacer-based design. A customised ultra high frequency (UHF) inlay is based on NXP’s UCODE 7xm IC with 448-bit EPC memory and extended user memory of 2kbits. The resulting transponder is then folded and applied around a synthetic spacer developed and provided by identytag of Bad Berleburg, Germany.

The advanced antenna design, the IC’s long read range and reliable operation in dense reader and noisy environments through high interference rejection, as well as  optimised spacer material result in an on-metal read range in a compact tag, with a die-cut size of 54 x 25 x 1.8mm.

The inlay is permanently attached to the spacer and a layer of strong and resilient RA-33 adhesive is applied. According to Smartrac, this provides “excellent adhesion” to a range of surfaces. As a finished tag, Skyline’s surface is printable with thermal transfer printers.

The RFID tag can be used for tracking metallic assets, items and components in industrial environments such as automotive, mechanical engineering and aviation. Smartrac’s Skyline inlays and tags comply with VDA recommendations for the automotive industry and supported by the leading automation companies globally.

Smartrac and identytag completed initial product volumes and will be ramping up production in the second half of the year 2019.

Smartrac provides both ready-made and customised products. It makes products smart and enables businesses to digitise, identify, authenticate, track and complement products. Products are used in a wide array of applications such as animal identification, automation, automotive, brand protection, customer experience, industry, library and media management, logistics, retail and supply chain management.

Based in Amsterdam, the Netherlands, Smartac has research and development centres, production and a sales network, complemented by the IoT platform, Smart Cosmos. Smartrac embeds intelligence into physical products for an ecosystem of connected things. The company has also received ARC Quality Certification from Auburn University’s RFID Lab for the design and manufacturing of its RFID inlays.

http://www.smartrac-group.com

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Microchip reduces power needs for AI functions

Compute power for artificial intelligence (AI) inference at the edge is reduced, says Microchip, when using the memBrain neuromorphic memory technology.

AI processing is moving from the cloud to the edge of the network, meaning that battery powered and deeply embedded devices are challenged to perform AI functions, such as computer vision and voice recognition.

Via its subsidiary, Silicon Storage Technology (SST), Microchip offers the memBrain which is based on SuperFlash technology and optimised to perform vector matrix multiplication (VMM) for neural networks. The memory technology is claimed to improve system architecture implementation of VMM through an analogue in-memory compute approach, which, in turn, is claimed to enhance AI inference at the edge.

Current neural net models may require 50M or more synapses (weights) for processing which can challenge off-chip DRAM bandwidths, causing a bottleneck for neural net computing and an increase in overall compute power. The memBrain stores synaptic weights in the on-chip floating gate, which significantly improves system latency, says Microchip. Compared to traditional digital DSP and SRAM/DRAM based approaches, it delivers 10 to 20 times lower power and “significantly reduced overall bill of materials (BOM)”.

The memBrain is expected to advance machine learning (ML) capacities in edge devices, with reduced power in memory compute operations in AI.

SST will present Microchip’s memBrain product tile array-based architecture at the AI/ML session track on flash performance scaling at the 2019 Flash Memory Summit this week (6 to 8 August 2019) at the Santa Clara Convention Center in Santa Clara, California, USA.

SST offers design services for memBrain and SuperFlash technology and a software toolkit for neural network model analysis.

Silicon Storage Technology provides embedded flash technology in addition to developing, designing, licensing and markets proprietary and patented SuperFlash memory technology for the consumer, industrial, automotive and IoT markets.

SST was founded in 1989 and acquired by Microchip in April 2010 and is now a wholly owned subsidiary of Microchip.

http://www.microchip.com

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Microchip presents serial memory controller for AI and ML

Microchip has entered the memory infrastructure market, offering what it claims to be the first commercially serial memory controller for artificial intelligence (AI) and machine learning (ML).

The SMC 1000 8x25G enables four times the memory channels of parallel-attached DDR4 DRAM and low latency, says Microchip. It has been introduced as the computational demands of AI and ML workloads accelerate, highlighting the shortfall in DRAM, which require an increased number of memory channels to deliver more memory bandwidth.

The SMC 1000 8x25G enables CPUs and other compute-centric SoCs to use four times the memory channels of parallel attached DDR4 DRAM within the same package footprint. This enables serial memory controllers to deliver higher memory bandwidth and media independence to these compute-intensive platforms with low latency.

As the number of processing cores within CPUs has risen, the average memory bandwidth available to each processing core has decreased because CPU and SoC devices cannot scale the number of parallel DDR interfaces on a single chip to meet the needs of the increasing core count. The SMC 1000 8x25G interfaces to the CPU via 8-bit Open Memory Interface (OMI)-compliant 25Gbits per second lanes and bridges to memory via a 72-bit DDR4 3200 interface. This formation reduces the required number of host CPU or SoC pins per DDR4 memory channel “significantly”, says Microchip, allowing for more memory channels and increased memory bandwidth.

The SMC 1000 8x25G is the first memory infrastructure product in Microchip’s portfolio that enables the media-independent OMI.

Data centre application workloads require OMI-based differential dual-inline memory modules (DDIMMs) to deliver the same high-performance bandwidth and low latency results of today’s parallel-DDR based memory products. The low latency of the SMC 1000 8x25G delivers less than four nanoseconds incremental latency to the first DRAM data access and identical subsequent data access performance, reports Microchip. OMI-based DDIMM products have virtually identical bandwidth and latency performance to comparable LRDIMM products, concludes the company.

A CPU or SoC with OMI support can use various types of media, allowing designers to select appropriate cost, power and performance metrics without having to integrate a unique memory controller for each type. Microchip points out that CPU and SoC memory interfaces today are typically locked to specific DDR interface protocols, such as DDR4, at specific interface rates.

SMART Modular, Micron and Samsung Electronics are building multiple pin-efficient 84-pin DDR4 DDIMMs with capacities ranging from 16 to 256Gbyte. These DDIMMs will leverage the SMC 1000 8x25G and will seamlessly plug into any OMI-compliant 25Gbits per second interface, Microchip advises.

The SMC 1000 is supplied with ChipLink diagnostic tools that provide extensive debug, diagnostics, configuration and analysts tools with an intuitive graphics user interface (GUI).

The SMC 1000 8x25G is sampling now.

http://www.microchip.com

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