ICs & Semiconductors Archives - Page 194 of 235

Bluetooth low energy module from u-blox includes direction finding

Thu, Oct 31, 2019

Features such as direction finding, long range and operation up to +105 degrees C make up the u-blox NINA-B4 series of standalone modules. They are designed for indoor positioning applications and for deployments in harsh environments.

The u-blox NINA-B4 Bluetooth low energy modules are based on Nordic Semiconductor’s recently announced nRF52833 chip. The module enables Bluetooth long range, Bluetooth mesh, and Bluetooth direction finding for applications in the connected industry, smart homes, buildings, and cities, asset tracking, and healthcare.

Bluetooth’s new direction finding feature, part of the Bluetooth v5.1 specification, brings the benefits of high precision positioning to indoor applications, says u-blox. NINA-B4 is the first u-blox module designed to act as both a transmitter and a receiver in angle of arrival (AoA) and angle of departure (AoD) direction finding and indoor positioning applications.

In AoA-based implementations, stationary beacons equipped with multi-antenna arrays determine the angle of arrival of signals emitted by a tracking device to pinpoint the tracker’s location with sub-meter level accuracy. When AoD is used, the tracking device triangulates its position by calculating the angle of departure of signals from the stationary Bluetooth beacons’ multi-antenna arrays.

The NINA-B4 enables wireless mesh networks for robust communication between large numbers of connected devices. The networks relay messages from node to node and, by simplifying the control of groups of devices, can be used in smart lighting systems in cities and buildings. These applications also further benefit from the module’s enhanced operating temperature range (up to +105 degrees C).

Bluetooth long range is also a feature for the NINA-B4 series, making it suitable for deployments in harsh environments, e.g. to enable wirelessly connected and configurable equipment. Long range not only increases the distance that Bluetooth signals can travel in undisturbed environments, it also makes communications more robust and reliable in unfavourable ones, such as in production plants or on factory floors.

The NINA-B4 series is supplied with u-blox u‑connect software. It provides an interface to configure the required connectivity to integrate Bluetooth into new and existing products.

There is also a powerful Arm Cortex-M4F microcontroller with an open CPU architecture. This allows customers to run their own applications right on the module. Supporting Zigbee and Thread, the first members of the NINA-B4 family have an internal PCB antenna, or alternatively, are supplied with a U.FL connector for an external antenna of choice.

Samples of the NINA-B4 will be available in December.

http://www.u-blox.com

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Winbond exploits HyperRAM for AIoT

Thu, Oct 31, 2019

The artificial intelligence of things (AIoT) will consist of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices, all of which will require new functionality in terms of size, power consumption, and performance. New microcontrollers are being developed to meet these demands with higher performance and lower power consumption and with new RAM options to improve that of the existing SDRAM and pSRAM available.

HyperRAM supports the HyperBus interface and Winbond Electronics offers 32, 64 and 128Mbit devices. Hans Liao, technology manager of DRAMs at Winbond, explained that the computing power, data processing and image display functions of traditional MCUs are limited and that the new IoT devices often have touch panel as image control interface, or require stronger edge computing functions for image processing and speech recognition, requiring higher performance, lower power microcontrollers.

Winbond’s 64Mbit HyperRAM consumes 90 microW at 1.8V, which is about half of a DRAM of the same capacity, claims the company. The power consumption of HyperRAM is only 45 microW at 1.8V in hybrid sleep mode – as opposed to the standby mode of an SDRAM. A low power SDRAM has a larger form factor than HyperRAM, says Winbond.

In addition, HyperRAM has only 13 signal pins, which can greatly simplify the PCB layout design. It also means that when designing end products, developers can use microcontrollers with more pin-out for other purposes or use microcontrollers with fewer pins for cost-effectiveness.

Simplifying control interface is another feature of HyperRAM. Based on pSRAM architecture, HyperRAM is a self-refresh RAM. It can automatically return to standby mode. This means system memory is easier to use, and the development of firmware and drivers is also simplified, says Winbond.

Winbond’s HyperRAM is based on a 38nm process node, which will continue to move toward 25nm, confirms Winbond.

Winbond’s entry to the HyperRAM camp makes it the third supplier, in addition to Cypress and ISSI. Its 32Mbit device has entered mass production, the 64 and 128Mbit are expected to enter mass production in 4Q19 and 1Q20 respectively. Products of 24BGA (automotive grade), 49BGA and KGD are available. The size of 24BGA is 6.0 x 8.0mm², while the 49BGA is only 4.0 x 4.0mm², which targets the consumer wearable market.

http://www.Winbond.com

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Volkswagen and NXP begin on the road to V2X

Wed, Oct 30, 2019

NXP Semiconductors is rolling out its RoadLink V2X (vehicle to everything) communication system in the new Volkswagen Golf. The eighth generation Golf is the first volume European car model equipped with V2X, reports NXP.

V2X can prevent accidents by allowing cars to communicate with each other, independent of car brands and without the support of cellular infrastructure.

Dr. Johannes Neft, head of vehicle body development at Volkswagen, said:“The introduction of V2X, together with traffic infrastructure providers and other vehicle manufacturers, is a major milestone in [safety].”

Torsten Lehman, senior vice president and general manager of Driver Assistance and Infotainment at NXP, added: “After proving our technology in more than one million test days globally, we are pleased that our RoadLINK technology, developed in cooperation with Cohda Wireless, was chosen to enable new levels of safety in Europe’s most popular car model, the new Golf.”

Wi-Fi-based V2X is a mature technology has been tested for more than 10 years. Wi-Fi is available independently of paid cellular services and other developing cellular-based technologies can be added to Wi-Fi-based V2X .

Wi-Fi-based V2X is robust, has low latency and real-time communication – regardless of any car brands, advocates NXP. It enables awareness and communication between cars, road infrastructure like traffic lights or street signs, and other road users such as cyclists and pedestrians.

The technology is collaborative, allowing it to “tap into” surrounding sensor data from mutually equipped cars to warn of hazards and prevent accidents. V2X complements other ADAS sensing technologies such as radar, lidar and cameras.

It helps vehicles to “see” more than a mile ahead and around corners to provide early warning of obstacles, hazards, and road conditions and has the ability to “see” through objects, delivering more information than that obtained through line of sight only, continues NXP. Its sensing capabilities are unaffected by poor weather conditions.

NXP claims to offer the only 5.9 GHz V2X system solution proven in volume production today.

NXP and Volkswagen have collaborated for standardisation of V2X communication that addresses cybersecurity and privacy protection.

http://www.nxp.com

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Renesas adds IP to include 7nm process and Ethernet TSN

Mon, Oct 28, 2019

Additional IP now available from Renesas Electronics includes a 7nm process ternary content addressable memory (TCAM) and standard Ethernet time sensitive networking (TSN) IP.

Customers will have access to IPs such as advanced 7nm (nanometer) SRAM and TCAM, and leading-edge standard Ethernet time-sensitive networking (TSN) IP, says the company, which is also working on providing a system IP which includes processing in memory (PIM) for use as an artificial intelligence (AI) accelerator. Customers can use these IPs to jump start semiconductor device development projects, such as the development of next-generation AI chips or ASICs for 5G networks.

Customers developing custom chips can leverage the IP in the subsystem, or those using FPGA devices can use it to speed up software development while they focus resources on specialty areas to reduce development time. Customers who prefer to use existing software assets can take advantage of Renesas IP assets to achieve more efficient system development by reducing the resources required to develop, verify and evaluate software and boards.

“Model-based design enables a development process in which IP models can be easily shared across the supply chain, giving customers the ability to identify system issues before implementation,” said Paul Barnard, director, Product Marketing at MathWorks. “To do this, Renesas provides customers with models of their IP in Simulink, as well as tools that extend Simulink to support the deployment of algorithms from models to Renesas microprocessors with verification support using processor-in-the-loop (PIL) technology.” He believes the partnership with Renesas will benefit mutual customers working on sectors as varied as automotive, robotics and industrial technologies.

To support customers’ semiconductor development efforts, Renesas has also established a network of partner companies to support users. This network includes design houses that perform contract semiconductor design and technology partners who will provide software and middleware tools. The network will accelerate users’ technology innovations and product development efforts by lowering the barriers to entry for semiconductor device and FPGA development. Renesas can also introduce experienced users to model-based design development environments.

The Renesas IP license portfolio has been available since September 2018, offering access to more than 40 licenses, including CPU cores, timer IP for motor applications, USB cores, and SRAM.

Renesas aims to exceed IP sales annual market growth rate of 10 per cent, and will expand the provision of IP and support system while creating new, and expanding old, IP markets.

http://www.renesas.com

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Bluetooth low energy module from u-blox includes direction finding

Winbond exploits HyperRAM for AIoT

Volkswagen and NXP begin on the road to V2X

Renesas adds IP to include 7nm process and Ethernet TSN

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