ICs & Semiconductors Archives - Page 194 of 230

ON Semiconductor’s digital image sensor enables AI vision systems

Thu, Sep 12, 2019

Intelligent vision systems for viewing and artificial intelligence (AI) can be implemented using the low power 0.3Mpixel image sensor announced by ON Semiconductor.

The ARX3A0 digital image sensor has 0.3Mpixel resolution in a 1:1 aspect ratio. It can perform like a global shutter in many conditions, with up to 360 frames per second (fps) capture rate, yet with the size, performance and response levels that relate to being a back-side illuminated (BSI) rolling shutter sensor, explains ON Semiconductor. It has a small size, square format and high frame rate, making it particularly suitable for emerging machine vision, AI and augmented reality/virtual reality (AR/VR) applications, as well as small supplemental security cameras.

To meet the demands of applications that provide still or streaming images, the ARX3A0 is designed to deliver flexible, high-performance image capture with minimal power. It consumes less than 19mW when capturing images at 30 frames per second, and just 2.5mW when capturing one frame per second.

The 1/10 in square format enables low height modules and the 3.5 mm die size helps maximise the sensor’s field of view. It can therefore be used in emerging applications where orientation is not fixed but space is limited, such as AR/VR goggles, monitoring the wearer’s eye movement. Eye movement data can be used to adjust the image viewed and possibly mitigate motion sickness. Another application is simultaneous localisation and mapping (SLAM), which can also capitalise on the ARX3A0’s size and low power.

The monochrome sensor is based on a 560 by 560 active-pixel array featuring ON Semiconductor’s NIR+ technology, giving it high sensitivity at near IR wavelengths for performance in no-light conditions or when lighting is used that is non-detectable by the human eye.

Power management features include the ability to automatically wake from a low power mode when detecting motion or lighting changes in the scene. This allows the sensor to become the main source of wake for an entire camera system saving even more system power.

Gianluca Colli, vice president and general manager, Consumer Solution Division of Image Sensor Group at ON Semiconductor said: “As we approach an era where AI is becoming an integral part of vision-based systems, it becomes clear that we now share this world with a new kind of intelligence. The ARX3A0 has been designed for that new breed of machine, where vision is as integral to their operation as it is ours.”

The ARX3A0 is available in both chip scale package and reconstructed wafer die. Evaluation boards running on ON Semiconductor’s industry leading PC-based DevWare system and prototype modules are also available through ON Semiconductor and authorised distributors.

http://www.onsemi.com

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Synopsys claims industry’s first CXL IP for data-intensive SoCs

Thu, Sep 12, 2019

Low latency and high bandwidth are assured for artificial intelligence (AI), memory expansion and cloud computing, says Synopsys at the introduction of its DesignWare Compute Express Link (CXL) IP.

It is, according to Synopsys, the industry’s first CXL IP for data-intensive system of chips (SoCs). The IP suite consists of controller, PHY, and verification IP for AI, memory expansion, and high-end cloud computing system-on-chips (SoCs). The CXL protocol enables low-latency data communication between the SoC and general-purpose accelerators, memory expanders, and smart I/O devices requiring high-performance, heterogenous computing for data-intensive workloads. The DesignWare CXL IP is compliant with the CXL 1.1 specification and supports all three CXL protocols (CXL.io, CXL.cache, CXL.mem) and device types to meet specific application requirements.

The CXL IP is built on Synopsys’ DesignWare IP for PCI Express 5.0, which has been adopted by semiconductor companies across all key market segments, reports the company.

“Compute Express Link is a key enabler for next-generation heterogeneous computing architectures, where CPUs and accelerators work together to deliver the most advanced solutions,” said Dr. Debendra Das Sharma, Intel Fellow and director of I/O Technology and Standards at Intel.

Synopsys’ DesignWare CXL Controller helps designers achieve timing closure at 1GHz and provides a robust 512-bit architecture that supports x16 links for maximum CXL bandwidth. The CXL controller offers reliability, availability, serviceability (RAS) capabilities to help maintain data reliability, as well as successfully debug and resolve linkup issues. The 32GTerabytes per second PHY allows more than 36dB channel loss across power, voltage and temperature (PVT) variations for long-reach applications. The VC Verification IP for CXL verifies I/O, memory access, and coherency protocol features with built-in sequences, checks, and coverage for all link configurations up to 16 lanes and 32GTbytes per second data rates. SystemVerilog test suites for CXL accelerate verification closure and are available as source code.

Synopsys’ 32G PHY IP for CXL is available now in 16-, 10-, and 7nm FinFET processes. The CXL Controller and VC Verification IP for CXL are available now.

http://www.synopsys.com/designware

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Power Integrations introduces GaN to LYTSwitch drivers

Mon, Sep 09, 2019

The latest members of Power Integrations’ LED driver ICs, the LYTSwitch-6 family, use PowiGaN technology to enable designs that deliver up to 110W with 94% conversion efficiency using a simple, flexible flyback topology.

The high efficiency eliminates the need for heatsinks, reducing ballast size, weight and cooling airflow requirements, says Power Integrations. The 750V PowiGaN primary switches provide very low RDS (on) and reduced switching losses, increasing power conversion efficiency by up to three per cent compared to conventional solutions and reducing wasted heat by more than one-third.

LYTSwitch-6 ICs with PowiGaN technology employ lossless current sensing. They retain existing LYTSwitch-6 characteristics, such as fast transient response for cross regulation for parallel LED strings without the need for additional regulator hardware, and flicker-free system operation, says the company. This allows simple implementation of a pulse width modulation (PWM) dimming interface.

The LYTSwitch-6 ICs with PowiGaN technology enable designs up to 110W for smart residential and commercial fixtures and low-profile ceiling troffers. The high power density enables reduced height and weight, which is vital for space-constrained and sealed ballast applications.

The GaN-based LYTSwitch-6 LED-driver ICs are available now. A reference design (DER-801) is also available, describing a 100W three-way dimming LED ballast.

Power Integrations specialises in semiconductor technologies for high-voltage power conversion, with products that are key building blocks in the clean-power ecosystem, enabling the generation of renewable energy as well as the efficient transmission and consumption of power in applications ranging from mW to MWs.

http://www.power.com

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ON Semiconductor uses PoE to meet IoT endpoints’ power demands

Thu, Sep 05, 2019

Using the new IEEE 802.3bt standard, Power over Ethernet (PoE) can be used to deliver high-speed connectivity up to 90W of power over local area network (LAN) connections. ON Semiconductor has announced that controllers and MOSFETs not only support the new standard power limit, but extends it further to 100W for systems including telecommunications and digital signage.

The IEEE 802.3bt standard for PoE enables more sophisticated endpoints operating across larger networks, explains ON Semiconductor. The IEEE 802.3bt standard optimises energy management through the new Autoclass feature, which enables powered devices (PDs) to communicate specific power needs to the power sourcing equipment (PSE). This in turn allows each PSE to allocate just the right amount of power to each PD, maximising both the available energy and bandwidth.

Three times the power is available with IEEE 802.3bt (90W, compared to the 30W provided by the IEEE 802.at standard, or PoE+). IEEE 802.3bt can provide both power and connectivity to new applications that would otherwise require a dedicated and typically off-line power source. PoE will simplify network topologies and provide a more robust plug-and-play user experience, explains ON Semiconductor.

ON Semiconductor offers the NCP1095 and NCP1096 interface controllers. Both incorporate all of the features needed to implement a PoE interface, including detection, auto-classification and current limiting. The controllers employ either an external (NCP1095) or internal (NCP1096) hot-swap FET. The integrated hot-swap FET in the NCP1096 features the lowest on-resistance available in a Type 3 or Type 4 PoE controller

The controllers are complemented by the NCP1566 DC/DC controller, the FDMC8622 single MOSFET and the FDMQ8203 and FDMQ8205A GreenBridge Quad MOSFETs. These have been developed to provide a more efficient alternative to a diode bridge in PoE applications. Together, these devices enable highly efficient PoE interfaces with up to the standard limit of 90W or to a proprietary 100W.

The company believes it offers a complete family of IEEE 802.3bt-compliant products, to make the technology more accessible and enable more connected devices with guaranteed interoperability.

“PoE is one of the fastest-growing markets for power semiconductors today, with a compound average unit growth rate of 14 per cent expected from 2017 through to 2022,” said Kevin Anderson, senior analyst, power semiconductors at business information provider IHS Markit. “The additional power-delivery capability defined in IEEE 802.3bt enables new applications, such as higher-powered connected lighting, networked high-resolution surveillance cameras and high-performance wireless access points.”

http://www.onsemi.com

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ON Semiconductor’s digital image sensor enables AI vision systems

Synopsys claims industry’s first CXL IP for data-intensive SoCs

Power Integrations introduces GaN to LYTSwitch drivers

ON Semiconductor uses PoE to meet IoT endpoints’ power demands

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