ICs & Semiconductors Archives - Page 190 of 231

Rugged edge node has processing performance for smart cities

Fri, Nov 01, 2019

A rugged outdoor edge node from Aaeon, Atlas, is built to provide cities with flexible solutions for AI and edge computing. It has the Intel Movidius Myriad X for real-time processing for a range of smart city applications.

It is based on the compact Aaeon NanoCOM-APL board, featuring the Intel Atom x7, providing efficient computing with low power consumption. It is designed with an IP66-rated fanless chassis, for installation on any streetlight, making it easy to quickly set up and deploy, says the company. Connectivity is via Wi-Fi, Gigabit Ethernet, or even 4G/LTE for flexible communication within an edge network or with a central cloud server. The Aaeon Atlas also features built-in cameras and sensors for data collection and analysis.

An embedded Intel Movidius Myriad X vision processing unit (VPU) provides a low-power, high-performance solution for on-device AI inference. The Atlas is compatible with the Intel Distribution of OpenVINO toolkit, which includes optimisation and hardware acceleration to maximise the capabilities of the VPU

As an edge gateway, AEON Atlas can connect with up to 200 smart street lights, providing intelligent control. It has licence plate recognition AI inference to power applications such as smart street parking or detecting traffic violations or accidents. With traffic and congestion monitoring, Aaeon Atlas can optimise traffic signals in real time to help improve traffic flow. Aaeon Atlas can also anonymously detect pedestrians in crowd control and flow monitoring applications.

Established in 1992, Aaeon designs and manufactures professional intelligent IoT solutions. It provides industrial motherboards and systems, industrial displays, rugged tablets, embedded controllers, network appliances and related accessories, as well as integrated solutions. It also has the hardware and services for premier OEM/ODMs and system integrators worldwide. It is an Associate Member of the Intel Internet of Things Solutions Alliance and offers customised end-to-end services from initial product conceptualisation and board product development to mass manufacturing and after-sales service programs.

http://www.aaeon.com

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Evaluation kit supports energy harvesting embedded controller

Fri, Nov 01, 2019

For the development of battery maintenance-free IoT equipment, Renesas Electronics has introduced the RE family, which encompasses the company’s current and future line-up of energy harvesting embedded controllers. The RE Family is based on Renesas’ proprietary Silicon on Thin Buried Oxide (SOTB) process technology. SOTB is claimed to dramatically reduce power consumption in both active and standby states, eliminating the need for battery replacement or recharging.

Following the introduction of the RE01 microcontrollers, the first of the RE family, the RE01 Group evaluation kit is now available to allow users working with the RE01

Hiroto Nitta, senior vice president, Head of SoC Business, IoT and Infrastructure Business Unit at Renesas, said: “We hope this will accelerate the spread of IoT equipment powered by energy harvesting.”

The RE01 evaluation kit includes an evaluation board with an RE01 embedded controller, an interface for the energy harvesting device and a rechargeable battery interface. There is also an Arduino-compatible interface for easy expansion and evaluation of sensor boards and a Pmod connector to expand and evaluate wireless functionality. There is also a low power memory in pixel (MIP) LCD expansion board so that users can evaluate display functions faster. The kit also contains sample code and application notes that serve as references for power management design that eliminates the need for battery maintenance, and driver software that supports CMSIS, Arm’s Cortex Microcontroller Software Interface Standard. Sample code for low power ADCs, digital filter and fast Fourier transform (FFT) routines, 2D graphics MIP LCD displays, and secure boot and secure firmware update functions for improved security are available.

The kit can be used to adopt energy harvesting based on RE01 Group devices at the system level and will accelerate the development of equipment that does not require battery maintenance.

IAR Embedded Workbench for Arm which can use the high efficiency IAR C/C++ compiler, and e2 studio (note 2) which can use the free GNU compiler are available as the developmental environment.

The RE01 evaluation kit is available now.

http://www.renesas.com

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Bluetooth low energy module from u-blox includes direction finding

Thu, Oct 31, 2019

Features such as direction finding, long range and operation up to +105 degrees C make up the u-blox NINA-B4 series of standalone modules. They are designed for indoor positioning applications and for deployments in harsh environments.

The u-blox NINA-B4 Bluetooth low energy modules are based on Nordic Semiconductor’s recently announced nRF52833 chip. The module enables Bluetooth long range, Bluetooth mesh, and Bluetooth direction finding for applications in the connected industry, smart homes, buildings, and cities, asset tracking, and healthcare.

Bluetooth’s new direction finding feature, part of the Bluetooth v5.1 specification, brings the benefits of high precision positioning to indoor applications, says u-blox. NINA-B4 is the first u-blox module designed to act as both a transmitter and a receiver in angle of arrival (AoA) and angle of departure (AoD) direction finding and indoor positioning applications.

In AoA-based implementations, stationary beacons equipped with multi-antenna arrays determine the angle of arrival of signals emitted by a tracking device to pinpoint the tracker’s location with sub-meter level accuracy. When AoD is used, the tracking device triangulates its position by calculating the angle of departure of signals from the stationary Bluetooth beacons’ multi-antenna arrays.

The NINA-B4 enables wireless mesh networks for robust communication between large numbers of connected devices. The networks relay messages from node to node and, by simplifying the control of groups of devices, can be used in smart lighting systems in cities and buildings. These applications also further benefit from the module’s enhanced operating temperature range (up to +105 degrees C).

Bluetooth long range is also a feature for the NINA-B4 series, making it suitable for deployments in harsh environments, e.g. to enable wirelessly connected and configurable equipment. Long range not only increases the distance that Bluetooth signals can travel in undisturbed environments, it also makes communications more robust and reliable in unfavourable ones, such as in production plants or on factory floors.

The NINA-B4 series is supplied with u-blox u‑connect software. It provides an interface to configure the required connectivity to integrate Bluetooth into new and existing products.

There is also a powerful Arm Cortex-M4F microcontroller with an open CPU architecture. This allows customers to run their own applications right on the module. Supporting Zigbee and Thread, the first members of the NINA-B4 family have an internal PCB antenna, or alternatively, are supplied with a U.FL connector for an external antenna of choice.

Samples of the NINA-B4 will be available in December.

http://www.u-blox.com

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Winbond exploits HyperRAM for AIoT

Thu, Oct 31, 2019

The artificial intelligence of things (AIoT) will consist of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices, all of which will require new functionality in terms of size, power consumption, and performance. New microcontrollers are being developed to meet these demands with higher performance and lower power consumption and with new RAM options to improve that of the existing SDRAM and pSRAM available.

HyperRAM supports the HyperBus interface and Winbond Electronics offers 32, 64 and 128Mbit devices. Hans Liao, technology manager of DRAMs at Winbond, explained that the computing power, data processing and image display functions of traditional MCUs are limited and that the new IoT devices often have touch panel as image control interface, or require stronger edge computing functions for image processing and speech recognition, requiring higher performance, lower power microcontrollers.

Winbond’s 64Mbit HyperRAM consumes 90 microW at 1.8V, which is about half of a DRAM of the same capacity, claims the company. The power consumption of HyperRAM is only 45 microW at 1.8V in hybrid sleep mode – as opposed to the standby mode of an SDRAM. A low power SDRAM has a larger form factor than HyperRAM, says Winbond.

In addition, HyperRAM has only 13 signal pins, which can greatly simplify the PCB layout design. It also means that when designing end products, developers can use microcontrollers with more pin-out for other purposes or use microcontrollers with fewer pins for cost-effectiveness.

Simplifying control interface is another feature of HyperRAM. Based on pSRAM architecture, HyperRAM is a self-refresh RAM. It can automatically return to standby mode. This means system memory is easier to use, and the development of firmware and drivers is also simplified, says Winbond.

Winbond’s HyperRAM is based on a 38nm process node, which will continue to move toward 25nm, confirms Winbond.

Winbond’s entry to the HyperRAM camp makes it the third supplier, in addition to Cypress and ISSI. Its 32Mbit device has entered mass production, the 64 and 128Mbit are expected to enter mass production in 4Q19 and 1Q20 respectively. Products of 24BGA (automotive grade), 49BGA and KGD are available. The size of 24BGA is 6.0 x 8.0mm², while the 49BGA is only 4.0 x 4.0mm², which targets the consumer wearable market.

http://www.Winbond.com

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Rugged edge node has processing performance for smart cities

Evaluation kit supports energy harvesting embedded controller

Bluetooth low energy module from u-blox includes direction finding

Winbond exploits HyperRAM for AIoT

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