ICs & Semiconductors Archives - Page 190 of 235

Renesas collaborates with Xilinx on Versal ACAP reference designs

Wed, Dec 18, 2019

Power semiconductors from Renesas and timing solutions from its subsidiary, IDT, support the Xilinx Versal adaptive compute acceleration platform (ACAP) devices featured on the Xilinx VCK190 evaluation kit and the Renesas VERSALDEMO1Z power reference board.

The 7nm process Versal is the industry’s first ACAP platform that addresses applications in data centre, automotive, 5G wireless, and wired and defence markets, says Renesas.

The company provides turnkey clocking and power reference boards that help system developers jumpstart Versal ACAP designs. For developers creating complex, compute-intensive systems that demand flexible and high-performance power delivery and timing, the collaboration has resulted in pre-validated reference designs that allow developers to rapidly develop and optimise system performance and power efficiency.

The Xilinx VCK190 is the first Versal AI Core series evaluation kit. It is based on the VC1902 Versal AI Core series ACAP, providing AI inference and signal processing throughput for cloud, network, and edge applications. The kit features complete timing solutions including the 8A34001 ClockMatrix system synchroniser for IEEE1588 and eCPRI applications, 8T49N240/8T49N241 Universal Frequency Translators for low-jitter and flexible transceiver SerDes clocking, a programmable clock generator and clock buffer/multiplexer for PCIe interface.

The Renesas VERSALDEMO1Z power reference board provides full power rails for the Versal ACAP’s adaptable engines, AI engines, scalar engines, and external DDR memory. The board is a complete power supply solution featuring one member of the ISL68xxx digital multiphase PWM controller family and multiple members of the ISL99xxx smart power stage family to provide high-efficiency and scalable Vcore power. There are also ISL91211A power management IC (PMIC) and DC/DC regulators.

The Renesas VERSALDEMO1Z power reference board is available now from Renesas Electronics.

Renesas Electronics delivers semiconductors that enable billions of connected, intelligent devices, microcontrollers, analogue, power, and SoC products for automotive, industrial, home electronics, office automation, and information communication technology applications.

http://renesas.com

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Microchip delivers early access for RISC-V enables PolarFire SoC FPGAs

Wed, Dec 11, 2019

At this week’s RISC-V Summit in San Jose, California, USA, Microchip has announced an early access program for its PolarFire SoC.

Explaining the reason behind the programme, Microchip cited the trend towards compute-intensive gateways and edge devices which is driving the integration of traditional deterministic control applications with the additional embedded processing capabilities needed for smart and secure connected systems. The early access programme for the PolarFire SoC FPGA offers what is claimed to be the world’s first hardened real-time, Linux-capable, RISC-V-based microprocessor sub-system on the mid-range PolarFire FPGA family. According to Microchip, this brings low power consumption, thermal efficiency and defence-grade security to embedded systems.

Qualified customers can start designing now with Microchip’s Libero SoC 12.3 FPGA design suite and SoftConsole 6.2 integrated development environment (IDE) for the embedded developer. Customers can also debug embedded applications using Renode, a virtual model of the microprocessor sub-system.

The company believes that, in addition to driving innovation in the embedded space, as designers develop a new class of power-efficient applications, there will also be the opportunities to add “unprecedented capabilities” at the edge of the network for communications, defence, medical and industrial automation.

PolarFire SoC delivers power efficiency that is up to 50 per cent lower power than competitive devices in the industry, said Microchip. This reduces the bill of materials by eliminating the need for fans and heat sinks. It is believed to be the first SoC FPGA with a deterministic, coherent RISC-V CPU cluster and a deterministic L2 memory subsystem enabling Linux plus real-time applications.

The support of real-time and rich operating systems such as Linux is part of Microchip’s growing Mi-V RISC-V ecosystem, a comprehensive suite of tools and design resources developed by Microchip and third parties to support RISC-V designs. Ecosystem partners ready to support PolarFire SoC include WindRiver, Mentor Graphics, WolfSSL, ExpressLogic, Veridify, Hex-Five, and FreeRTOS as well as development tools from IAR systems and AdaCore.

http://www.microchip.com

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EERAM retains data despite a power loss

Tue, Dec 03, 2019

Microchip has introduced a family of serial peripheral interface (SPI) EERAM devices that it says offers system designers up to 25 per cent cost savings over the current serial non-volatile RAM (NVRAM) alternatives.

Serial EERAM is a standalone serial SRAM that includes shadow non-volatile back-up. The SPI EERAM family introduces four SPI densities to Microchip’s EERAM portfolio, ranging from 64kbit up to 1Mbit.

They can be used for applications that require repetitive task data-logging and which must be able to automatically restore content if power is disrupted during processing. Target applications range from smart meters to manufacturing lines.

Current low-density (64kbit to 1Mbit) NVRAMs used for these data logs are typically the highest price-per-bit memory in the resulting end products, notes Microchip.

The EERAM standalone non-volatile RAM uses the same SPI and I2C protocols as serial SRAM, enabling devices to retain SRAM content during power loss without using an external battery. All non-volatile parts are invisible to the user. When the device detects power going away, it automatically transfers the SRAM data to non-volatile storage, moving it back to the SRAM once power returns.

In manufacturing lines, for example, stations handle up to millions of tasks over their lifetimes and lost data during a task can require overhauling or discarding items. EERAMs automatically store SRAM content in these settings, allowing the manufacturing line to resume where the task was disrupted.

The primary reason EERAM is available at a lower price point is the use of standard CMOS and flash processes. As the highest volume and most widely used processes and can offer the best reliability and lowest cost in the industry, explains Microchip.

Alternatives such as ferroelectric RAM (FRAM) use a specialty process, which results in higher costs and unstable long-term supply, argues Microchip.

This EERAM family comes with Microchip’s customer-driven obsolescence practice, which helps ensure availability to customers for as long as needed.

The 48L640 (64kbit SPI), 48L256 (256kbit SPI), 48L512 (512kbit SPI) and 48LM01 (1Mbit SPI) devices are available in eight-pin SOIC, SOIJ and DFN packages in volume production.

http://www.microchip.com

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Infineon showcases smart security

Wed, Nov 27, 2019

At Trustech 2019 (26 to 28 November) Infineon is exhibiting its hardware-based security for digital identification and contactless payment.

Firstly, it will be showcasing Secora ID, a Java Card solution optimised for electronic ID. Based on Infineon’s security controllers, Secora ID comes with an operating system targeted to be certified according to highest security standards, standardised applets and a selection of packages. There will be a live demonstration showing how easily it can be integrated into ID projects and adapted to local needs.

For contactless payment systems, Infineon’s new generation of SLC3x security chips are based on a 40nm geometry which provides performance and scalability for a vast array of smart card applications as well as payment wearables. Smart card manufacturers and payment solution providers will benefit from an Arm-based architecture, Infineon’s contactless expertise, creating what Infineon describes as the industry’s most advanced security controller portfolio.

Biometric authentication for drivers is also featured. Infineon and Next have been working on reference platforms since November 2018, working together to accelerate the adoption of biometric smartcards. Next Biometrics’ fingerprint sensor technology for dual interface smart cards uses a secure element from Infineon. The biometric card module developed by Next operates seamlessly throughout the standard ISO/IEC 14443 near field communication (NFC) range.

Smart ticketing will also be represented with Infineon’s standardised ticket and payment solutions. This includes limited use tickets over seasonal and yearly passes to sophisticated versions for multi-application implementations. Infineon has recently become a gold member of the Calypso Network Association (CNA) and been named member of the board of directors of the CAN, underling the company’s commitment to provide a comprehensive transport ticketing portfolio based on open standards.
Infineon will be exhibiting and demonstrating its security products at Trustech 2019 in Cannes, France from 26 to 28 November, booth RIV C 050.

The company will also be presenting on topics such as “Security by Design” or “JAVA Card”.

http://www.infineon.com/security

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Renesas collaborates with Xilinx on Versal ACAP reference designs

Microchip delivers early access for RISC-V enables PolarFire SoC FPGAs

EERAM retains data despite a power loss

Infineon showcases smart security

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