ICs & Semiconductors

Insight SiP launches next generation bluetooth radio in miniature integrated SiP package

Wed, Sep 18, 2024

Insight SiP is launching the ISP2454-MX module in a tiny package measuring 8 x 8 x 1mm, the smallest package on the market. With extended temperature capability up to 105oC, this device can support next generation Bluetooth based solutions including Angle of Arrival and the new Bluetooth Channel Sounding technology. Based on the new Nordic nRF54L15, this offers improved performance across the board, being based on a 4th generation radio and a double speed microprocessor compared with the nRF52 series-based devices, at a lower cost.

This module can support a wide range of solutions, offering a powerful Arm M33F 128Mhz based processor, and advanced security features with ARM Trustzone. Power consumption is improved in both radioactive and sleep modes. Memory capacity is increased with 1.5MB of storage and 256KB RAM, allowing the largest and most sophisticated applications to be run. This enhanced performance is also offered at a cost advantage over nRF52 based devices, making it equally suitable for price sensitive products.

Despite the advanced features of this device, it is released in Insight SiP’s standard 8 x 8 x 1 mm package and offers a fully integrated solution with RF matching and integrated antenna. Both 32MHz and 32 kHz crystals and DC-DC support for each processor are included, meaning it is a fully functioning Bluetooth node only requiring a power supply to operate.

A full range of peripheral connections is available including HS-SPI, SPI, UART, I2S and others. There is also a software programmable peripheral independent 128MHz RISC processor, allowing alternative high-speed peripherals to be supported. As well as supporting BLE, the module can run Zigbee, Thread and other 802.15.4 based protocols, concurrently with BLE. Protocols stacks and applications run on the real time Zephyr operating system which provides a rich suite of drivers and services.

The ISP2454 RF module is designed to run on a coin cell battery if required. Thanks to the module’s ultra-low power consumption and advanced power management system, the battery can last up to several years.

Initial samples are available now. Full production of the modules will start in 2025. Certification is pending. To help product developers, Insight SiP will offer complete development kits together with sample software that provides everything required out of the box to start developing a solution on day one.

https://www.insightsip.com/

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New EnOcean radio transceivers for a quantum leap in performance and efficiency

Wed, Sep 18, 2024

With its latest radio transceiver family, EnOcean is setting new benchmarks in the landscape of wireless technology. The new TCM 600 and TCM 615 devices provide significantly more memory and much higher computation power. At the same time, they reduce energy consumption even further. These new wireless transceivers enable the creation of next generation, differentiated products based on EnOcean technology.
The TCM 615 provides a simple, compact, and cost-effective way to add EnOcean radio communication functionality to OEM customer solutions. It is pin-to-pin compatible with the previous TCM 515 device and uses the same, well-established ESP3 interface protocol. Users can therefore directly upgrade existing designs from TCM 515 to TCM 615 without the need for hardware or software redesign, and thereby immediately benefit from the latest functionality.

With the TCM 600, customers can combine their own application with the latest EnOcean radio communication technology in the same module. This solution is therefore ideal for implementing in space-constrained wireless applications such as ultra-compact relays and dimmers.

TCM 600 and TCM 615 implement the open, industry-leading EnOcean radio communication standard ISO1453-3-10 and ISO14543-3-11. This standard is characterised by high reliability and very low power consumption thanks to the use of small, redundant messages making them ideal for energy harvesting and low power applications.

“With its latest radio transceiver family, EnOcean is underlining its strong commitment to the EnOcean Alliance ecosystem. Both TCM 600 and TCM 615 significantly extend the performance and sustainability envelope and therefore represent an important milestone for sustainable, wireless connectivity. Thanks to their enhanced performance, focus on sustainability and space efficiency, these modules are ideal for the implementation of a wide range of solutions that are both technologically advanced and environmentally conscious,” Kassner summarises.

Samples of TCM 600 and TCM 615 for testing are already available. Volume shipments of TCM 615 will begin end of the year and TCM 600 volume shipments will start early next year

https://www.enocean.com

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SECORA Pay Bio enhances convenience and trust of biometric contactless payment

Tue, Sep 17, 2024

As the payment world moves towards digitalisation, the need to protect digital identities and transactions has never been more important. In addition to standard contactless payment cards, biometric payment cards are a promising development in this area and are gaining in popularity. Against this backdrop, Infineon has announced SECORA Pay Bio, an all-in-one biometric payment card solution that complies with Visa and Mastercard specifications. It integrates Infineon’s enhanced SLC39B system-on-chip (SoC) Secure Element and the FPC1323 sensor by Fingerprint Cards AB (Fingerprints) into the Infineon Biometric Coil on Module (BCoM) package, leveraging the key advantages of inductive coupling technology. The solution uses the fingerprint credentials securely stored on the card as a second authentication factor, enabling a convenient and trusted contactless payment experience.

In an optimistic scenario, ABI Research expects the market for biometric cards to grow to 113.3 million units by 2028. This market trend is driven by further optimisation of the price-performance ratio, including the producibility and cost of biometric payment cards, as well as by consumer demand for more convenient and secured biometric authentication in personal payment transactions. Furthermore, biometric payment cards could offer an additional barrier against lost-and-stolen fraud and PIN phishing fraud.

SECORA Pay Bio extends Infineon’s SECORA Pay solution family. The solution integrates Fingerprints’ sensor and Infineon’s SLC39B SoC Secure Element into a single dual-interface package, the innovative Infineon Biometric Coil on Module (BCoM). The SLC39B Secure Element with an integrated power source offers large memory size and various peripherals, as well as excellent contactless performance. Based on innovative inductive coupling technology without wire connection from the BCoM module to the card antenna, manufacturing complexity can be drastically reduced, and the card robustness and long-term reliability can be significantly improved. In addition, the biometric sensor card production can now be implemented on existing dual interface card manufacturing equipment with only minor operational changes. As the SECORA Pay Bio solution complies with both Mastercard and Visa specifications, the use of BCoM technology would not require additional performance testing, enabling a flexible and rapid rollout with outstanding performance and a frictionless onboarding process.

SECORA Pay Bio supports a wide range of enrolment options, including sleeves, smartphone apps and in-field enrolment. The innovative SECORA Pay Bio enrolment sheet makes fingerprint enrolling via smartphone easier than ever before. In addition, SECORA Pay Bio is the first biometric payment solution to support in-field enrolment. This allows cardholders to use biometric payment cards without any additional effort or devices. Moreover, with these new biometric cards, the fingerprint template is trained with each payment transaction, improving the user experience even further.

Availability
The SECORA Pay Bio solution supports the latest payment applications according to EMV specifications. The pilot proven product is available with full design-in package and ready for mass-production. More information is available at https://www.infineon.com/secorapaybio

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Infineon introduces the XENSIV PAS CO2 5V sensor for higher energy efficiency

Mon, Sep 16, 2024

In order to further drive decarbonisation, improving the energy efficiency of buildings is crucial, as they contribute significantly to global energy consumption and carbon emissions. Innovative solutions are needed to optimise energy consumption while ensuring a healthy indoor environment. Infineon is addressing this need with the introduction of the new XENSIV PAS CO2 5V sensor. It is based on the Photoacoustic Spectroscopy (PAS) technology and improves energy efficiency by adapting ventilation to actual occupancy, thereby reducing the carbon footprint of buildings. This makes the device suitable for applications such as heating, ventilation, and air conditioning (HVAC) systems as well as room controller and thermostat units in commercial and residential buildings. It can also be used for IoT and consumer devices such as smart lighting, air purifiers, conferencing systems, and smart speakers, as well as emerging applications such as smart horticulture and smart refrigerators.

“Environmental sensing is an important pillar of Infineon’s sensor portfolio,” said Andreas Kopetz, VP Ambient Sensing at Infineon. “CO2 sensors play an increasingly important role in smart homes and buildings by continuously monitoring indoor air quality and adjusting ventilation systems accordingly. Our XENSIV PAS CO2 5V is a sensor solution that ensures a healthier living environment for occupants and enables significant energy savings for greater sustainability.”

The XENSIV PAS CO2 5V provides accurate air quality data in real time. Its miniaturised form factor of 14×13.8×7.5 mm³ is identical to the size of the XENSIV PAS CO2 12V sensor and allows seamless integration into a wide range of applications. This makes it easy to adopt dual designs or maintain the same design strategy for both product variants. Compared to the 12V sensor, the 5V version comes with a 5V power supply which further simplifies installation. Moreover, it offers a significantly faster response time of 55 seconds, down from 90 seconds (12 V). This improvement enhances efficiency across various applications, allowing for quicker data acquisition and more responsive performance in dynamic environments. The sensor’s design is dust-proof in accordance with ISO 20653:2013-02, which extends the lifetime of the device in dusty environments and minimises maintenance requirements. In addition, the UART, I²C and PWM interfaces enable seamless integration with microcontrollers and other digital systems, simplifying the design and development process. Ultimately, with its robust performance, the sensor meets the performance criteria of the internationally recognised WELL Green Building Standard, enhancing both environmental sustainability and property value.

All major components of the XENSIV PAS CO2 5V sensor are developed in-house according to Infineon’s high-quality standards. Among others, this includes a dedicated microcontroller that runs advanced compensation algorithms to provide direct and reliable ppm readouts of real CO2 levels. The available configuration options make the sensor one of the most versatile plug-and-play CO2 sensors on the market. They include a dedicated ABOC (Automatic Baseline Offset Calibration), pressure compensation, signal alarm, sample rate and early measurement notification, which are especially useful for power consumption management. The SMD package, delivered in tape and reel, allows for easy assembly, even in high-speed, high-volume manufacturing.

https://www.infineon.com/co2

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