ST announces availability of low-power, long-range wireless microcontrollers

ST has announced general availability of STM32WL33 wireless microcontrollers (MCUs), integrating its latest-generation sub-GHz long-range radio, Arm Cortex-M0+ core, tailored peripherals for smart-metering applications, and power-saving enhancements. The new MCUs greatly simplify the design of wireless solutions, reduce time-to-market, and prolong battery life.

These new IoT-focused devices are used in smart utility meters, alarm systems, smart-building equipment, asset-tracking, and proximity detection. Among many other applications in cutting-edge, smart use cases, they are ideal for monitoring and control in smart cities, smart agriculture including reporting soil condition and animal welfare, forest-fire detection, water metering, and leakage detection.

Designers creating new products can take advantage of flexible options, ultra-low-power architecture, best-in-class radio efficiency, and innovative features to optimise the wireless range, simplify the design and extend battery lifetime.

A unique analog flow-sensor controller, LCSC, is integrated to streamline and optimise the design of water metering devices. The LCSC integrated circuitry can operate in conjunction with traditional coil-based mechanical meters, measuring fluid flow without any MCU intervention and providing a suitable anti-tampering feature. With these properties, the LCSC provides safety-proofing and can further enhance battery lifetime to more than 15 years while optimising the integration and cost structure of water metering devices.

In addition, there is an ultra-low-power (4.2µA) receive-only wideband radio that listens for a wake-up signal while the main communication radio is turned off to save power. This always-on radio has negligible impact on battery consumption and provides a standby mode that can quickly react upon receiving a suitable RF wake-up signal. Application use cases include drive-by reading in metering devices or wake-on-service capability in battery-operated monitoring solutions to permit applying firmware upgrades. Moreover, the wake-up signal generated, for instance, by a fixed-position beaconing tag, can transport OOK-modulated information, providing a convenient solution for asset-tracking or location-tags in logistics and warehouse applications.

A comprehensive set of integrated programmable memories, peripherals and security options let developers build richly featured applications with minimal external circuitry. These include 256Kbyte Flash, 32Kbyte SRAM and flexible peripherals including a 16-segment LCD driver, 12-bit 1Msample/s analog-to-digital converter (ADC), analog comparator, digital-to-analog converter (DAC), multiple timers, and a real-time clock (RTC). Security services include secure-boot, secure firmware updates, 128-bit AES, and a random-number generator (RNG).

All the MCUs can operate in either of the 413-479 MHz or 826-958 MHz license-free bands. A special variant, the STM32WL33CCV6A, operates in the 169MHz band.
The device embeds two programmable power amplifiers allowing a selectable RF output power of either +14dBm or +20dBm, further optimising power efficiency during active transmission time. In EU, Korea and Japan, legislation restricts the maximum to +14dBm for energy saving, while North America and Asia-Pacific allow +14dBm or +20dBm for longer range. With their dual power output, STM32WL33 wireless MCUs can be deployed worldwide and provide roaming capability for global tracking applications.

The widely configurable radio allows multi-protocol support and multi-modulation flexibility including 4-(G)FSK up to 600kbit/s, 2-(G)FSK, (G)MSK, DBPSK, DSSS, and ASK. A programmable and autonomous state-machine, the Radio Sequencer, automates common radio operations such as frequency-hopping low-duty-cycle operations, LBT, RX Sniff, auto-ack and many more saving MCU intervention and boosting radio efficiency.

With receive sensitivity of -132 dBm @300 bit/s 433 MHz OOK and -128 Bm @300 bit/s 868 MHz 2(G)FSK, the radio ensures robust communication over long distances. At +20 dBm output power and -128 dBm of sensitivity at 868 MHz, 300 bps GFSK makes it possible to achieve a link budget that supports a wireless communication range of over 1 Km.

There is also an IQ interface for custom modulation schemes and to further enhance reception sensitivity, enabling post-processing exploration with GNURadio or similar tools prior to embedding optimised protocol libraries. Supported standard protocols, besides the fully customisable proprietary options, includes wM-Bus, Mioty, Wize, Sigfox, 6LowPAN as well as Wi-SUN Home-Area-Networking (HAN).

This wireless SoC can combine seamlessly with ST’s MEMS inertial and environmental sensors, leveraging ML/AI algorithms and toolsets provided by ST. This facilitates development of applications that require positional and contextual awareness, as well as battery-operated remote monitoring and wireless sensors in industrial, smart-city or agricultural applications.

As an all-in-one system-on-chip (SoC), the STM32WL33 series connects developers with the extensive STM32 ecosystem. This now includes device-specific STM32CubeWL3 software and middleware, the NUCLEO-WL33CC1 board for 868/915MHz development, and NUCLEO-WL33CC2 for 433MHz. Also, dedicated matched filters (MLPF-WL-01D3/02D3/04D3) are now available for these MCUs, built with ST’s integrated passive device (IPD) technology, that deliver a simple and space-saving solution to optimise RF performance. In addition, a set of reference designs (STDES-WL3xxxx) saves R&D and simplifies RF design, further easing the path to market for new products. Pre-certified and fine-tuned for the STM32WL3 series, these reference designs cover several options including frequency band, RF power, MCU package, and two-layer or four-layer PCB.

The Wireless Studio Environment (STM32CubeWiSE), a graphical-UI based toolset, greatly boosts the learning curve and out-of-the-box experience. This includes the WiSE-RadioCodeGen, a code generator for RF-protocol automation that comes with the dedicated WL33 Radio Sequencer, and the WiSE-RadioExplorer. The explorer helps users make the most of the cutting-edge radio features and navigate the RF testing and certification process.

https://www.st.com

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u-blox launches tri-radio module that delivers the latest wireless technologies for IoT

u-blox has announced the launch of the MAYA-W4, a tri-radio module that delivers the latest in wireless connectivity technologies for the mass market. With support for dual-band Wi-Fi 6, Bluetooth Low Energy 5.4, and 802.15.4 (for Thread supporting Matter), the MAYA-W4 is set to redefine the landscape of IoT applications in diverse industries, enhancing device connectivity and interoperability.
Combining three of the most critical wireless technologies into a compact, power-efficient module, the versatile MAYA-W4 meets the growing demand for reliable and secure connectivity. Whether enabling low-energy mesh networks for smart homes or providing high-speed Wi-Fi 6 connectivity for industrial tools, the MAYA-W4 offers unparalleled flexibility for developers and manufacturers. Its small size and robust design make it ideal for space-constrained applications, while its comprehensive global certifications ensure seamless deployment across regions.
The MAYA-W4 addresses the market’s need for Wi-Fi 6 solutions, driven by the rapid adoption of Wi-Fi 6 in IoT segments, as highlighted by recent market data from TSR* (Techno Systems Research CO. LTD.). It alleviates network congestion, enhances power efficiency, and, with a temperature range of -40°C to +85°C, is suitable for industrial environments. With its entry-level feature set and optimised data throughput, the MAYA-W4 offers cost-efficient connectivity without compromising performance. The inclusion of 802.15.4 enables low-power IoT and mesh networking, providing a gateway for the next generation of smart, connected devices.
The new module also eases design efforts, enabling manufacturers to scale their device designs for current and future markets. Offering a selection of antenna variants, designers can choose between pin(s) out, embedded antenna, or U.FL. connector(s) configuration. By maintaining the same compact dimensions as its predecessors (10 x 14 x 1.9 mm), u-blox simplifies migration across previous generations.

https://www.u-blox.com

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Renesas introduces new AnalogPAK programmable mixed-signal ICs

Renesas has announced new AnalogPAK ICs, including lower power and automotive-qualified devices along with the industry’s first programmable 14-bit SAR ADC (Successive-Approximation Register Analog-Digital Converter).

AnalogPAK devices are part of Renesas’ GreenPAK Family of Programmable Mixed-Signal Matrix products: cost-effective, NVM programmable devices which enable innovators to integrate many system functions while minimising component count, board space, and power consumption. GreenPAK and AnalogPAK ICs deliver functional replacement of mixed-signal standard products and stand-alone discrete circuits. They also provide reliable hardware supervisory functions for SoCs and microcontrollers. GreenPAK and AnalogPAK devices provide benefits for virtually any application, including consumer electronics, computing, white goods, industrial, communications, and automotive. Using Go Configure Software Hub and the GreenPAK Development Kit, designers can create and program a custom circuit in minutes.

Renesas’ new SLG47011 AnalogPAK device delivers a new level of performance for configurable analog integrated circuits. It includes a rich set of digital and analog features including programable multichannel 14-bit SAR ADC with Programmable Gain Amplifier (PGA). The SLG47011 also has flexible, user-defined power saving modes for all macrocells that enable designers to switch off some blocks in sleep mode and therefore reduce power consumption to the µA level.

The SLG47011 can be used to extend the performance of, or to offload an MCUs. It can also be used in conjunction with an MCU to replace a complex analog front-end (AFE). Key functions supported by the SLG47011 include measurement, data processing, logic control and data output.

In addition to the SLG47011, Renesas is introducing two other AnalogPAK devices, the cost-optimised SLG47001/3, and the automotive-qualified SLG47004-A.

SLG47001/3 AnalogPAK Devices
The SLG47001 and SLG47003 enable the implementation of precise measurement systems with a low price point and a very compact package to address applications such as gas sensors, power meters, measurement equipment, servers, wearables, industrial robots, industrial and smart home sensor modules.
• Two ultra-low offset op-amps – 9 µV (max.)
• Two 10-bit digital rheostats
• Six-channel sampling comparator
• Analog switch
• Voltage reference
• 59-bytes pattern generator
• 2k/10k/25MHz oscillators
• Fully configurable blocks: LUTs, flip-flops, shift registers, timers, counters, delays

SLG47004-A AnalogPAK Device
The SLG47004-A delivers the functionality of the SLG47004 devices with the addition of automotive qualification Grade 1 for applications such as infotainment, navigation, chassis and body electronics, automotive display clusters and more. The new devices support a temperature range of -40°C to 125°C.

Device Availability
All of the new AnalogPAK devices are available today from Renesas and its authorised distributors, along with customised development kits. The SLG47011 comes in a 2.0 x 2.0 mm 16-pin STQFN package. The SLG47001 is packaged in a 2.0 mm x 3.0 mm 20-pin STQFN, while the SLG47003 comes in a 3.0 mm x 3.0 mm 24-pin STQFN. The SLG47004-A is available in a 4.0 mm x 4.0 mm 24-pin TQFN.

More information on all the new offerings is available at https://www.renesas.com/analogpak.

 

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Renesas brings the high performance of Arm Cortex-M85 processor to cost-sensitive applications

Renesas has introduced the RA8E1 and RA8E2 microcontroller (MCU). Introduced in 2023, the RA8 Series MCUs are the first to implement the Arm Cortex-M85 processor, enabling them to deliver market-leading 6.39 Coremark/MHz1 performance. The new RA8E1 and RA8E2 MCUs offer the same performance but with a streamlined feature set that reduces costs, making them excellent candidates for high-volume applications such as industrial and home automation, office equipment, healthcare, and consumer products.

The RA8E1 and RA8E2 MCUs deploy Arm Helium technology, Arm’s M-Profile Vector Extension that provides up to a 4X performance boost for digital signal processor (DSP) and machine learning (ML) implementations versus MCUs based on the Arm Cortex-M7 processor. This performance uplift enables applications in the fast-growing field of AIoT where high performance is crucial to execute AI models.

RA8 Series devices integrate low power features and multiple low power modes to improve power efficiency, even while providing industry-leading performance. A combination of low power modes, independent power domains, lower voltage range, fast wakeup time and low typical active and standby currents enables lower overall system power and allows customers to lower overall system power consumption and meet regulatory requirements. The new Arm Cortex-M85 core also performs various DSP/ML tasks at much lower power.

RA8 Series MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of existing designs to the new RA8 Series devices.

Key Features of the RA8E1 MCUs
• Core: 360 MHz Arm Cortex-M85 with Helium and TrustZone
• Memory: 1MB Flash, 544 KB SRAM (including 32KB TCM w/ ECC, 512KB user SRAM with parity protection), 1KB standby SRAM, 32KB I/D caches

• Peripherals: Ethernet, XSPI (Octal SPI), SPI, I2C, USBFS, CAN-FD, SSI, ADC 12bit, DAC 12bit, HSCOMP, temperature sensor, 8-bit CEU, GPT, LP-GPT, WDT, RTC
• Packages: 100/144 LQFP

Key Features of the RA8E2 MCUs
• Core: 480 MHz Arm Cortex-M85 with Helium and TrustZone
• Memory: 1MB Flash, 672 KB SRAM (including 32KB TCM w/ ECC, 512KB user SRAM with parity protection+128 KB additional user SRAM), 1KB standby SRAM, 32KB I/D caches

• Peripherals: 16-bit external memory I/F, XSPI (Octal SPI), SPI, I2C, USBFS, CAN-FD, SSI, ADC 12bit, DAC 12bit, HSCOMP, temperature sensor, GLCDC,2DRW, GPT, LP-GPT, WDT, RTC
• Packages: BGA 224

Availability
The RA8E1 and RA8E2 Group MCUs are available now, along with the FSP software. Renesas is also shipping a Fast Prototyping Board for the RA8E1 and will offer an RA8E2 Evaluation Kit including a TFT Display in early Q1 2025.

https://www.renesas.com

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