ICs & Semiconductors

Chipset family supports 6GHz spectrum for Wi-Fi 6E

Wed, Apr 22, 2020

Equipped with an architecture designed to maximise use of the 6GHz band, the QCS-AX2 chipset family is optimised for high-throughput Wi-Fi applications, such as access points, gateways, and mesh networking solutions for dense environments and under-served areas, says ON Semiconductor.

The QCS-AX2 supports the 6GHz spectrum band based on the enhanced Wi-Fi 6E standard. The chipset is built on an integrated baseband and RF architecture that supports key Wi-Fi 6E features, such as orthogonal frequency division multiple access (OFDMA), advanced multi-user, multi-input, multi-output (MU-MIMO), 160MHz channel support for faster speeds and SmartScan channel selection.

The family consists of the QCS-AX2-A12, tri-band (6GHz/5GHz/2.4GHz) with AdaptivMIMO technology. It supports flexible 8×8 or 4×4 configurations, the QCS-AX2-T12, a tri-band concurrent 4×4 operation for high performance, cost-effective router solutions, says ON Semiconductor, and the QCS-AX2-T8, a tri-band concurrent eight-stream configuration for mesh nodes and mainstream access points.

The Federal Communications Commission anticipates the opening of the 6GHz band in the US later this year, with up to 1,200MHz of newly available spectrum to be designated for Wi-Fi and other unlicensed use. With almost five times more spectrum than the current 2.4 GHz and 5GHz bands combined, the 6GHz band is accelerating the development of Wi-Fi 6 applications. The 6GHz client ecosystem will take time to build but the Wi-Fi infrastructure devices, such as gateways, routers, and access points will need to continue to support existing dual band (2.4GHz/5GHz) clients.

ON Semiconductor’s Wi-Fi 6E products accommodate the transition to the 6GHz band with AdaptivMIMO technology. A Wi-Fi 6E infrastructure device with AdaptivMIMO allows the network to operate in the 5GHz or 6GHz band depending on the clients present in a subscriber’s home network to maximise performance, coverage, and utilisation. The QCS-AX2 series provides the Wi-Fi performance and connectivity in congested environments to multiple devices that applications demand.

ON Semiconductor is now sampling the QCS-AX2 solutions to customers.

http://www.onsemi.com

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NXP offers Wi-Fi 6 processors for automotive and IoT

Wed, Apr 08, 2020

Wi-Fi 6 (802.11ax) devices from NXP Semiconductors support developers’ efforts to adopt the latest Wi-Fi standards. The company says its expanded Wi-Fi 6 portfolio applies to connectivity for automotive, access, mobile and industrial and IoT markets.

Wi-Fi 6 delivers symmetric multi-gigabit uploads and downloads, lower latency, increased capacity and improved power efficiency, explains NXP. These technical advancements have so far been limited to premium products but NXP says these benefits are now available for large-scale deployment across multiple markets, enabling products with up to four-fold performance improvement, greater range, improved battery life and greater connection reliability for Wi-Fi capabilities. Wi-Fi 6 connectivity can be applied to smart homes, connected cars, and industrial machinery.

The portfolio consists of the 88W9064 and 88W9068, 4×4 and 8×8-stream solutions with integrated Bluetooth 5 for home and enterprise access solutions, the 88Q9098 concurrent dual Wi-Fi 2×2+2×2 + Bluetooth 5 AEC-Q100-qualified devices for infotainment and telematics automotive applications, the 88W9098, concurrent dual Wi-Fi 2×2+2×2 + Bluetooth 5 devices for multimedia streaming and consumer access applications. Others are IoT-focused 2×2 WiFi 6 + Bluetooth 5 devices.

NXP’s RF front-end solutions are based on silicon germanium (SiGe) and can scale Wi-Fi 6 capabilities from low to high-end applications, including 1×1, 2×2, 4×4 and 8×8 multiple input, multiple output (MIMO). It is packaged in a compact 3.0 x 4.0mm module for mobile products.

“To date, the adoption of Wi-Fi 6 has predominantly been driven by smartphones. However, we expect significant traction to build within the IoT, infrastructure, and automotive markets throughout 2020 and beyond. said Andrew Zignani, Wi-Fi, Bluetooth, and Wireless Connectivity Principal Analyst at ABI Research.

When combined with the processing power of the EdgeVerse platform, NXP enables smart connected devices, connecting people to the internet, joining IoT devices to the cloud, or communicating with cars.

NXP Semiconductors says it is the world leader in secure connectivity solutions for embedded applications, and is driving innovation in the automotive, industrial and IoT, mobile, and communication infrastructure markets. It has more than 60 years of combined experience and expertise, with employees in more than 30 countries.

http://www.nxp.com

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IO-Link IC connects industry 4.0 devices

Wed, Apr 01, 2020

The CCE4503 is the latest member of the IO-Link family from Dialog Semiconductor.  It is the first to be launched by the company since it bought Creative Chips at the end of last year. The IC connects the smallest and most price-sensitive IO-Link device sensors and actuators for the industrial IoT (IIoT).

IO-Link is the first globally standardised, serial bi-directional point-to-point communication technology (IEC 61131-9) for an industrial automation network, providing data access to the cloud. It provides robust communications for the last stretch between sensors, actuators and any fieldbus within a network.

The CCE4503 is a robust device-side IO-Link-compliant transceiver that combines IO-Link standard communications with advanced protection circuitry and low power dissipation. It is packaged in a tiny DFN10 (3.0 x 3.0mm). Its size enables it to be used to add IO-Link connectivity to the most space-constricted industrial sensor and actuator devices, says Dialog.

“Industrial sensors and actuators are integrating more functionality in smaller form factors with greater demands for cloud connectivity,” said Dr Lutz Porombka, vice president of Dialog’s Industrial Mixed Signal business unit.

The CCE4503 is sampling now and is supported by a comprehensive set of development support tools, industry standard IO-Link software and a full-featured customer evaluation board.

https://www.dialog-semiconductor.com

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Image sensors for computer vision use ST’s die-stacking technology

Thu, Mar 26, 2020

Two high-speed image sensors released by STMicroelectronics use global shutter to capture images. Global shutter mode captures distortion-free images when the scene is moving or when near-infrared illumination is needed. This makes the sensors suitable for use in the next generation of smart computer vision applications, says ST.

Global-shutter sensors save all pixel data in each frame simultaneously, contrasting with rolling-shutter operation that captures pixel data sequentially, which makes moving images vulnerable to distortion or in need of additional corrective processing.

The company’s image sensor process technologies are claimed to enable class-leading pixel size while offering both high sensitivity and low crosstalk. The silicon process innovation and advanced pixel architecture allows a smaller sensor pixel array on the top die, while keeping more silicon area on the bottom die to increase digital-processing capabilities and features.

ST’s advanced pixel technology, including full deep trench isolation (DTI), enables extremely small 2.61 x 2.61 micron pixels that combine low parasitic light sensitivity (PLS), high quantum efficiency (QE), and low crosstalk in a single die layer.

The VD55GO sensor has 640 x 600 pixels and the VD56G3 sensor has 1.5Mpixels (1124 x 1364). The VD55GO measures 2.6 x 2.5mm and the VD56G3 measures 3.6mm x 4.3mm, making them the smallest image sensors available today, in relation to resolution, says ST.

They also have low pixel-to-pixel crosstalk at all wavelengths, specifically near-infrared, which ensures high contrast for image clarity. Embedded optical-flow processing in the VD56G3 calculates movement vectors, without the need for host computer processing.

The sensors are intended for a wide range of applications including augmented reality / virtual reality (AR/VR), simultaneous localisation and mapping (SLAM), and 3D scanning.

According to Eric Aussedat, imaging sub-group general manager and executive vice president of the Analog, MEMS and Sensors Group, STMicroelectronics: “They are enabling another step forward in computer-vision applications, empowering designers to create tomorrow’s smart, autonomous industrial and consumer devices.”

Samples are shipping now to lead customers.

http://www.st.com

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