NXP enhances Bluetooth microcontroller family

Bluetooth 5.0 long range capabilities and Bluetooth advertising channels have been added to NXP Semiconductors’ KW3x family of microcontrollers. The KW39, KW38 and KW37 microcontrollers extend the wireless microcontroller family.

They offer seamless migration with hardware, software and tools compatibility with the previous generation of devices, KW34, KW35 and KW36. The connectivity microcontrollers allow Bluetooth LE devices to communicate at distances of more than a mile and increase the amount of Bluetooth advertising channels and advertising data within the Bluetooth standard, says NXP.

The KW39, KW38 and KW37 wireless microcontrollers are designed with automotive and industry-grade hardware and software, along with robust serial communications with CAN-FD peripherals. They are suitable for automotive applications, such as keyless entry, sensors and wireless onboard diagnostic functions. They also enable industrial applications such as building control and monitoring, fire and safety, home and institutional healthcare, asset management and monitoring.

NXP claims that the KW39, KW38 and KW37 deliver best-in-class RF performance, with extreme RX sensitivity to allow for the long range Bluetooth LE connections. They achieve -105 dBM RX sensitivity with LE-coded 125kbits per second data rate, for example, allowing for connections in harsh environments and at extended distances. The radio supports up to eight simultaneous secure connections in any master/slave combination, allowing multiple authorised users to communicate with the device. The microcontroller’s data stream buffer allows the capture of radio parameters without stalling processor or DMA operations, enabling high-accuracy measurements needed for distance and angle approximations.

NXP’s MCUXpresso tool suite features a certified Bluetooth LE software stack with application programming interface calls. The KW39, KW38 and KW37 microcontrollers extend the previous generation of devices with hardware and software compatibilities for faster design cycles. In addition, the KW38 microcontroller integrated FlexCAN, enables seamless integration into an industrial CAN communication network or an automobile’s in-vehicles network. The FlexCAN module can support CAN’s flexible data rate (CAN FD) for increased bandwidth and lower latency. In addition, the KW38 integrated FlexCAN, enables seamless integration into an industrial CAN or an automobile’s in-vehicles network. The FlexCAN module can support CAN’s flexible data rate for increased bandwidth and lower latency.

The KW39, KW38 and KW37 wireless microcontrollers feature AEC-Q100 Grade 2 and industrial qualifications for exceptional durability and performance for safety-critical applications

RF transmit power and receive sensitivity enhancements, including -105dBm typical Bluetooth LE sensitivity in 125kbits per second, -98dBm typical Bluetooth LE sensitivity in 1Mbits per second, -101dBm typical generic FSK (at 250kbits per second) sensitivity and +5dBm maximum transmit output power provide an advanced link budget that helps ensure long range of communication and a high immunity to interference

The AES-128 accelerator is a true random number generator for fast encryption/decryption, using hardware security algorithms for network commissioning and transmission of supported protocols.

The microcontrollers are supplied in a 7.0 x 7.0mm wettable flanks 48HVQFN package with up to 512kbyte flash memory with ECC and 64kbyte SRAM, allowing space for protocol stacks, application profiles and custom user firmware.

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Signal conditioner IC targets industry 4.0, medical and IoT sensor applications

The latest addition to the sensor signal conditioner (SSC) range is the ZSSC3240. According to Renesas, it delivers high accuracy, sensitivity, and flexibility for sensor applications such as resistive pressure sensors and medical infra red thermometers. It is also claimed to deliver best-in-class performance and speed with up to 24 bits analogue to digital conversion (ADC) resolution.

The ZSSC3240 has a flexible sensor front end and a range of output interfaces, enabling the SSC to be used for nearly all types of resistive and absolute voltage sensor elements. Engineers can develop complete sensing platforms from a single SSC device, said Renesas. It is also small in size, for use in a variety of sensor-based devices for the industrial, consumer, and medical markets, including smart meters, continuous smart health monitors, factory automation devices, industrial pressure transmitters, HVAC sensors and weight scales.

Unlike micro-machined and silicon-based sensing elements which provide mostly non-linear and very small signals, which need to be converted into a linearised output, the ZSSC3240 SSC provides programmable, wide gain and quantisation functions, combined with powerful, high-order digital correction and linearisation algorithms, explained Renesas. High performance, and flexible sensor front end configuration and analogue output options enable sensor platform design using a single IC, allowing users to leverage the SSC cost effectively for a wide variety of sensor elements that have different characteristics.

The ZSSC3240 SSC has a high-gain analogue front end supporting up to 540V per Volt (V/V) and an integrated 26bit DSP for high-precision sensor calibration. Current loop output is 4.0 to 20 mA.

The ZSSC3240 SSC is available now in a 4.0 x 4.0mm, 24-lead QFN package. The SSC is also available in bare die format.

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Picocom uses Arteris IP FlexNoC in 5G NR

Picocom has licensed Arteris’ FlexNoC Interconnect IP for use in its 5G new radio (5G NR) small cell, baseband SoC. It was chosen to enable the complex high-speed yet flexible design for open small cell radio access networks (RANs), says the company.

The network on a chip (NoC) was selected by Picocom to meet the evolving 5G NR standard for its silicon. “It is enabling us to manage our on-chip SoC bandwidth and complexity, whilst allowing us to retain design flexibility,” said, Yingbo Jiang, CEO of Picocom. “In addition, it has helped us reduce development time, a crucial achievement in the fast-paced 5G NR market.”

Will Robbins, vice president of silicon at Picocom, added that the Arteris IP is a key component and Arteris has provided technical support.

Semiconductor company, Picocom, designs and markets open RAN standard-compliant baseband SoCs and carrier-grade software products for 5G small cell infrastructure. The company was founded in 2018, and is headquartered in Hangzhou, China. It has R&D engineering sites in Beijing, China and Bristol, UK. Picocom is a member of the Small Cell Forum, O-RAN Alliance and Telecom Infra Project wireless industry associations.

Arteris IP provides network on chip (NoC) interconnect IP to accelerate SoC semiconductor assembly for a range of applications from artificial intelligence (AI) to automobiles, mobile phones, IoT, cameras, SSD controllers and servers for customers such as Mobileye, Samsung, Huawei / HiSilicon, Toshiba and NXP. Arteris IP products include the Ncore cache coherent and FlexNoC non-coherent interconnect IP, the CodaCache standalone last level cache, and optional Resilience Package (ISO 26262 functional safety), FlexNoC AI Package, and PIANO automated timing closure capabilities.

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Renesas extends Bluetooth 5.0 security to RA 32-bit microcontrollers

Bluetooth 5.0 connectivity has been extended to the RA family of 32-bit microcontrollers by Renesas Electronics, with the introduction of the RA4W1, with an Arm Cortex-M core.

In addition to the 8MHz, 32-bit Arm Cortex-M4 core, it has an integrated Bluetooth 5.0 low energy radio and is delivered in a 56-pin QFN package. The RA4W1 microcontroller and Flexible Software Package (FSP) enables engineers to immediately begin development with Arm ecosystem software and hardware building blocks, says Renesas. FSP features FreeRTOS and middleware for device-to-cloud development. Renesas also points out that options can be replaced and expanded with any other RTOS or middleware.

The RA4W1 microcontroller allows embedded designers to develop safe and secure IoT endpoint devices for industry 4.0, building automation, metering, healthcare, consumer wearable and home appliance applications. It is intended for engineers developing IoT edge devices for wireless sensor networks, IoT hubs, an add-on to gateways and an aggregator to IoT cloud applications.

Sakae Ito, vice president of IoT Platform Business Division at Renesas, said that customers can use the on-chip features, such as Renesas’ Secure Crypto Engine. This feature supports customers with symmetric encryption and decryption, hash functions, true random number generation (TRNG), and advanced key handling with key generation and microcontroller-unique key wrapping for strong key management for IoT security. It also has what is claimed to be best-in-class output power consumption and sensitivity for secure, longer range applications.

The Arm Cortex M4 core and Bluetooth 5.0 core are housed in a 7.0 x 7.0mm 56-pin QFN. The single-chip RA4W1 48MHz microcontroller features 512 kbyte flash memory, 96 kbyte SRAM and connectivity such as USB, CAN and Renesas’ HMI capacitive touch technology.

Bluetooth 5.0 support includes 2 Mbits per second data throughput, all advertising extension functions with maximum advertising length (1,650 byte), periodic advertisements and channel selection algorithm #2 for applications requiring large amounts of traffic. The RA4W1 also offers low peak power consumption at 3.3mA during receiving and 4.5mA (at 0dBm) while transmitting. Renesas claims its sensitivity of -105dBm in 125 kbits per second mode is an industry best and is achieved without additional loss from external components.

Renesas provides several API functions that conform to all standard profiles, including a heart rate profile (HRP), an environment sensing profile (ESP) and an automation I/O profile (AIOP), to allow users to quickly start and speed up prototype development and evaluation.

Renesas’ Smart Configurator GUI generates Bluetooth code and microcontroller peripheral function driver code as well as pin settings for the e2 Studio integrated development environment (IDE). The Renesas QE tool for Bluetooth LE generates programs for custom profiles and embeds them in user application programs to support application program development. The Bluetooth Trial Tool Suite GUI allows users to perform initial wireless characteristics evaluations and Bluetooth functional verification. Users can typically have the RA4W1 evaluation board up and running with the downloadable smartphone applications demo in less than 30 minutes, says Renesas.

Integrating a high-precision, low-speed on-chip oscillator, an RF oscillator adjustment circuit and on-chip matching circuit for easy antenna connection reduces both bills of materials costs and circuit board area.

http://www.renesas.com

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