ICs & Semiconductors Archives - Page 17 of 235

u-blox expands its NORA-B2 Bluetooth LE modules series to address all mass market segments

Thu, Feb 06, 2025

u-blox has expanded its portfolio by introducing six new variants of the NORA-B2 Bluetooth Low Energy modules. Now integrating the entire range of Nordic Semiconductor’s next-level nRF54L Series of ultra-low power wireless Systems-on-Chip (SoCs), NORA-B2 offers a versatile solution for mass market segments thanks to its choices of antennas, architectures and chipsets.

The wireless modules combine ultra-lower power consumption and high processing efficiency, consuming up to 50% less current than previous-generation devices while doubling process capacity. They also security features, which makes them ideal for a wide range of IoT applications, such as smart home devices, industrial automation, or healthcare.

The entire NORA-B2 series comprises four variants that differ in memory sizes, design architectures and price levels to match almost any device manufacturer’s requirements.

• NORA-B20 features an ultra-low power nRF54L15 SoC with a 128 MHz Arm Cortex-M33, RISC-V co-processor, and 2.4 GHz multiprotocol radio. It includes 1.5 MB NVM and 256 KB RAM.
• NORA-B21, built on the nRF54L10 SoC, supports multiple wireless protocols (Bluetooth LE, Mesh, Thread, Matter, Zigbee, Amazon Sidewalk) with 1.0 MB NVM and 192 KB RAM.
• NORA-B22 is a cost-effective option with up to 31 GPIOs, 0.5 MB NVM, and 96 KB RAM.
• NORA-B26 is pre-flashed with u-blox u-connectXpress, enabling easy Bluetooth integration without prior expertise.

All NORA-B2 modules are designed for PSA Certified Level 3 security. They incorporate features such as secure boot and updates, tamper detection, and secure firmware over-the-air (FOTA) updates. These security measures ensure that IoT devices remain protected against any potential threats, safeguarding both data and functionality. NORA-B2 modules are also qualified against Bluetooth Core 6.0 that includes Channel Sounding, enabling endless cost-effective possibilities in tracking and locating use cases.

NORA-B2 variants either come with an antenna pin for connecting an external antenna of choice or are designed with a patented PCB antenna providing best-in-class RF performance. All module versions come with global certification allowing device manufacturers to launch their products worldwide with minimal effort.
Samples of NORA-B20 are now available. Early samples of NORA-B21 and NORA-B22 are available for evaluation in limited quantities. The pre-release version of u-connectXpress software for NORA-B26 is also available for early adopters.

https://www.u-blox.com

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Microchip launches the next generation of its low-noise chip-scale atomic clock

Tue, Jan 28, 2025

Microchip has announced its second generation Low-Noise Chip-Scale Atomic Clock (LN-CSAC), model SA65-LN, in a lower profile height and designed to operate in a wider temperature range, enabling low phase noise and atomic clock stability in demanding conditions.

Microchip has developed its own Evacuated Miniature Crystal Oscillator (EMXO) technology and integrated it into a CSAC, enabling the model SA65-LN to offer a reduced profile height of less than ½ inch, while maintaining a power consumption of <295 mW. The new design is optimal for aerospace and defense mission-critical applications such as mobile radar, dismounted radios, dismounted IED jamming systems, autonomous sensor networks and unmanned vehicles due to its compact size, low power consumption and high precision. Operating within a wider temperature range of -40°C to +80°C, the new LN-CSAC is designed to maintain its frequency and phase stability in extreme conditions for enhanced reliability.

The LN-CSAC combines the benefits of a crystal oscillator and an atomic clock in a single compact device. The EMXO offers low-phase noise at 10 Hz < -120 dBc/Hz and Allan Deviation (ADEV) stability <1E-11 at a 1-second averaging time. The atomic clock provides initial accuracy of ±0.5 ppb, low frequency drift performance of <0.9 ppb/mo, and maximum temperature-induced errors of < ±0.3ppb. Together, the LN-CSAC can save board space, design time and overall power consumption compared to designs that feature two oscillators.

The crystal signal purity and low-phase noise of LN-CSAC are designed to ensure high-quality signal integrity, which is essential for frequency mixing. The atomic-level accuracy allows for longer intervals between calibrations, which can help extend mission durations and potentially reduce maintenance requirements.

https://www.microchip.com

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Upgraded sensor board from ST accelerates plug-and-play evaluation

Tue, Jan 28, 2025

ST’s latest-generation sensor evaluation board, the STEVAL-MKI109D. is now upgraded with an STM32H5 microcontroller, USB-C connector, and extra digital interfaces including I3C for flexible communication , the new board lets users quickly evaluate sensors and handle demanding projects.

Engineers unveiled the STEVAL-MKI109D during a live tech lab, showing how to simply plug in a sensor module, connect a PC, and start analysing data in ST MEMS Studio. Using this all-in-one graphical environment, developers can visualise the sensor output, quickly fine-tune settings, configure features, and exercise the AI capabilities of ST sensors with a machine-learning core (MLC) and intelligent sensor processing unit (ISPU) inside. The tool provides advanced functions including power monitoring and supply voltage management that help optimise energy consumption and debugging.

ST’s MEMS portfolio contains inertial sensors, pressure sensors, biosensors, and digital and analog microphones offering many choices of speed, accuracy, full-scale range, and package style in industrial, consumer, and automotive grades. Extremely compact and robust, they are suited to diverse applications including consumer products, smartphones, wearables, smart-home devices, industrial sensing, safety equipment, healthcare, environmental monitoring, and many more. Automotive-grade devices target applications including navigation support, advanced driver assistance, and automated driving.

An evaluation module is available for each sensor type, mounted on a convenient DIL24 card with headers, ready to connect to the STEVAL-MKI109D board. Additional plug-and-play accessories are available, including biosensor electrodes and remote-sensing extension cables to quickly evaluate sensors when building proof-of-concept models and developing prototypes.

The STM32H5 MCU at the heart of the new board has the latest high-performing and efficient Arm® Cortex®-M33 core with extensive peripherals that enable faster, more convenient development. Customers’ sensor projects can target any of the over 1400 microcontrollers and microprocessors in the STM32 family. The MLC, finite-state machine (FSM), and ISPU embedded in select MEMS devices help optimise application performance and power consumption for superior functionality, responsiveness, and battery runtime.

https://www.st.com/mems-studio

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Infineon launches the world’s smallest eSIM solution for mobile consumer devices

Mon, Jan 27, 2025

Wearables, smartphones, tablets: In the consumer sector in particular, the demand for ever greater functionality, simplicity, and battery lifetime is increasing. Infineon Technologies contributes to these requirements with the introduction of the OPTIGA Connect Consumer OC1230. It is the world’s smallest GSMA-compliant and first 28 nm eSIM solution. OPTIGA Connect Consumer allows up to 50 percent less energy consumption compared to eSIMs on the market, extending the lifetime of the device’s battery without compromising on performance. It also contributes largely to more convenience since eSIMs can be managed remotely, making haptic SIM changes abundant thus saving time and resources and allowing for greater flexibility. Smartphone users can switch between different providers more easily, manufacturers can be more flexible in their design since physical access is not required. This can be a large advantage in IoT devices. Above all, OPTIGA Connect Consumer OC1230 is ideal for consumer devices such as smartphones, tablets, and notebooks, and even for small devices such as smartwatches and other wearables as well as 5G routers and POS payment terminals.

The OPTIGA Connect Consumer OC1230’s security architecture is based on Arm v8 and Infineon’s Integrity Guard 32 technology for increased performance and reduced power consumption. It enables a gain of 25 percent power/performance ratio compared to existing eSIMs on the market, thus extending the lifetime of the device’s battery. Remote SIM provisioning (RSP) and multiple enabled profiles (MEP) compliant with GSMA SGP.22 v3 enhance the end user experience. Users can download and store several mobile network operator profiles and remotely activate multiple profiles simultaneously.
With only 1.8 x 1.6 x 0.4 mm, the ultra-small chip-scale packaging reduces printed circuit board (PCB) space requirements by a factor of 37 relative to Nano SIMs and by a factor of 130 compared to standard SIMs. The OPTIGA Connect Consumer OC1230 is also available in X2QFN20 (3.0 x 3.0 x 0.3 mm) package. The eSIM solution features a large memory of 1 MB to accommodate multiple network operator profiles along with additional applications and user data.

OPTIGA Connect Consumer OC1230 is security evaluated according to BSI-CC-PP-0100-2018, specified in GSMA SGP.25 and is based on post-quantum-cryptography-(PQC) ready hardware.

The OPTIGA Connect Consumer OC1230 is available now.

https://www.infineon.com

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u-blox expands its NORA-B2 Bluetooth LE modules series to address all mass market segments

Microchip launches the next generation of its low-noise chip-scale atomic clock

Upgraded sensor board from ST accelerates plug-and-play evaluation

Infineon launches the world’s smallest eSIM solution for mobile consumer devices

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