u-blox has announced the launch of the MAYA-W4, a tri-radio module that delivers the latest in wireless connectivity technologies for the mass market. With support for dual-band Wi-Fi 6, Bluetooth Low Energy 5.4, and 802.15.4 (for Thread supporting Matter), the MAYA-W4 is set to redefine the landscape of IoT applications in diverse industries, enhancing device connectivity and interoperability.
Combining three of the most critical wireless technologies into a compact, power-efficient module, the versatile MAYA-W4 meets the growing demand for reliable and secure connectivity. Whether enabling low-energy mesh networks for smart homes or providing high-speed Wi-Fi 6 connectivity for industrial tools, the MAYA-W4 offers unparalleled flexibility for developers and manufacturers. Its small size and robust design make it ideal for space-constrained applications, while its comprehensive global certifications ensure seamless deployment across regions.
The MAYA-W4 addresses the market’s need for Wi-Fi 6 solutions, driven by the rapid adoption of Wi-Fi 6 in IoT segments, as highlighted by recent market data from TSR* (Techno Systems Research CO. LTD.). It alleviates network congestion, enhances power efficiency, and, with a temperature range of -40°C to +85°C, is suitable for industrial environments. With its entry-level feature set and optimised data throughput, the MAYA-W4 offers cost-efficient connectivity without compromising performance. The inclusion of 802.15.4 enables low-power IoT and mesh networking, providing a gateway for the next generation of smart, connected devices.
The new module also eases design efforts, enabling manufacturers to scale their device designs for current and future markets. Offering a selection of antenna variants, designers can choose between pin(s) out, embedded antenna, or U.FL. connector(s) configuration. By maintaining the same compact dimensions as its predecessors (10 x 14 x 1.9 mm), u-blox simplifies migration across previous generations.
ICs & Semiconductors
Renesas introduces new AnalogPAK programmable mixed-signal ICs
Renesas has announced new AnalogPAK ICs, including lower power and automotive-qualified devices along with the industry’s first programmable 14-bit SAR ADC (Successive-Approximation Register Analog-Digital Converter).
AnalogPAK devices are part of Renesas’ GreenPAK Family of Programmable Mixed-Signal Matrix products: cost-effective, NVM programmable devices which enable innovators to integrate many system functions while minimising component count, board space, and power consumption. GreenPAK and AnalogPAK ICs deliver functional replacement of mixed-signal standard products and stand-alone discrete circuits. They also provide reliable hardware supervisory functions for SoCs and microcontrollers. GreenPAK and AnalogPAK devices provide benefits for virtually any application, including consumer electronics, computing, white goods, industrial, communications, and automotive. Using Go Configure Software Hub and the GreenPAK Development Kit, designers can create and program a custom circuit in minutes.
Renesas’ new SLG47011 AnalogPAK device delivers a new level of performance for configurable analog integrated circuits. It includes a rich set of digital and analog features including programable multichannel 14-bit SAR ADC with Programmable Gain Amplifier (PGA). The SLG47011 also has flexible, user-defined power saving modes for all macrocells that enable designers to switch off some blocks in sleep mode and therefore reduce power consumption to the µA level.
The SLG47011 can be used to extend the performance of, or to offload an MCUs. It can also be used in conjunction with an MCU to replace a complex analog front-end (AFE). Key functions supported by the SLG47011 include measurement, data processing, logic control and data output.
In addition to the SLG47011, Renesas is introducing two other AnalogPAK devices, the cost-optimised SLG47001/3, and the automotive-qualified SLG47004-A.
SLG47001/3 AnalogPAK Devices
The SLG47001 and SLG47003 enable the implementation of precise measurement systems with a low price point and a very compact package to address applications such as gas sensors, power meters, measurement equipment, servers, wearables, industrial robots, industrial and smart home sensor modules.
• Two ultra-low offset op-amps – 9 µV (max.)
• Two 10-bit digital rheostats
• Six-channel sampling comparator
• Analog switch
• Voltage reference
• 59-bytes pattern generator
• 2k/10k/25MHz oscillators
• Fully configurable blocks: LUTs, flip-flops, shift registers, timers, counters, delays
SLG47004-A AnalogPAK Device
The SLG47004-A delivers the functionality of the SLG47004 devices with the addition of automotive qualification Grade 1 for applications such as infotainment, navigation, chassis and body electronics, automotive display clusters and more. The new devices support a temperature range of -40°C to 125°C.
Device Availability
All of the new AnalogPAK devices are available today from Renesas and its authorised distributors, along with customised development kits. The SLG47011 comes in a 2.0 x 2.0 mm 16-pin STQFN package. The SLG47001 is packaged in a 2.0 mm x 3.0 mm 20-pin STQFN, while the SLG47003 comes in a 3.0 mm x 3.0 mm 24-pin STQFN. The SLG47004-A is available in a 4.0 mm x 4.0 mm 24-pin TQFN.
More information on all the new offerings is available at https://www.renesas.com/analogpak.
Renesas brings the high performance of Arm Cortex-M85 processor to cost-sensitive applications
Renesas has introduced the RA8E1 and RA8E2 microcontroller (MCU). Introduced in 2023, the RA8 Series MCUs are the first to implement the Arm Cortex-M85 processor, enabling them to deliver market-leading 6.39 Coremark/MHz1 performance. The new RA8E1 and RA8E2 MCUs offer the same performance but with a streamlined feature set that reduces costs, making them excellent candidates for high-volume applications such as industrial and home automation, office equipment, healthcare, and consumer products.
The RA8E1 and RA8E2 MCUs deploy Arm Helium technology, Arm’s M-Profile Vector Extension that provides up to a 4X performance boost for digital signal processor (DSP) and machine learning (ML) implementations versus MCUs based on the Arm Cortex-M7 processor. This performance uplift enables applications in the fast-growing field of AIoT where high performance is crucial to execute AI models.
RA8 Series devices integrate low power features and multiple low power modes to improve power efficiency, even while providing industry-leading performance. A combination of low power modes, independent power domains, lower voltage range, fast wakeup time and low typical active and standby currents enables lower overall system power and allows customers to lower overall system power consumption and meet regulatory requirements. The new Arm Cortex-M85 core also performs various DSP/ML tasks at much lower power.
RA8 Series MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of existing designs to the new RA8 Series devices.
Key Features of the RA8E1 MCUs
• Core: 360 MHz Arm Cortex-M85 with Helium and TrustZone
• Memory: 1MB Flash, 544 KB SRAM (including 32KB TCM w/ ECC, 512KB user SRAM with parity protection), 1KB standby SRAM, 32KB I/D caches
• Peripherals: Ethernet, XSPI (Octal SPI), SPI, I2C, USBFS, CAN-FD, SSI, ADC 12bit, DAC 12bit, HSCOMP, temperature sensor, 8-bit CEU, GPT, LP-GPT, WDT, RTC
• Packages: 100/144 LQFP
Key Features of the RA8E2 MCUs
• Core: 480 MHz Arm Cortex-M85 with Helium and TrustZone
• Memory: 1MB Flash, 672 KB SRAM (including 32KB TCM w/ ECC, 512KB user SRAM with parity protection+128 KB additional user SRAM), 1KB standby SRAM, 32KB I/D caches
• Peripherals: 16-bit external memory I/F, XSPI (Octal SPI), SPI, I2C, USBFS, CAN-FD, SSI, ADC 12bit, DAC 12bit, HSCOMP, temperature sensor, GLCDC,2DRW, GPT, LP-GPT, WDT, RTC
• Packages: BGA 224
Availability
The RA8E1 and RA8E2 Group MCUs are available now, along with the FSP software. Renesas is also shipping a Fast Prototyping Board for the RA8E1 and will offer an RA8E2 Evaluation Kit including a TFT Display in early Q1 2025.
Mouser is now shipping the new MCX W series MCUs from NXP Semiconductors
The MCX W series are compact, secure, wireless MCUs designed to enable interoperable, scalable and innovative designs for the next generation of smart and secure connected devices in edge, IoT, smart home, building automation and controls, and smart energy applications.
The NXP Semiconductors MCX W series is based on the Arm Cortex-M33 core, offering a unified range of pin-compatible multiprotocol wireless MCUs for Matter, Thread, Bluetooth Low Energy and Zigbee. The MCX W series includes the industry’s first wireless MCU to support the new Bluetooth Channel Sounding standard, which improves the accuracy and security of distance measurement compared to traditional Bluetooth technology for a wide range of applications, such as secure access, asset tracking and indoor wayfinding. With NXP’s Trimension portfolio of ultra-wideband (UWB) secure radar and fine-ranging products, The MCX W series enhances a broad range of market segments and applications in ambient computing. The MCX W series supports both standalone or hosted architectures and is pin- and software-compatible, allowing developers to easily migrate to the part that best fits their use case. The MCX W series is supported by the MCUXpresso Developer Experience.
Also available is the NXP FRDM-MCXW71 development board. The FRDM-MCXW71 is a compact and scalable multiprotocol board for rapid prototyping and easy evaluation of the MCXW71 wireless MCU, with wireless support for Bluetooth LE, Zigbee, Thread, and Matter. This board includes an onboard MCU-Link debugger, industry-standard headers for easy access to the MCU’s I/Os, an accelerometer, a light sensor, and external SPI flash memory.
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