Eval kit accelerates BLE SoC development for industrial and smart buildings markets

The STMicroelectronics STEVAL-IDB008V1M Bluetooth Low Energy 5.0 (BLE) evaluation platform is intended to accelerate application development with modules featuring the BlueNRG-2 SoC.

BlueNRG-2 supports the Bluetooth 5.0 certification, which allows enhanced security with LE secure connections, power-efficient privacy with Link Layer Privacy 1.2 and up to 2.6 times higher throughput with LE data length extension. The SoC contains an Arm Cortex-M0 core operating at up to 32MHz to handle the Bluetooth stack and application processing. Other features are a 32kHz ring oscillator, 24kbyte RAM and 256kbyte flash program memory. Standby power is low, just 0.9 microA in sleep mode with active Bluetooth stack and there is full RAM retention.

The BlueNRG-M2SA module combines a ceramic antenna, RF balun circuit, and 32kHz crystal oscillator and switch mode power supply (SMPS) inductor to reduce power consumption. The compact module measures 13.5 x 11.5mm.

According to STMicroelectonics, the module greatly reduces engineering costs and enables designers to create wireless devices with minimal RF engineering expertise. BlueNRG-M2SA is qualified as a Bluetooth end product, so additional testing by the customer to complete product qualification is unnecessary, says the company. The modules are pre-certified according to US FCC, Canadian IC, European RED, Japan TYPE radio-equipment regulations and will also meet China SRCC requirements when those are finalised.

The STEVAL-IDB008V1M kit’s board combines the BlueNRG-M2 module with sensors including a MEMS pressure and temperature sensor and motion sensors suitable for nine-axis sensor-fusion library. There is also a low-latency, low-power ADPCM codec, ready to use with BlueVoice middleware for voice over BLE streaming. Arduino R3 connectors are provided, and allow access to all the module’s peripherals and enable users to further extend functionality by adding expansion shields.

The associated development-software package, STSW-BLUENRG1-DK, contains an intuitive BlueNRG-Navigator graphical user interface (GUI) which negates the need for an external programmer or hardware.

The kit also simplifies integration of the BlueNRG-M2SA module with ST’s STSW-BNRG-MESH software. STSW-BNRG-MESH implements the Bluetooth SIG Mesh Profile v1.0 to allow true two-way communication and range-extending mesh networks, for industrial and smart building applications.

Operating temperature range is -40 to +85 degrees C. The module has 5dBm RF output power, enabling it to be powered directly with a pair of AAA batteries or any power source from 1.7 to 3.6V.

The STEVAL-IDB008V1M evaluation kit is available now.

http://www.st.com

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Renesas adds neural network training to add AI to air quality sensor

Renesas has added embedded AI (e-AI) to its ZMOD4410 Indoor Air Quality (IAQ) sensor platform, enabling smart odour sensing for ventilation systems, bathroom monitoring and controls and air quality monitors.

The company has combined neural network-trained firmware on microcontrollers, such as the Renesas RL78, to provide higher resolution measurement results. With these new capabilities, the ZMOD4410 platform is capable of not only detecting gases in small enclosed rooms with higher accuracy and  improved part-to-part deviation, but can also distinguish between sulphur- and ethanol-based odours, Renesas explains. The upgrades are the first in a family of e-AI-based firmware from the company.

The software-configurable ZMOD platform provides greater design flexibility for smart sensing systems, through firmware upgrades in the field to enable new, application-specific capabilities such as selective measurements to detect volatile organic compounds (VOCs). The upgrades enable IAQ measurement within international guidelines, allowing customers to measure total VOCs (TVOCs) and IAQ in the low parts-per-million range (ppm). The higher accuracy and consistency provides improved estimated carbon dioxide (eCO2) levels. The ZMOD4410 AI firmware can also be implemented on any Renesas microcontroller – including RE, RA, or RX devices – or other general-purpose microcontrollers.

The programmability, stability and sensitivity in measuring VOCs makes the ZMOD4410 suitable for use in smart HVAC systems, ventilator fans, and bathroom lights and switches.

The ZMOD4410 is based on proven metal oxide (MOx) material and each sensor is electrically and chemically tested to ensure consistency from lot to lot. The devices are also highly resistant to siloxanes for reliable operation in harsh applications.

The ZMOD4410 platform with AI and performance firmware is available now.

http://www.renesas.com

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Renesas adds to control plane options with I3C bus extension products

I3C multiplexers and I/O expanders from Renesas Electronics deliver 12.5MHz in a small footprint, claims the company.

There are four new I3C Basic bus extension products for control plane designs for data centre and server applications, as well as enterprise, factory automation and communications equipment. The IMX3102 2:1 bus multiplexer, IMX3112 1:2 bus expander, and IXP3114 and IXP3104 1:4 general-purpose I/O expanders support up to 12.5MHz speeds as well as integrated thermal sensor capability.

Engineers can use them when implementing I3C Basic as a system management bus in applications where there may be multiple masters, a large number of endpoint devices and long traces affecting bus complexity and signal integrity. The integrated thermal sensor allows the thermal management to be integrated into the bus design itself and can reduce the number of dedicated thermal sensor endpoints.

According to Renesas, next-gen compute architectures are leading the transition to I3C as the system management bus of choice, as a result of the JEDEC standard’s adoption of I3C Basic for the DDR5 memory sideband. The increase in memory subsystem complexity with distributed power management, telemetry and thermal management at the sub-channel level requires higher sideband bus bandwidth, observes the company.

Demand for advanced thermal control loops, security and component authentication, and more robust fault tolerance and recovery are driving the need for a high bandwidth interface across the entire server control plane. I3C Basic enables system management architectures to provide granular information about the server resource status during boot-up and runtime. This allows system managers to implement effective workload migration and server load balancing to “significantly optimise” server utilisation.

The IMX3102 2:1 bus multiplexer is suitable for designs where there may be two masters controlling a single peripheral or slave devices. The IMX3112 1:2 bus multiplexer supports designs where a single host is controlling two peripheral or slave devices. The general-purpose I/O expanders, IXP3114 (with temperature sensor) and IXP3104 1:4 (without temperature sensor), are designed for a host controller with up to four peripheral or slave devices.

The new I3C products feature integrated temperature sensors. Unexpected motherboard temperature increases can result in costly system failures. Positioning temperature sensors in multiple locations on the motherboard allows engineers to continuously monitor for potential temperature spikes and direct the CPU to take action to prevent a catastrophic event.

Additional features include a two-wire programmable I2C or I3C Basic bus serial interface, a single device load on the host bus and single 1.8V input power supply. The integrated temperature sensor accuracy is 0.5 degrees C with 0.25 degrees C resolution and the industrial operating temperature range is -40 to +125 degrees C.

The devices are supplied in a thermally enhanced, nine-pin PSON-8 package, measuring 2.0 x 3.0mm.

The I3C devices and evaluation boards are sampling now to qualified customers.

http://www.renesas.com

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MiFare IC secures the future of contactless smart city services

Increased security for smart city installations is a feature of the MiFare DESFire EV3 IC, says NXP, claiming it ushers in a new era of security and connectivity for contactless smart city services.

It is the third evolution of NXP’s contactless MiFare DESFire portfolio. It is backwards compatible and offers enhanced performance with a greater operating distance and improved transaction speed. It is also claimed to deliver faster, more secure transactions that are truly contactless, such as paying for parking, accessing offices or campuses and using other essential city services; all touch-free.

The MiFare DESFire EV3 IC can be used by transit agencies, access control providers and system integrators.

The IC hardware and software are certified to Common Criteria EAL 5+, and the IC supports a broad choice of open crypto algorithms. A card-generated MAC helps to securely authenticate transactions, and a new Transaction Timer feature helps mitigate man-in-the-middle attacks making it harder for an attacker to interfere with a transaction. The new Secure Unique NFC (SUN) messaging feature is a secure method for maintaining data confidentiality and integrity. Each time a card, phone or ticket is tapped with the SUN feature enabled, an authentication message and crypto-secure URL are generated and sent to a server for verification, which makes taps unclonable, says NXP.

Support for MiFare DESFire EV3 will be integrated into NXP’s MiFare 2GO cloud service, which manages digitised MiFare product-based credentials and helps streamline mobile integration via NXP’s ecosystem. This will enable smart city services to be seamlessly deployed to NFC-enabled smartphones, wearables and other mobile devices, explains NXP.

For simplified deployment, each MiFare DESFire EV3 IC is pre-configured with keys to enable delegated application management, which supports seamless, over-the-air updates to already deployed smart cards using NFC-enabled smartphones.

NXP’s upcoming MiFare Plus EV2 IC will provide a drop-in replacement for upgrading existing MiFare Plus and MiFare Classic product-based installations to higher security.

http://www.nxp.com

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