ICs & Semiconductors

Bluetooth, Zigbee, Thread and multi-protocol modules from Silicon Labs reduce time-to-market for secure smart home, building and industrial automation applications.

The pre-certified wireless modules are claimed to be the only modules in the industry with full stack support for multi-protocol solutions to enable commercial and consumer IoT applications. y offer package options and integrated device security.

“Silicon Labs has mastered the challenges that come with adding wireless connectivity to IoT devices,” said Matt Saunders, vice president of IoT marketing and applications at Silicon Labs. The modules allow IoT device makers to get pre-certified and secure wireless devices quickly to market.

The integrated modules are available in multiple package options including system in package (SiP) and traditional PCB versions. SiP modules contain miniaturised components that remove the need for complicated RF design and certification by opening space-constrained IoT designs to module-based solutions, says Silicon Labs. PCB modules enable flexible pin access and additional options to extend RF performance.

The xGM210PB features Secure Vault, the ARM PSA Level 2-certified IoT device security, as well as dynamic multi-protocol support for Bluetooth, Zigbee, and OpenThread and supports Wi-Fi co-existence. It is optimised for IoT applications, such as connected lighting, gateways, voice assistants and smart meter in-home displays, xGM210PB modules offer up to +20dBM output power and better than -104dBm sensitivity.

The BGM220 is one of the world’s smallest Bluetooth modules, says Silicon Labs, and the first to support Bluetooth Direction Finding. The integrated, pre-certified Bluetooth 5.2 module delivers up to 10 years’ operation on a coin cell battery, making it suitable for appliances, asset tags, beacons, portable medical, fitness, and Bluetooth mesh low-power nodes.

The MGM220 is a low-power, low-cost module for lighting controls, building and industrial automation sensors as well as Zigbee Green Power and energy harvesting applications.

Finally, the BGX220 Xpress includes an on-board Bluetooth stack, Xpress command interface and pre-programmed cable replacement firmware to deliver serial to Bluetooth LE with no need for firmware development. The modules are suitable for industrial applications including human machine interface (HMI) devices, addressing size, safety, and environmental challenges.

The modules are supported in the free-of-charge Silicon Labs Simplicity Studio 5 integrated development environment (IDE), which has software stacks, application demos and mobile apps, network analyser and patented energy profiler. Developers can also use simple APIs from Silicon Labs Xpress modules.

Samples, production quantities and development kits for all four modules are available now.

http://www.silabs.com

Adaptive radio platforms are flexible for evolving 5G standards and with a hardened radio digital front end for performance, power, and cost effectiveness, says Xilinx.

The Zynq RFSoC DFE adaptive radio platform is designed to meet the evolving standards of 5G NR wireless applications. It combines hardened digital front end (DFE) blocks and adaptable logic to build low power, cost-effective 5G NR radio solutions for use cases ranging across 5G low-, mid-, and high- band spectrums. According to Xilinx, it offers the best balance of technologies between the cost economies of an ASIC which uses hardened blocks and the flexibility, scalability, and time-to-market benefits of a programmable and adaptive SoC.

5G radio must meet bandwidth, power, and cost challenges for widespread deployment, but must also adapt to the three key 5G use cases, i.e. enhanced mobile broadband, massive machine type communication, and ultra-reliable low-latency communication. They must also scale for evolving 5G standards such as OpenRAN (O-RAN) and new, disruptive 5G business models, Xilinx advises. Zynq RFSoC DFE integrates hardened DFE application-specific blocks for 5G NR performance and power savings yet also offers the flexibility to integrate programmable adaptive logic to enable a futureproof solution for evolving 5G 3GPP and O-RAN radio architectures.

“For the first time, Xilinx is providing a wireless radio platform with more hardened application-specific IP than adaptive logic to address low power and low cost 5G requirements,” said Liam Madden, executive vice president and general manager, Wired and Wireless Group at Xilinx. As the 5G landscape continues to evolve, it is imperative that integrated RF solutions are adaptable to address future standards. “Zynq RFSoC DFE provides the optimal balance between that adaptability and fixed function IP,” said Madden.

Zynq RFSoC DFE offers 2X performance-per-watt compared to the earlier generation of adaptive computing and scales from small cell to massive MIMO macrocells. It is claimed to be the industry’s only direct RF platform that enables carrier aggregation/sharing, multi-mode, multi-band 400MHz instantaneous bandwidth in all FR1 bands, and emerging bands up to 7.125GHz. When used as a mmWave intermediate frequency transceiver, it provides up to 1,600MHz of instantaneous bandwidth.

The Zynq RFSoC DFE architecture allows customers to either bypass or customise the hard IP blocks. For example, they can leverage Xilinx’s field-proven DPD that supports existing and emerging GaN power amplifiers or insert their own DPD IP.

Zynq RFSoC DFE design documentation and support is available to early access customers, with shipments expected during the first half of 2021.

http://www.xilinx.com