Xilinx introduces Zynq RFSoC DFE for mass 5G radio deployments

Adaptive radio platforms are flexible for evolving 5G standards and with a hardened radio digital front end for performance, power, and cost effectiveness, says Xilinx.

The Zynq RFSoC DFE adaptive radio platform is designed to meet the evolving standards of 5G NR wireless applications. It combines hardened digital front end (DFE) blocks and adaptable logic to build low power, cost-effective 5G NR radio solutions for use cases ranging across 5G low-, mid-, and high- band spectrums. According to Xilinx, it offers the best balance of technologies between the cost economies of an ASIC which uses hardened blocks and the flexibility, scalability, and time-to-market benefits of a programmable and adaptive SoC.

5G radio must meet bandwidth, power, and cost challenges for widespread deployment, but must also adapt to the three key 5G use cases, i.e. enhanced mobile broadband, massive machine type communication, and ultra-reliable low-latency communication. They must also scale for evolving 5G standards such as OpenRAN (O-RAN) and new, disruptive 5G business models, Xilinx advises. Zynq RFSoC DFE integrates hardened DFE application-specific blocks for 5G NR performance and power savings yet also offers the flexibility to integrate programmable adaptive logic to enable a futureproof solution for evolving 5G 3GPP and O-RAN radio architectures.

“For the first time, Xilinx is providing a wireless radio platform with more hardened application-specific IP than adaptive logic to address low power and low cost 5G requirements,” said Liam Madden, executive vice president and general manager, Wired and Wireless Group at Xilinx. As the 5G landscape continues to evolve, it is imperative that integrated RF solutions are adaptable to address future standards. “Zynq RFSoC DFE provides the optimal balance between that adaptability and fixed function IP,” said Madden.

Zynq RFSoC DFE offers 2X performance-per-watt compared to the earlier generation of adaptive computing and scales from small cell to massive MIMO macrocells. It is claimed to be the industry’s only direct RF platform that enables carrier aggregation/sharing, multi-mode, multi-band 400MHz instantaneous bandwidth in all FR1 bands, and emerging bands up to 7.125GHz. When used as a mmWave intermediate frequency transceiver, it provides up to 1,600MHz of instantaneous bandwidth.

The Zynq RFSoC DFE architecture allows customers to either bypass or customise the hard IP blocks. For example, they can leverage Xilinx’s field-proven DPD that supports existing and emerging GaN power amplifiers or insert their own DPD IP.

Zynq RFSoC DFE design documentation and support is available to early access customers, with shipments expected during the first half of 2021.

http://www.xilinx.com  

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Integrated ToF module is multi-zone

Offering an increased camera field of view (FoV) coverage and spatial resolution, the VL53L5 FlightSense time of flight (ToF) sensors are believed to be the first 64-zone devices. The sensors from STMicroelectronics breaks a scene into separate areas to help an imaging system build the most detailed spatial understanding of a scene, the company says.

It has a 940nm vertical cavity surface emission laser (VCSEL) light source, an SoC sensor integrating a VCSEL driver, the receiving array of 40nm single photon avalanche diodes (SPADs), and a low-power 32-bit MCU core and accelerator running firmware.

The SPAD array can be set to favour spatial resolution, where it outputs all 64 zones at up to 15 frames per second, or to favour maximum ranging distance, where the sensor outputs 4×4/16 zones at a frame rate of 60 frames per second.

The miniature module contains optical elements in the receive aperture to create the 64 ranging zones. Range is 4m.

Eric Aussedat, general manager of ST’s imaging division, said that the VL53L5 delivers “64x more ranging zones than previously available . . . [and] performance improvement in laser auto focus, touch-to-focus, presence detection, and gesture interfaces while helping developers create even more innovative imaging applications.”

ST’s ToF technology includes human-presence detection to control the wake up and hibernation of laptops or monitors and laser autofocus in hybrid focusing algorithms for smartphone cameras. The auto focus feature is embedded in most of the highest-ranking smartphone cameras according to DXOMARK, an independent benchmark that assesses image quality.

Laser auto focus assures quick, accurate focusing in low-light scenes or when capturing low-contrast targets.

ST says that key smartphone and PC platform suppliers have pre-integrated the sensor onto platforms. Android and Windows device drivers are widely available for the FlightSense modules.

The VL53L5 is packaged in a 6.4 x 3.0 x 1.5mm module and integrates both transmit and receive lenses and has and expanded FoV of 61 degrees diagonal. This wide FoV is especially suited to detect off-centre objects and ensure perfect auto focus in the corners of the image.

For laser auto focus, the VL53L5 gathers ranging data from up to 64 zones across the full FoV.

ST’s architecture can automatically calibrate each ranging zone and direct ToF technology allows each zone to detect multiple targets and reject reflection from the cover-glass. FlightSense also gathers the raw data collected by the SPAD array and performs post processing, via a proprietary, embedded MCU and accelerator before transferring the ranging data to the system host over an I2C or a SPI bus. This removes the need for a specific camera interface and powerful receiver MCU.

The VL53L5 retains the Class 1 certification of all ST’s FlightSense sensors and is fully eye-safe for consumer products. It is in mass production with millions of units already shipped to leading wireless and computer manufacturers, says ST.

http://www.st.com

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MCUs integrate peripherals for sensor-based IoT applications

Sensor-based IoT applications use a combination of analogue functionality and digital control capability to meet cost, size, performance and power parameters for efficiency. In response, Microchip has combined analogue peripherals and multi-voltage operation with inter-peripheral connections in its PIC18-Q41 and AVR DB MCU families. In addition to these attributes for increased system integration and reduced signal acquisition times, they offer the convenience and efficiency of operating in a single design environment, says Microchip.

The introduction bring s easy-to-use analogue capability to cost-effective PIC and AVR MCUs, says Greg Robinson,  so designers can meet the requirements of large-scale IoT systems,” said Greg Robinson, associate vice president of marketing for Microchip’s 8-bit microcontroller business unit. “With a unified, seamless development tool experience, designers can use these MCUs as a single-chip controller, or as an intelligent analogue signal conditioning component in a larger system,” he explained.

The PIC18-Q41 MCU has a configurable operational amplifier and ADC with computation and DACs for signal conditioning in space-constrained sensing and measuring applications such as IoT end nodes and industrial, medical devices, wearables, automotive and lighting systems. It is also well-suited for IoT and large-scale artificial intelligence (AI) at the edge, including predictive maintenance edge nodes in a smart factory, added Microchip. It is offered in compact 14- and 20-pin packages and can be used with Microchip’s 32-bit MCUs and other controllers that require analogue integration.

For mixed-signal IoT systems which often include multiple power domains, the AVR DB MCU integrates true bi-directional level shifters to reduce cost. Typical use examples are automotive, appliances, HVAC and liquid measurement applications. Microchip has added three configurable op amps, a 12-bit differential ADC, 10-bit DAC, three zero cross detectors and Core Independent Peripherals (CIPs) enabling the AVR DB MCU to be used wherever analogue signal conditioning and processing functions are required.

The PIC18-Q41 and AVR DB MCU families are supported by Microchip’s MPLAB X integrated development environment (IDE), its MPLAB Code Configurator (MCC) and the MPLAB Mindi Analog Simulator. MCC is a free software plug-in that provides a graphical interface to configure peripherals and functions specific to an application.

The AVR DB is additionally supported by Atmel START, Atmel Studio and third-party tools such as IAR and the GCC C compiler.

The PIC18F16Q41 Curiosity Nano evaluation kit (EV26Q64A) and the AVR DB Curiosity Nano evaluation kit (EV35L43A) are also available with programming and debugging capabilities.

http://www.microchip.com

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UWB ICs enable emerging use cases for the IoT

Secure ultra-wideband (UWB) technology ICs have been added to NXP’s portfolio. The Trimension SR040 and SR150 ICs deliver “relative position” with a very high level of accuracy, says NXP to enable new IoT use cases such as smart locks and real-time location system (RTLS) tags.

“To accelerate the adoption of UWB and create meaningful new experiences, smart edge devices need to gain spatial awareness, whether it’s a smartphone, car, or different IoT device form factor,” said Rafael Sotomayor executive vice president of BL Connectivity & Security with NXP. “Imagine the possibilities of moving through daily life with fewer barriers as devices anticipate our actions,” he proposed.

UWB technology enables doors to lock and unlock in response to the owner’s presence; cars can be shared with a simple touch of a screen or accessed hands free; smart home automation systems follow their owners intuitively and efficiently from one room to another. Another advantage is that people spend less time searching because misplaced items can be tracked instantly.

A fine-ranging capability will also enable new location-based services and device-to-device IoT applications in consumer products and industrial applications.

The Trimension SR150 adds angle-of-arrival (AoA) technology to increase precision. It is suitable for UWB in larger infrastructures, such as access control installations, indoor localisation set ups, and payment schemes, as well as consumer electronics. For example, several SR150 IC devices can be placed in a room as UWB anchors to help localise people and objects as they move.

The Trimension SR040 is optimised for low power operation, and is intended for use in battery-operated IoT devices, including UWB trackers and tags. It can be integrated with Bluetooth Low Energy or other connectivity controllers in one device.

NXP also offers Trimension OL23D0, an open, customer programmable UWB controller for IoT applications.

Trimension SR150 and SR040 ICs are available in modules and development kits supplied by selected NXP partners.

http://www.nxp.com

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