PCIe board brings AI to the edge

Combining the Flex Logix InferX X1 edge inference accelerator chip with Winbond Electronics’ LPDDR4X DRAM, the former’s half-height, half-length PCIe embedded processor board is designed for demanding artificial intelligence (AI) applications, such as object recognition delivered via edge servers and gateways.

The Winbond LPDDR4X chip is paired with Flex Logix’s InferX X1 edge inference accelerator chip, which is based on an architecture that features arrays of reconfigurable Tensor processors. According to the company, this provides higher throughput and lower latency at lower cost than any other existing AI edge computing when processing complex neural networking algorithms such as YOLOv3 or Full Accuracy Winograd.

To support the InferX X1’s 7.5Terra operations per second (maximum) performance, the W66CQ2NQUAHJ 4Gbit LPDDR4X DRAM offers a maximum data rate of 4267Mbits per second at a maximum clock rate of 2133MHz. To enable use in battery-powered systems and other power-constrained applications, the W66 series device operates in active mode from 1.8V or 1.1V power rails, and from a 0.6V supply in quiescent mode. It offers power saving features including partial array self-refresh.

The 4Gbit W66CQ2NQUAHJ is comprised of two 2Gbit dies in a two-channel configuration. Each die is organised into eight internal banks which support concurrent operation.

Flex Logix’s half-height, half-length PCIe embedded processor board takes advantage of Flex Logix’s architecture which includes reconfigurable optimised data paths which reduce the traffic between the processor and DRAM, to increase throughput and reduce latency.

According to Robert Chang, technology executive of DRAM product marketing at Winbond:  “The price/performance advantage of using InferX with our LPDDR4X chip has the potential to significantly expand AI applications by finally bringing inference capabilities to the mass market.”

Dana McCarty, vice president of sales and marketing for Flex Logix’s AI inference products agreed: “The combination of the unique InferX X1 processor and Winbond’s high-bandwidth LPDDR4X chip sets a new benchmark in edge AI performance. Now for the first time, affordable edge computing systems can implement complex neural networking algorithms to achieve high accuracy in object detection and image recognition even when processing data-intensive high-definition video streams.”

https://flex-logix.com

http://www.winbond.com

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SiP integrates cellular and GNSS technology

Swiss positioning and wireless communication specialist, u-blox, has integrated low power wide area (LPWA) connectivity and a global navigation satellite system (GNSS) technology into a small system in package (SiP) form factor. The Alex-R5 is a miniature cellular module designed for size-constrained asset tracking, wearable and healthcare applications.

It features the secure u-blox UBX-R5 LTE-M / NB-IoT chipset with Secure Cloud functionality and the u-blox M8 GNSS chip for location accuracy.

Alex-R5 has a small footprint of 14 x 14mm footprint. The SiP design reduces its size by half, compared to the functionally equivalent u-blox SARA-R5 module.

Its 23dBm cellular transmission power guarantees that end devices operate effectively in all signal conditions, even at cell edges, underground, or in other challenging scenarios. A dedicated GNSS antenna interface enables fully independent, simultaneous operation of the u-blox M8 GNSS chip, matching the performance of a stand-alone u-blox M8 module. To further enhance positioning, there is the u-blox IoT Location-as-a-Service with CellLocate and AssistNow (online, offline, and autonomous).

Alex-R5 is optimised for power-sensitive and battery-dependent applications, says u-blox, including wearables and connected medical devices. The lower power modes of the u-blox UBX-R5 and UBX-M8 chipsets give users options to balance power consumption and performance using GNSS Super-E mode.

The rugged SiP construction is suitable for harsh environments, where moisture or vibration would be a concern for conventional modules, says u-blox. Alex-R5 is rated at moisture sensitivity level 3 (MSL 3), offering reduced handling and device production complexity.

u-blox guarantees long-term device availability and provides lifetime support for the entire platform, down to the chipset level. Secure Cloud functionality supporting IoT-Security-as-a-Service based on an internal, hardware-based secure element enables a pre-shared key management system specifically designed for LPWA devices.

In addition, Alex-R5 futureproofs IoT devices and networks by enabling customers to software upgrade deployed devices for compatibility with 5G networks in a seamless transition as 5G networks are rolled out by mobile operators.

Engineering samples of the Alex-R5 SiP will be available by Q1, 2021.

http://www.u-blox.com

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STMicroelectronics simplifies portable GNSS receiver design

Claimed to simplify design and save real estate in global navigation satellite system (GNSS) receivers, the BPF8089-01SC6 RF is an integrated impedance-matching and protection IC from STMicroelectronics.

Integrating the impedance-matching and electrostatic discharge (ESD) protection circuitry, typically implemented using discrete components, results in a much smaller footprint, says STMicroelectronics.

The BPF8089-01SC6 provides a 50 Ohm matched interface between the receiver’s antenna and low noise amplifier (LNA), and is ready to use with ST’s STA8089 and STA8090 LNAs. The compact, integrated device typically replaces a matching network containing up to five capacitors, resistors, and inductors, as well as two discrete protection devices. Designers can also leverage PCB-track specifications provided in the device datasheet for optimal performance.

The ESD protection provided complies with IEC 61000-4-2 (C = 150pF, R = 330Ω) and exceeds level 4: 8kV for contact discharge and 15kV for air discharge. The device also withstands 2kV pulse voltage in accordance with MIL STD 883C (C = 100pF, R = 1.5 kOhm).

The BPF8089-01SC6 is suitable for use in portable satellite receivers for GPS, Galileo, GLONASS, BeiDou, and QZSS constellations, which may be used in a number of applications including consumer satellite navigation, radio base stations, drones, and tracking of assets or livestock.

The IC is part of ST’s ASIP (Application Specific Integrated Passives) product range. It is housed in a SOT23-6L package that is compatible with automatic optical inspection. It is in production now.

http://www.st.com

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Renesas boosts AI with Arm Cortex-A55 on RZ/G2L microprocessors

Renesas has announced the expansion of its RZ/G2 general-purpose 64-bit microprocessors, with improved artificial intelligence (AI) processing.

The company has added three entry level microprocessor models built around the Arm Cortex-A55 core. The RZ/G2L, RZ/G2LC, and RZ/G2UL join the mid- to high-end RZ/G2E, RZ/G2N, RZ/G2M, and RZ/G2H microprocessors. Renesas adds that the seven RZ/G2 microprocessors provide scalability from entry-level to high-end design.

The RZ/G2Lx microprocessors’ Arm Cortex-A55 CPU core delivers approximately 20 per cent improved processing performance compared with the previous Cortex-A53 core. It also provides approximately six times faster essential processing for AI applications, says the company.

The latest microprocessors integrate camera input interfaces, a 3D graphics engine, and a video codec, for human machine interface (HMI) applications, such as multimedia processing, graphical user interface (GUI) rendering and AI image processing. The microprocessors also feature the Cortex-M33 core, to perform real-time processing for tasks such as sensor data collection without the need for external microcontrollers.

Hiroto Nitta, senior vice president and head of SoC Business, IoT and Infrastructure business unit at Renesas, explained that, with the entry-level products, Renesas is accelerating adoption of the Linux OS on high-performance microprocessors, for innovation to improve performance and enhance functionality in HMI devices, while driving down the overall cost.

“With AI transforming our daily lives, greater on-device compute capabilities are required to provide real-time insights for billions of IoT endpoints,” said Dipti Vachani, senior vice president and general manager, of Automotive and IoT at Arm. “By incorporating Arm technology in its latest 64-bit microprocessors, Renesas is accelerating the adoption of endpoint AI by enabling higher-performance IoT devices capable of processing more intelligence on the device,” he added.

The new entry-level RZ/G2L microprocessors feature error checking and correction (ECC) protection for both on-chip memory and external DDR memory. There is also a Verified Linux Package (VLP) featuring a Civil Infrastructure Platform (CIP) Linux – an industrial-grade Linux offering guaranteed support and security maintenance for more than 10 years. This makes it possible to reduce future maintenance costs, says Renesas. Additionally, support for security functions means that customers can also confidently adopt the RZ/G2L microprocessors for industrial applications requiring high reliability and extended service life, making it possible to bring products to market quicker.

For cases where more sophisticated AI functionality may be required, Renesas plans to enhance the functions and performance of the RZ/G2L microprocessors with its DRP-AI, AI accelerator.

Samples of the new microprocessors MPUs are shipping today, with mass production scheduled to commence sequentially beginning in August 2021.

An evaluation board can be reserved to get an early start evaluating applications for RZ/G2L microprocessors. Reference designs (circuit diagrams and board layout data) are available now.

Renesas is currently developing power management IC (PMIC) products optimised for the RZ/G2L Group. These are scheduled for release later this year.

 http://www.renesas.com

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