ICs & Semiconductors

Communication timing options from Renesas Electronics now include three low phase noise, high frequency RF timing devices for 4G and 5G radio. The 8V19N850 radio synchroniser and 8V19N880, 8V19N882 JESD204B/C clock jitter attenuators deliver ITU-T-compliant network clock synchronisation. They are also claimed to have best-in-class phase noise and high clock frequency.

The 8V19N850 radio synchroniser is claimed to be the industry’s first integrated 5G radio synchronisation device. It is equipped with a complete set of features for radio synchronisation on a single chip, including full ITU-T G.8273.2 T-BC/T-TSC Class C, ITU-T G.8262.1 enhanced SyncE, and JESD204B/C compliance. The 8V19N850 also takes care of recovering the clock from CPRI/eCPRI, per IEEE 802.1cm front haul synchronisation requirements, making it suitable for use in emerging 5G O-RAN networks for radio units (O-RU).

The 8V19N880 and 8V19N882 JESD204B/C clock jitter attenuators deliver low phase noise. They offer jitter performance as low as 74fs RMS and -90dB spurious attenuation for mission-critical industrial data converter applications in wireless radio, test and measurement, instrumentation, and high performance imaging. They support frequencies up to 3932.16MHz (up to 6GHz with an external VCO) and feature 16 and 18 integrated differential outputs with low power consumption and 1.8V support.

The devices are also featured in Renesas’ two Winning Combinations, designed to address increasing demand for higher bandwidth for cellular services. The Small Cell Radio and MIMO Radio Combinations use mutually compatible devices for lower risk and faster time to market. They also showcase the combined benefits of the new RF timing ICs paired with Renesas’ complementary microcontroller and power management offerings to accelerate solution design.

The 8V19N850, 8V19N880 and 8V19N882 RF timing ICs are available now.

Renesas Electronics delivers semiconductors that enable billions of connected, intelligent devices to enhance the way people work and live. Its portfolio includes microcontrollers, analogue, power, and SoC products, for a broad range of automotive, industrial, Infrastructure, and IoT applications.

http://www.renesas.com

Xilinx has expanded its UltraScale portfolio, with new Artix (pictures) and Zynq UltraScale+ devices for applications which require compact form factors and intelligent edge processing.

The new Artix and Zynq UltraScale+ devices are in compact form factors that are 70 per cent smaller than traditional chip-scale packaging. The 16nm technology devices are in TSMC’s Integrated Fan-Out (InFO) packaging technology and are intended for use in industrial, vision, healthcare, broadcast, consumer, automotive and networking markets.

“Demand for compact, intelligent edge applications is driving the requirement for processing and bandwidth engines to not only provide higher performance, but also new levels of compute density to enable the smallest form factor systems,” said Sumit Shah, senior director, Product Line Management and Marketing at Xilinx. “The new cost-optimised additions . . . . leverage the architecture and production-proven technology of Xilinx’s UltraScale+ FPGAs and MPSoCs.”

The Artix UltraScale+ uses proven FPGA architecture and is suitable for a range of applications including machine vision with advanced sensor technology, high-speed networking, and compact 8K-ready video broadcasting. They deliver 16Gbits per second transceivers to support emerging and advanced protocols in networking, vision, and video. They also deliver the highest DSP compute in its class, said Xilinx.

The new ZU1 and the production-proven ZU2 and ZU3 devices are all in InFO packaging to expand the Zynq UltraScale+ MPSoC range. The ZU1 is designed for connectivity at the edge and for industrial and healthcare IoT systems, including embedded vision cameras, AV-over-IP 4K and 8K-ready streaming, handheld test equipment, as well as consumer and medical applications. It is built for miniaturised compute-intensive applications and is powered by a heterogeneous Arm processor-based multi-core processor subsystem. It is also able to migrate to common package footprints for greater compute performance.

Both the Artix and Zynq UltraScale+ families include the same security features found across the UltraScale+ portfolio, namely RSA-4096 authentication, AES-CGM decryption, DPA countermeasures. They also include Xilinx’s proprietary Security Monitor IP that adapts to security threats across the product life cycle, and which meets the security needs for both defence and commercial projects.

The first Artix UltraScale+ devices are expected to be available in production by Q3 2021, with Vivado Design Suite and Vitis Unified Software Platform tool support starting late summer. Zynq UltraScale+ ZU1 devices will also begin sampling in Q3 with tool support in Q2, with volume production beginning Q4.

The cost-optimised Artix devices and the extension to the Zynq UltraScale+ family join the company’s high-end Virtex UltraScale+ and the midrange Kintex UltraScale+   offerings to provide scalability across a single platform.

http://www.xilinx.com