ICs & Semiconductors Archives - Page 143 of 230

SiTime extends temperature range of Endura MEMS Super-TCXO

Thu, Apr 29, 2021

Expanding the reach of the Endura MEMS Super-TCXO in to airborne and cold temperature terrestrial applications, SiTime announces that the TCXO now has an operating temperature range beyond its original -40 degrees C. It can now support -55 degrees C.

This enables the Endura SiT5146 to deliver best-in-class stability over -55 to +105 degrees C, says SiTime and is therefore able to be used in low earth orbiting (LEO) satellites, commercial aircraft, satellite communication systems, and rocket delivery systems as well as terrestrial systems residing in extremely cold environments

Aerospace and defence applications depend on precise and stable timing in the presence of extreme temperatures,” said Piyush Sevalia, executive vice president of marketing at SiTime. “Through our rapid-release derivatives program, we extended the operating temperature range of the SiT5146 to -55 degrees C while maintaining ±1 to ±2.5 ppm stability and excellent performance in the presence of shock and vibration,” he continued.

SiTime’s Endura SiT5146 MEMS Super-TCXO is available 0.009 ppb/g and 0.1 ppb/g acceleration sensitivity options. The ruggedised Super-TCXO can withstand high levels of shock and vibration. Frequencies are programmable with six decimals of accuracy from 1.0 to 60MHz.

The SiT5146 can be factory programmed for any combination of frequency, stability, voltage, and pull range, enabling shorter lead times. The device is available now in a 5.0 x 3.2mm package in the production quantities.

SiTime specialises in silicon MEMS timing. It offers programmable solutions that enable customers to differentiate their products with higher performance, smaller size, lower power, and better reliability.

http://www.sitime.com

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Simplified design for FemtoClock2 lowers power budget for data centres

Wed, Apr 28, 2021

With jitter as low as 64fs RMS, the FemtoClock2 family is available in a small 4.0 x 4.0mm2 24- and 28-pin QFN package options from Renesas Electronics. Power consumption is just 600mW.

The sub-100fs point-of-use clock is designed for data centre, server and network infrastructure markets. The FemtoClock2 family includes low jitter clock generators and jitter attenuators in a single package, enabling cost-effective and simple clock tree implementation for next generation, high speed interconnect designs.

The best-in-class jitter enables customers to easily meet next-generation PAM4 requirements on new switch or router designs, says Renesas. The form factor makes it less than one third the size of similar products available today, says the company. Designers can place the clock source at the point of use – very close to the device receiving the clock signal – for streamlined PCB layout design, reduced cross talk, and cleaner signals. The FemtoClock2 can be configured as a DCO, clock generator, or jitter attenuator.

“PAM4 technology is enabling a major leap in data transmission rates in both communications and data centre segments resulting in stringent requirement on the clock in such systems,” said Bobby Matinpour, vice president of Renesas’ timing products, data centre business division. The small size of the FemtoClock allows it to be placed anywhere on the board at the point of use. “This greatly simplifies the design by eliminating the additive jitter associated with the extensive clock routing on the board,” said Matinpour.

Customers can combine the FemtoClock2 with Renesas’ small, single-output, high-performance oscillators, or the broader ClockMatrix portfolio of timing solutions to address challenging timing needs for their high-performance server and network infrastructure designs. FemtoClock2 also works seamlessly with systems using the recently introduced PTP Clock Manager software for IEEE 1588 support, and can be combined with Renesas’ complementary power and microcontroller offerings to create comprehensive solutions for a variety of applications, such as the IEEE 1588 Winning Combination. FemtoClock2 also serves as the downstream clock capable of delivering 100fs at the pin without disrupting the synchronization.

The RC32504A and RC22504A FemtoClocks and an evaluation board are available now.

Renesas Electronics supplies microcontrollers, analogue, power, and SoC products for automotive, industrial, infrastructure and IoT applications.

http://www.renesas.com

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White chip LEDs save space in IoT devices and drones

Fri, Apr 23, 2021

Compact high luminous intensity white chip LEDs from Rohm are optimised for applications which require high brightness white light emission. The CSL1104WB LEDs are intended for IoT devices, drones, and other battery equipped applications.

High luminous intensity (2.0cd) white LEDs are being increasingly adopted to improve visibility in a range of applications in the consumer electronics and automotive sectors. At the same time, the emergence of applications that mount multiple LEDs in a small space – for example IoT devices and drones – require high density mounting. This makes it difficult to achieve high brightness in a compact footprint, explains Rohm.

The CSL1104WB series achieves a high luminous intensity of 2.0cd in an ultra-compact 1608 size (1.6 x 0.8mm for 1.28mm²), which was previously difficult to achieve. The result is the same luminosity as the current mainstream 3528 size PLCC package (3.5 x 2.8mm or 9.8mm²) but in an 87 per cent smaller form factor.

Colour variation is significantly improved, simplifying the colour adjustment process by ensuring accurate white colour chromaticity, says Rohm. This contributes to space savings, but also improves design flexibility along with visibility through high density mounting of high luminosity LEDs. Qualification under the automotive reliability standard AEC-Q102 is specifically developed for optical devices is planned, enabling a smooth application inside industrial equipment and automotive applications that are exposed to harsh environments.

Rohm is committed to expand its line up of 1608 size white chip LEDs from low to high brightness.

Rohm Semiconductor develops and manufactures a large product range from SiC diodes and MOSFETs, analogue ICs such as gate drivers and power management ICs to power transistors and diodes to passive components. The company has manufacturing plants in Japan, Korea, Malaysia, Thailand, the Philippines, and China.

Lapis Technology and Lapis Semiconductor (former OKI Semiconductor), SiCrystal and Kionix are companies of the Rohm Semiconductor Group. Rohm Semiconductor Europe has its head office near Dusseldorf, Germany serving the EMEA region (Europe, Middle East and Africa).

http://www.rohm.com/eu

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Synopsys bundles design engines for hyper-convergent ICs

Fri, Apr 23, 2021

For memory, artificial intelligence (AI), automotive and 5G applications, the PrimeSim design environment provides comprehensive analysis, improved productivity, says Synopsys.

At the SNUG World international user conference, Synopsys unveiled the PrimeSim Continuum. This is a unified workflow for circuit simulation technologies to accelerate the creation and signoff of hyper-convergent designs. PrimeSim Continuum is built on next-generation Spice and FastSpice architectures and is the industry’s only proven GPU acceleration technology, claims Synopsys. It provides design teams 10X runtime improvements with golden signoff accuracy, says the company. PrimeSim Continuum combines PrimeSim Spice, PrimeSim Pro, PrimeSim HSpice and PrimeSim XA. PrimeWave delivers a seamless simulation experience around all PrimeSim engines with comprehensive analysis, improved productivity and ease of use.

“PrimeSim Continuum represents a revolutionary breakthrough in circuit simulation innovation with heterogeneous compute acceleration on GPU/CPU, setting a new bar for EDA solutions,” said Sassine Ghazi, chief operating officer (COO) at Synopsys. The PrimeSim Continuum technologies complement the company’s Custom Design Platform and Verification Continuum, continued Ghazi.

Today’s hyper-convergent SoCs consist of larger and faster embedded memories, analogue front-end devices and complex I/O circuits that communicate at 100Gb+ data rates with the DRAM stack connected on the same piece of silicon in a system-in-package (SiP) design. Verifying complex designs at advanced technology process nodes present increased parasitics, process variability and reduced margins, reports Synopsys. This results in more simulations with longer runtimes at higher accuracy impacting the overall time-to-results, quality-of-results and cost-of-results. PrimeSim Continuum addresses the systemic complexity of such hyper-convergent designs with a unified workflow of sign-off quality simulation engines tuned for analogue, mixed-signal, RF, custom digital memory designs, says Synopsys. PrimeSim Continuum uses next-generation Spice and FastSpice architectures and heterogenous computing to optimise the use of CPU and GPU resources and improve time-to-results and cost of results.

The PrimeSim Pro simulator represents a next-generation FastSpice architecture for fast and high-capacity analysis of modern DRAM and Fflash memory designs.

The PrimeSim Spice simulator’s next-generation architecture with GPU technology delivers significant performance improvements needed to perform comprehensive analysis for analogue and RF design while meeting signoff accuracy requirements.

The PrimeSim Continuum integrates PrimeSim Spice and PrimeSim Pro with the PrimeSim HSpice simulator for foundation IP and signal integrity and the PrimeSim XA simulator, for SRAM and mixed-signal verification. PrimeWave delivers a seamless experience by providing a consistent and flexible environment across all PrimeSim Continuum engines optimising design set-up, analysis and post-processing, says Synopsys.

PrimeSim Continuum is available now.

https://www.synopsys.com

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SiTime extends temperature range of Endura MEMS Super-TCXO

Simplified design for FemtoClock2 lowers power budget for data centres

White chip LEDs save space in IoT devices and drones

Synopsys bundles design engines for hyper-convergent ICs

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