Infineon combines MEMS and automotive expertise for Xensiv microphone

High performance, low noise MEMS microphones are increasingly popular inside and outside of vehicles because of noise quality and hands-free operation. Infineon says it has combined its expertise in the automotive industry, with its MEMS microphones technical know-how to develop the Xensiv IM67D130A. It is claimed to be the first microphone in the market to be qualified for automotive applications.

The Xensiv IM67D130A microphone has a wide operating temperature range of -40C to +105 degrees C for use in harsh automotive environments. The high acoustic overload point (AOP) of 130dB sound pressure level (SPL) allows the microphone to capture distortion-free audio signals in loud environments, enabling it to be effective whether placed inside or outside of the vehicle. The IM67D130A can be used for in-cabin applications such as hands-free systems, emergency calls, in-cabin communication and active noise cancellation (ANC). For exterior applications, it can be used in, for example, siren or road condition detection. Its use allows sound to be a further, complementary sensor for advanced driver assistance systems (ADAS) and predictive maintenance.

The high signal-to-noise ratio (SNR) of 67dB combined with low distortion level are designed for optimum speech quality and speech intelligence for speech recognition applications. The microphones have tight sensitivity matching allowing optimised beamforming algorithms for multi-microphone arrays, added Infineon.

The Xensiv MEMS microphone IM67D130A is qualified for the AEC-Q103-003 standard for automotive applications and available now in PG-LLGA-5-4 package.

http://www.infineon.com

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MxFE digitiser targets aerospace and defence applications

From Analog Devices comes a 16-channel, mixed-signal front-end (MxFE) digitiser for aerospace and defence applications, including phased array radars, electronic warfare, and ground-based satellite communications.

The new digitiser includes four AD9081 or four AD9082 software-defined, direct RF sampling transceivers. It is designed to accelerate customer development by providing reference RF signal chains, software architectures, power supply designs, and application example code.

ADI has also introduced a digitising card to complement the platform and facilitate system-level calibration algorithms and demonstration of power-up phase determinism.

The ADQUADMXFE1EBZ 16-channel, mixed-signal front-end digitiser offers 16 FR receive (Rx) channels (32 digital Rx channels) and 16 RF transmit (Tx) channels (32 digital Tx channels). It provides application-specific examples in MatLab application scripts and a GUI, and has flexible clock distribution.

The ADQUADMXFE-CAL digitising card key provides both individual adjacent channel loopback and combines channel loopback options, combined Tx and Rx channels output via SMA connectors and on-board log power detectors with AD5592R digitisation.

Analog Devices is a global high-performance semiconductor company dedicated to solving tough engineering challenges.

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Sondrel presents its second reference platforms for faster ASIC design

Sondrel has launched the second in its family of reference designs for ASICs that provide a framework to support a customer’s own IP. The SFA250A is aimed at functional safety (FuSa) applications such as advanced driver assistance systems and contains an independent FuSa monitor compliant to ISO 26262 ASIL D – ASIC safety subsystem. Individual subsystems are responsible for the detection and, where applicable, the correction of errors. The SFA 250A has been designed to be easy to adapt to suit the support needs of the customer’s IP as it is scalable, both in terms of function and performance, as well as modular as multiple versions can be combined to form larger solutions.

“So often a customer has created innovative IP but has no idea how to implement this in a chip which is a high-risk scenario,” explained Graham Curren, Sondrel’s CEO. “We are a very safe pair of hands as we have done this hundreds of times over the years for customers. We have drawn on this experience to create the Architecting the future family of IP platforms that are each targeted at specific application areas. Each platform has been designed so that the customer’s IP can easily be integrated into it giving up to 30 per cent reduction in costs, risk and time to market.”

Ben Fletcher, Sondrel’s director of engineering, added: “Reducing risk is massively important for any complex chip design. Sondrel is constantly refining and improving processes to keep increasing the reliability and predictability of the work that we do, and avoid costly delays to customer schedules. Our detailed design practices help us to more easily deliver demanding projects that require the added dimension of functional safety.”

Sondrel emphasises that for those that work in a functional safety environment, safety has to be a top priority. This philosophy has enabled the company to work on FuSa designs for many companies including automotive designs to the ISO 26262 standard.

To further reduce risk and time to market, Sondrel offers a full turnkey service that turns designs into fully tested, shipping silicon.

http://www.sondrel.com

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eSIM with boostrap profile provides immediate link in IoT Discovery kit

Developers of cellular IoT devices that connect to the internet through LTE-Cat M and NB-IoT networks can now call on STMIcroelectronics B-L462E-CELL1 Discovery kit which includes GSMA-certified embedded SIM (eSIM).

The kit features an ultra-small size all-in-one cellular module from Murata which, as well as the ST4SIM-200M GSMA-certified embedded eSIM, embeds ST’s ultra-low-power STM32L462 microcontroller and an LTE-M/NB-IOT chipset. The eSIM is pre-programmed with a bootstrap connectivity profile from Truphone, one of ST’s authorised partners. The kit leverages out-of-the-box data connectivity and enables remote SIM provisioning and SIM over-the-air updates. The user can immediately start the board by connecting to a power supply using a USB cable or inserting three AAA batteries in the connector provided before activating the eSIM to let the board connect to a cellular network to begin developing the application.

The B-L462E-CELL1 kit is designed to resist cellular connectivity attacks owing to the ST4SIM-200M eSIM solution based on the ST33 Arm SecurCore SC300 secure element, which is CC EAL5+ and GSMA SGP.02 v3.2 certified. The ST4SIM is ready to host a Root-of-Trust applet for enhanced protection against cyber-attacks.

A set of on-board sensors helps simplify development of motion- and environmental-monitoring solutions. They comprise ST’s LSM303AGR accelerometer-magnetometer, HTS221 relative humidity and temperature sensor, and LPS22HH pressure sensor. There is also a 0.96-inch OLED display, indicator LEDs and a USB connection.

The STM32Cube software expansion package, X-Cube-Cellular drives the Discovery kit and supports the Berkeley (BSD) sockets application programming interface. BSD’s standardised function-calls for Internet communication let users connect their prototypes to the internet without needing to develop an AT-command driver to control the modem. X-Cube-Cellular includes a demonstration application and cellular framework in source code, which ST says is easily imported and configured using the powerful, free STM32Cube software toolset.

With ST’s ultra-low-power technologies in the STM32L4, which draws about 2-microA in Stop 2 mode, and a cellular chipset drawing less than 1.4-microA in power saving mode, the B-L462E-CELL1 Discovery kit provides a platform to develop equipment with battery life of up to 10 years for smart-city, smart-industry, smart-agriculture, smart-metering, and wearable applications.

http://www.st.com/b-l462e-cell1

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