ICs & Semiconductors

Developed with the Clean Sky consortium, Microchip’s BL1, BL2 and BL3 families are qualified to stringent aerospace standards for AC/DC and DC/AC power conversion

To enable next-generation aircraft electrical systems – including electrical systems that replace today’s pneumatics and hydraulics powering everything from on-board alternators to actuators and auxiliary power units (APUs) – and reduce aircraft emissions, require new power conversion technology, explained Microchip.

It has developed the baseless power modules with Clean Sky, a joint European Commission (EC) and industry consortium, and says the BL1, BL2 and BL3 are the first aerospace-qualified baseless power modules which enable higher efficiency, lighter and more compact power conversion and motor drive systems.

The BL1, BL2 and BL3 family of baseless power modules provides greater efficiency in AC/DC and DC/AC power conversion and generation through the integration of Microchip’s silicon carbide (SiC) power semiconductor technology. They are 40 per cent lighter than other modules due to the modified substrate, reports Microchip. The design also produces an approximate 10 per cent cost savings over standard power modules that incorporate metal baseplates. Microchip’s BL1, BL2, and BL3 devices meet all mechanical and environmental compliance guidelines in RTCA DO-160G, the “Environmental Conditions and Test Procedures for Airborne Equipment,” Version G (August 2010).

The modules are available in low profile, low inductance packaging with power and signal connectors that designers can solder directly on PCBs, helping to speed development and increase reliability. According to Microchip, modules in the family have the same height which enables them to be paralleled or connected in a three-phase bridge and other topologies to achieve higher-performing power converters and inverters.

The family incorporates SiC MOSFETs and Schottky barrier diodes to maximise system efficiency. In packages delivering 100W to more than 10kW of power, the BL1, BL2, and BL3 family is available in topology options including phase leg, full bridge, asymmetric bridge, boost, buck and dual common source. The high-reliability power modules are available in voltage ranges from 600 to 1,200V in SiC MOSFETs and IGBTs to 1,600V for rectifier diodes.

Microchip’s power module technology as well as its ISO 9000- and AS9100-certified fabrication facilities provide high-quality units through flexible manufacturing alternatives.

Microchip’s baseless power modules complement its aerospace portfolio of motor drive controllers, storage ICs, FPGAs, microcontrollers, microprocessors, timing products, semiconductors and point of load (PoL) regulators for aerospace and defence applications. Microchip also provides a full portfolio of SiC technology for aerospace, automotive and industrial applications.

Microchip’s BL1, BL2 and BL3 baseless power modules are available as 75 and 145A SiC MOSFET, 50A as IGBT, and 90A as rectifier diode outputs.

http://www.microchip.com

The EKI-2701MPI-5G is a compact, industrial grade injector by Advantech which delivers Wi-Fi 6 network infrastructure, power over Ethernet (PoE) and advanced connectivity to existing infrastructure. It supports multiple data rates, i.e. 10M / 100M / 1G / 2.5G / 5G (data in) and IEEE802.3bt 90W PoE output. Advantech advised that it can be used for obsolete infrastructure applications requiring heavy network connectivity.

The EKI-2701MPI-5G supports downward-compatible 2.5 and 5Gbits per second data rates to deliver Wi-Fi 6 capabilities to existing wireless infrastructure. It also serves as a PoE power source, delivering up to 90W output to IP cameras, Wi-Fi 6 access points, and other connected devices. The injector’s PoE standard is downward- compatible for 15, 30, and 60W PoE power delivery (PD) devices, which can facilitate network infrastructure upgrades. Using the EKI-2701MPI-5G to upgrade infrastructure saves manpower while reducing cabling weight and cost, added Advantech. The downward-compatible data rate helps extend the life cycle of existing devices, the company said.

The compact, palm-sized form factor is adaptable to network infrastructure upgrades where space is limited. It is capable of delivering network service without overheating and supports a wide operating temperature range of -40 to +75 degrees C.

The injector’s force mode power supports up to 90W by DIP switch, power input of 54 to 57V DC and 90W.

The slim industrial grade metal housing is IP40-rated and is for DIN rail mounting.

Established in 1983, Advantech offers comprehensive system integration, hardware, software, customer-centric design services, embedded systems, automation products, and global logistics support. It co-operates closely with partners for a wide range of applications in diverse industries. The company’s mission is to enable an intelligent planet by developing automated and embedded computing products and solutions that facilitate smarter working and living.

http://www.advantech.com