ICs & Semiconductors Archives - Page 125 of 240

Secure microcontroller harvest energy for biometric cards

Tue, Nov 30, 2021

Energy harvesting and biometric security technologies are integrated in the ST31N600, a secure microcontroller from STMicroelectronics. It is based on an Arm SecurCore processor and can be used in biometric system-on-card (BSoC) and dynamic card verification (dCVV) systems, says the company.

The microcontroller is launched at this week’s Trustech 2021 and is designed for security in contact and contactless payment cards, ID cards, and transport ticketing.

The ST31N600, based on ST’s 40nm eSTM technology, integrates circuitry for energy harvesting and additional connectivity used by biometric and dynamic card verification (dCVV) applications. It enables battery-free smartcards to provide enhanced user authentication in contactless and online transactions. Based on the latest-generation Arm SecurCore architecture for secure microcontrollers, the ST31N600 meets EMV ISO 7816, ISO 14443, and ISO 18092 standards for contact and contactless cards. Designers can use the microcontroller to securely connect various types of peripherals to introduce value-added card features.

At Trustech 2021, it will be used to demonstrate secure biometric payment based on STPay-Topaz-Bio and dCVV for safe online transactions.

STPay-Topaz-Bio is a payment system that combines the security of biometric cardholder authentication to the speed and convenience of contactless transactions. This BSoC is based on the ST31N600 with a low power STM32L4 microcontroller, both embedded in an EMV (Eurocard Mastercard Visa) module. The ST31N600 hosts payment applications, biometric-template matching and energy harvesting to power the system.

The ST31N600 is also suitable for ecommerce payment based on dCVV technology, which provides a dynamic code refresh on each EMV transaction without needing an external battery or clock timer.

ST is showing the BSoC based on Linxens’ EMV module and pre-laminated inlay combined with a FPC T-Shape 2 (T2) sensor module from Fingerprint Cards.

There is also the dCVV which has the Ellipse EVC All-in-One, the first EMV micromodule with an integrated screen to display a dynamic security code for eCommerce protection.

Samples of the ST31N600 are available now.

http://www.st.com

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Bluetooth Low Energy microcontroller sets record for power efficiency

Tue, Nov 30, 2021

Smart sensing is incorporated in the RSL15 wireless microcontroller. According to onsemi it provides the industry’s lowest power consumption. It has Bluetooth Low Energy wireless connectivity and is designed to address the growing demand of secure, connected industrial applications which do not sacrifice.

The RSL15 supports a number of new capabilities provided by the Bluetooth 5.2 specification, including longer range, higher data transmissions and localisation through angle of arrival (AoA) and angle of departure (AoD). onsemi has also developed an innovative smart sensing feature that allows the Arm Cortex-M33 processor to remain in a deep sleep mode while still monitoring sensor interfaces.

To validate energy efficiency, the RSL15 was certified by the Embedded Microprocessor Benchmark Consortium (EEMBC). The organisation’s ULPMark-CoreMark benchmark programme measures the energy efficiency of microcontrollers used in embedded systems while active. Onsemi reports that the RSL15 leads its class by attaining a score of 60.5. The ULPMark- CoreProfile benchmark calculates the deep sleep efficiency of microcontrollers and places onsemi’s RSL10 and RSL15 in the top two spots.

“From beacons for contact tracing to trackable asset tags, there are millions of connected devices globally operating off of small batteries,” said Patrick Moorhead, CEO, founder and chief analyst at Moor Insights & Strategy.

The RSL15 is designed with ArmTrustZone technology to establish device root of trust as well as Arm CryptoCell-312 technology to protect the authenticity, integrity and confidentiality of code and data. This PSA Level 1-certified design enhances the security measures which is already offered as part of the Bluetooth protocol, providing assurance at both the application and software levels.

“The ability to protect against cyber threats is an essential differentiator for manufacturers choosing a wireless microcontroller for industrial IoT applications,” said Michel De Mey, vice president of the industrial solutions division at onsemi.

Target applications for the RSL15 are integration in a variety of industrial automation applications including connected asset tracking, smart retail and IoT edge nodes.

The RSL15 is available now in a miniature 40-pin QFN package.

https://www.onsemi.com

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Renesas introduces dual-beam active beamforming IC

Mon, Nov 22, 2021

ICs for phased array antennae in satellite comms (satcom), radar and point-to-point communications systems have been added to the portfolio of mmWave LNAs and Tx BFICs from Renesas Electronics. The company has added the F6121 and F6122 dual-beam active beamforming ICs for Ku-band satcom and the F6123 for Ku-band radar and line-of-sight communications.

They are claimed to have best-in-class power consumption, noise figure with a compact size to enable next-generation, low-latency electronically steered antennae for in-flight connectivity (IFC), maritime, satcom-on-the-move, and low earth orbit (LEO) ground terminals.

The F61xx Rx devices are believed to be the first commercial products to feature dual-beam capability for make-before-break or simultaneous multi-satellite, multi-orbit operation over the full Ku and Ka Satcom bands. The Ics offer OEMs the flexibility of LNA selection and placement for improved noise figure and system G/T performance.

“Our customers face three main challenges as they migrate from mechanical antennas to electronically steered antennas: thermal management, physical integration and affordability,” said Naveen Yanduru, vice president of RF Communications Product division at Renesas.

The second generation of F61xx dual-beam beamforming ICs address the thermal, integration, and cost challenges designers face as they transition from bulky mechanically steered antennae to the lower weight and leaner profile active electronically scanned array antennae (AESAs). The ICs deliver reduced power consumption, increased on-chip beam-state memory, and dual-beam operation (configurable for single beam with 40 per cent power savings), as well as improved RF performance, reports Renesas. They also complement the company’s sub-6GHz RFIC portfolio and the 5G mmWave product lines.

The ICs have the flexibility to support dual/single-beam, full/half-duplex, single/dual-polarisation and 1D and 2D array architectures. The compact footprint has less than four per cent panel area utilisation on Ku λ/2 grid and relaxed pitch FC-BGA package for reduced integration complexity and improved RF isolation.

The fast and flexible digital interface with on-chip beam-state memory allows for low latency antenna beam switching in under 100ns

The F6121 Rx BFIC, the F6921 LNA and F6521 Tx BFIC are in production and available now to support half-duplex and full-duplex antenna designs for Ku-band LEO and GEO ground terminals. The F6121, F6122, and F6123 ICs are available now and shipping to customers designing satcom and radar systems for 2022 deployments.

http://www.renesas.com

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Battery charger IC is designed for low voltage charging for wearables

Wed, Nov 17, 2021

A battery charger IC has been designed by Rohm for low-voltage charging. The BD71631QWZ is suitable for wearables like wireless ear buds and thin, compact IoT devices such as smart displays powered by rechargeable batteries.

The need for safer, higher density rechargeable batteries has led to the development of new battery types, including all- or semi-solid types and using novel materials for the electrode part and batteries that adopt different terminal compositions. Many of the latest rechargeable batteries are small and thin, requiring low voltage charging in the 2.0 to 3.0V range. There are currently no battery charger ICs that can handle a wide voltage range, says Rohm.

The BD71631QWZ battery charger IC supports low voltage charging of Li-ion but also new types of rechargeable batteries such as all-solid and semi-solid state models. The IC achieves low voltage charging over a wide range from 2.0 to 4.7V by improving the stability of the internal circuit

Unlike general battery charger ICs that provide a fixed voltage, the BD71631QWZ battery charger IC allows the charge voltage to be easily set by simply changing the external resistor, reducing design load when changing batteries. The original package technology results in a compact package just 0.4mm thick, which is 60 per cent lower than conventional products in this market to make devices smaller and thinner. Each charging characteristic like charge/termination current can be set for CCCV charging, providing an optimal charging environment for thin, compact IoT and wearable devices usng the latest rechargeable batteries.

In addition to devices using low voltage and single-cell Li-ion rechargeable batteries, the battery charger IC can be used in wearable devices, such as wireless ear buds, electronic pens, e-cigarettes, smart displays or tags and other compact IoT devices.

An evaluation board, BD71631QWZ-EVK-001, is also available.

Rohm Semiconductor develops and manufactures a large product range from SiC diodes and MOSFETs, analogue ICs such as gate drivers and power management ICs to power transistors and diodes to passive components.

http://www.rohm.com/eu

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Secure microcontroller harvest energy for biometric cards

Bluetooth Low Energy microcontroller sets record for power efficiency

Renesas introduces dual-beam active beamforming IC

Battery charger IC is designed for low voltage charging for wearables

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