Microchip and Acacia link to support bandwith growth

Data Centre Interconnect (DCI) and metro optical transport network (OTN) platforms are transitioning from 100/200G to 400G pluggable coherent optical modules to support bandwidth growth driven by the expansion of data centres and 5G network buildouts. Microchip Technology and Acacia, part of Cisco, are supporting this transition by bringing to market interoperable solution sets consisting of Microchip’s DIGI-G5 OTN processor and META-DX1 terabit secured-Ethernet PHY and Acacia’s 400G pluggable coherent optics.

The aim of the collaboration is to establish an ecosystem to support 400G CFP2-DCO, QSFP-DD and OSFP modules for the 400ZR specification as well as the OpenZR+ and Open ROADM multi-source agreement (MSA) applications.

For converged packet/OTN optical platforms, Microchip’s DIGI-G5 and Acacia’s 400G CFP2-DCO module are designed to enable terabit-class OTN switching line cards, muxponders, and switchponders. The DIGI-G5 interoperates with Acacia’s 400G CFP2-DCO module using a Flexible OTN (FlexO) or NxOTU4 interface to efficiently support OTN traffic, including Open ROADM MSA interface modes and 200G/400G ITU-T standards currently being drafted.    

For compact modular optical systems, Microchip’s META-DX1 and Acacia’s 400ZR and OpenZR+ modules are designed to enable 400G flexible line rate muxponders/transponders with support for multiple client optics types including QSFP28, QSFP-DD, and OSFP modules, helping service providers to transition from 100 GbE to 400 GbE using the same hardware.

For data centre routing and switching platforms, Microchip’s META-DX1 and Acacia’s 400ZR and OpenZR+ modules are designed to enable dense 400 GbE or FlexE with per port MACsec encryption coherent line cards. This helps customers leverage IP routers/switches over DWDM (IPoDWDM) infrastructure in DCI deployments.  

“DIGI-G5 and META-DX1 have enabled our optical transport, IP routing and Ethernet switching customers to implement a new class of multi-terabit OTN switching and high-density 100/400 GbE and FlexE line cards that deliver on stringent packet timing and integrated security capabilities for the build out of cloud and carrier 5G-ready optical networks,” said Babak Samimi, vice-president for Microchip’s communications business unit. “Our interoperability efforts with Acacia help to demonstrate that an ecosystem for volume deployment of these new line cards with pluggable 400G coherent optics exists.”

“With Acacia’s 400G coherent modules verified to interoperate with Microchip’s DIGI-G5 and META-DX1 devices, we see it as a robust solution designed to address network capacity growth and improved efficiency,” said Markus Weber, senior director DSP, product line management of Acacia, now part of Cisco. “The compact size and power efficiency of our 400G OpenZR+ CFP2-DCO modules were designed to help network operators deploy and scale capacity of high-bandwidth DWDM connectivity between data centres and in metro networks.”

For more information go to http://www.microchip.com and http://www.acacia-inc.com/products

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AR0821CS image sensor delivers in challenging light conditions

The AR0821CS image sensor from ONsemi provides high-quality images in challenging lighting conditions. These applications include scanners and/or readers, machine-vision cameras, high-end drones, dashboard cameras, and smart building surveillance/security systems.

The AR0821CS delivers 4K video with 8.3 MP resolution at 60 fps while consuming low power. The advanced sensor includes a 2.1 micro-Ohmn DR−Pix backside illuminated (BSI) pixel design exclusive to ONsemi, which enables high-quantum efficiency, as well as on-chip HDR (eHDR) technology that delivers dynamic range in excess of 140 dB.

A high-quality pixel design delivers detailed images even in bright daylight or low light conditions. With multiple subsampling modes, the AR0821CS optimises the amount of data transmitted to provide images at a faster rate as needed by the intended application.

The AR0821CS is supported by the AP1302 co-processor and by image signal processor (ISP) and system-on-chip (SoC) devices from ONsemi technology partners. The DevSuite software provides an integrated platform to develop AR0821CS-based camera systems. Within the DevSuite software, ONsemi provides custom firmware to enable system developers to complete their camera designs with minimal effort.

Alongside ONsemi development resources, the AR0821CS has been designed into Basler’s dart family of area scan camera modules. The dart camera series enables a wide range of image processing applications and offers the latest machine vision technology in a small format.

“The integration of the new AR0821CS sensor from ONsemi into our dart camera family is a significant step toward having a superior solution component for customer projects with HDR requirements. We have already noticed that the high-performance sensor is important for the successful implementation of new applications in light-sensitive conditions,” said Malene Fricke, head of module business at Basler.

The AR0821CS is now in production and is available through local ONsemi sales support and authorised distributors.

With a focus on automotive and industrial end-markets, ONsemi is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

For more information go to https://www.onsemi.com

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EasyPack 2B EDT2 power module for traction inverters up to 50 kW

Infineon Technologies has launched the automotive qualified EasyPack 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A RMS. The module is optimised for inverter applications in hybrid and electric vehicles.

With the introduction of the EDT2 (electric drive train) technology in this package and full automotive qualification, Infineon is now expanding the application range of the module family to include traction inverters.

The key feature of the EDT2 technology is the higher efficiency at low-load conditions. An EDT2 chip helps ensure significantly lower losses than current products on the market, says Infineon, and outperforms Infineon’s previous chip generation by 20 per cent.

Plug-and-play simplifies integration and compared to the classic through-hole discrete packages, as well as the  HybridPack 1, there Is no longer a need to solder pins.

Infineon’s PressFIT contact technology enables a reduction in mounting time and the compact package size means three EasyPack 2Bs need 30 per cent less surface area than a HybridPack 1.

The EasyPack 2B EDT2 is fully qualified to the AQG324 standard.

Over the past 10 years, Infineon has sold more than 50 million EasyPack module with various chip sets for a range of industrial and automotive applications.

The new EasyPack 2B EDT2 module FF300R08W2P2_B11A will be available starting in this month.

For more information go to http://www.infineon.com/easyinverter

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Intel expands neuromorphic research chip – introducing Loihi 2

Now with one million neurons, the second generation research chip from Intel, Loihi 2, uses a pre-production Intel 4 process. There is also now a software framework for developing neuro-inspired applications.

The second-generation chip improves the speed, programmability, and capacity of neuromorphic processing, comments Mike Davies, director of Intel’s Neuromorphic Computing Lab. Loihi 2 broaden the processing technology’s use in power and latency constrained intelligent computing applications. “We are open sourcing Lava to address the need for software convergence, benchmarking, and cross-platform collaboration in the field, and to accelerate our progress toward commercial viability,” adds Davies.

Neuromorphic computing draws insights from neuroscience to create chips that function more like the biological brain. Researchers hope that it will deliver orders of magnitude improvements in energy efficiency, speed of computation and efficiency of learning across edge applications including vision, voice and gesture recognition to search retrieval, robotics, and constrained optimisation problems. To this end, Intel and partners have demonstrated robotic arms, neuromorphic skins and olfactory sensing projects.

Advances in Loihi 2 allow the architecture to support new classes of neuro-inspired algorithms and applications and provide processing that is 10 times faster than its predecessor. It also exhibits up to 15 times greater resource density (up to one million neurons per chip), and improved energy efficiency.

Fabricated with a pre-production version of the Intel 4 process, the use of extreme ultraviolet (EUV) lithography has simplified the layout design rules compared to past process technologies for rapid development of Loihi 2, says Intel.

The Lava software is an open, modular, and extensible framework, for researchers and application developers to build on each other’s progress and converge on a common set of tools, methods, and libraries. Lava runs seamlessly on heterogeneous architectures across conventional and neuromorphic processors, and is interoperable with a variety of AI, neuromorphic and robotics frameworks.

Developers can begin building neuromorphic applications without access to specialized neuromorphic hardware and can contribute to the Lava code base, including porting it to run on other platforms.

Loihi 2’s greater programmability will allow a wider class of difficult optimisation problems to be supported, including real-time optimisation, planning, and decision-making from edge to data centre systems.

Loihi 2 also improves support for advanced learning methods, including variations of backpropagation, the algorithm of deep learning.

Fully programmable neuron models and generalised spike messaging in Loihi 2 suggest reductions of over 60 times fewer ops per inference compared to standard deep networks running on the original Loihi without loss in accuracy. It incorporates faster, more flexible, and more standard I/O interfaces, including Ethernet interfaces, glueless integration with a wider range of event-based vision sensors, and larger meshed networks of Loihi 2 chips.

http://www.intel.com

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