ICs & Semiconductors Archives - Page 111 of 230

SoC can support the Bluetooth LE spectrum, says Infineon

Wed, Jan 05, 2022

The Airoc CYW20829 Bluetooth LE (low energy) SoC is a Bluetooth 5.3 core spec-compliant device for IoT, smart home and industrial applications, introduced by Infineon. It is designed to support Bluetooth LE use cases for home automation, sensors, lighting, Bluetooth Mesh, remote controls and any other Bluetooth LE-connected IoT application, says the company.

The SoC has efficient peripheral design, low leakage silicon with scalable and efficient MIPS, and a low power Bluetooth radio, said Sonal Chandrasekharan, vice president of the Bluetooth product line at Infineon. It is claimed to offer superior RF performance for reliable, robust connections, he added.

The Airoc CYW20829 integrates a power amplifier with 10dBm of transmit output power and has receive sensitivity of -98.5 dBm for LE and -106 dBm for LE-LR 125kbits per second, making it the best link budget in Infineon’s Airoc Bluetooth portfolio. The RF performance offers reliable, robust connectivity without compromising low power, says the company, making the SoC suitable for a range of applications in smart home, smart building, medical, industrial, mesh and human interface devices (e.g., keyboard, mouse, remote control).

The CYW20829 is the first Infineon Airoc Bluetooth SoC to use the Arm Cortex M33. The Bluetooth LE sub system includes an optimised radio and an Arm Cortex M33 core as the Bluetooth controller. A second Arm Cortex M33 with a floating point unit can be clocked up to 96MHz to provide high performance compute at low power.

The application sub system has configurable serial communication blocks that can be turned into UART, I2C or SPI as needed. It also has multiple timer / counter pulse-width modulators, I2S, PDM, CAN and LIN interfaces. For security, there is a ROM-based root of trust, a TRNG, eFuse for custom keys and cryptography acceleration. The SoC also supports XIP from external flash and encryption on the fly for content on the flash.

The AIROC CYW20829 is supported by ModusToolbox – a collection of software and tools for the development of Bluetooth-enabled IoT designs.

The Airoc CYW20829 Bluetooth LE SoC is currently sampling to select customers.

http://www.infineon.com

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High resolution radar sensor monitors vehicle’s blind spots

Wed, Jan 05, 2022

Using a Doppler division multiple access (DDMA)-based signal processing method, the AWR2944 radar sensor can help automotive makers implement systems that can detect vehicles further away than is possible today. The 77GHz sensor has been announced by Texas Instruments and is supplied in a small form factor which it claims is approximately 30 per cent smaller compared to radar sensors today.

The AWR2944 sensor integrates a fourth transmitter to provide 33 per cent higher resolution than existing radar sensors, enabling vehicles to detect obstacles more clearly and avoid collisions. The DDMA signal processing improves the ability to sense oncoming vehicles at distances up to 40 per cent farther away than is currently possible.

The high resolution radar sensor will enable driver assistance technology to more accurately monitor blind spots and efficiently navigate turns and corners to safely avoid collisions for improved advanced driver assistance systems (ADAS), says the company.

According to the Federal Highway Administration, more than half of fatal and injury crashes occur at or near intersections or junctions. Texas Instruments says that the AWR2944 radar sensor can help vehicle manufacturers meet new safety regulations, enabling vehicles to detect obstacles more clearly to avoid collisions.

“Visibility around corners has historically been challenging for autonomous and semiautonomous vehicles,” concedes Curt Moore, manager for Jacinto processors at TI. “For automated parking and driving, being able to see farther with devices like the AWR2944 sensor – and then seamlessly process that data with our Jacinto processors – leads to improved awareness and safety,” he believes.

The AWR2944 and an AWR2944 evaluation module (AWR2944EVM) are available now.

Texas Instruments (TI) designs, manufactures, tests and sells analogue and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

http://www.TI.com

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Real time clock modules cut current consumption by 30 per cent

Mon, Jan 03, 2022

Compact real time clock (RTC) modules from Seiko Epson have current consumption that is reduced by 30 per cent compared to earlier modules from the company. They also have an increased number of events – 32 – that can be recorded by the time stamp function.

The RX8901CE and RX4901CE RTC modules for industrial applications feature a built-in digital temperature compensated crystal oscillator (DTCXO). Package dimensions are 3.2 x 2.5 x 1.0mm (max) which makes them the smallest RTC modules from the company.

The RX8901CE supports an I2C-bus interface and the RX4901CE supports an SPI-bus interface. They are designed for timekeeping in electronic systems which need a small form factor and low current consumption, for example, IoT devices, click-charge systems, security equipment, industrial systems.

Accurate tracking of time and date information is also needed in equipment that is installed in vehicles, outdoors, and other environments where systems are exposed to ambient temperature extremes. In addition, there is greater need for security to prevent information leaks caused by unauthorised product modification and tampering. Intrusions must be detected at all times despite the device’s low current consumption, advises Seiko Epson, which has increased demand for devices that consume less current and remain frequency-stable over a wider operating temperature range.

The RX8901CE and RX4901CE consume 0.24 microA (typical), which is 30 per cent less than the 0.35 microA (typical) consumed by the RX8804CE (an earlier equivalent Epson RTC module).

The number of time stamp records that can be kept has expanded from one to a maximum of 32. Epson also added an SPI-Bus interface, offered alongside the original I2C-Bus interface.

Epson individually adjusts and guarantees the timekeeping accuracy of modules at the factory. This renders adjustment of timekeeping accuracy unnecessary and helps to increase design efficiency and quality.

The RX8901CE and RX4901CE RTC modules are sampling now and are intended for use in smart meters and security equipment, as well as in factory automation equipment and other small electronic products.

https://www5.epsondevice.com/en

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Intel updates oneAPI tookits for cross-architecture capabilities

Thu, Dec 23, 2021

Enhanced oneAPI 2022 toolkits expand cross-architecture features to provide developers greater architectural choice to accelerate computing, says Intel.

New capabilities include what is claimed to be the world’s first unified compiler implementing C++, SYCL and Fortran, data parallel Python for CPUs and GPUs, advanced accelerator performance modelling and tuning, and performance acceleration for AI and ray tracing visualisation workloads.

The 2022 Intel oneAPI toolkits benefit from over 900 new and enhanced features, added over the course of this year. Included in the foundational and domain-specific toolkits are compilers, libraries, pre-optimised frameworks, analysers and debuggers.

One highlight is cross-architecture programming. Intel’s unified compiler implements C++, SYCL and Fortran for CPUs and GPUs utilising a common LLVM back end.

Another new feature is accelerated compute on CPUs and GPUs for the most popular programming language today, Python.

The Intel DPC++ compatibility tool has been improved to automatically migrate 90 to 95 per cent of CUDA code to SYCL/DPC++.

Intel oneAPI Toolkits are optimised to enable advanced features of the latest and upcoming new hardware, including 12th Gen Intel Core processors with AVX-VNNI, Next Gen Intel Xeon Scalable processors, codenamed Sapphire Rapids with Intel Advanced Matrix Extension (Intel AMX), and upcoming Xe client and data centre GPUs.

For AI, the deep learning framework performance has been accelerated up to 10 times over earlier versions with the latest Intel Optimization for TensorFlow and Intel Optimization for PyTorch.3

This edition also introduces the Intel Extension for Scikit-learn which speeds up machine learning algorithms more than 100 times on Intel CPUs over the stock open source version.

Another new feature is the Intel Neural Compressor which is designed to achieve increased inference performance through post-training optimisation techniques across multiple deep learning frameworks.

Advanced tools for development productivity include performance analysis for CPUs and accelerators. This includes Intel VTune Profiler’s flame graph display which helps improve the ability to visualise performance hot spots. Another tools is Intel Advisor’s accelerator performance modelling which allows developers to estimate performance benefits of offloading to a GPU before making code changes.

Advanced ray tracing has new features including cone telemetry, auxiliary feature denoising and FP16 support and there is also support future Intel Xe GPUs and real-time denoising to improve final frame, production-quality rendering.

Expanded development environment support includes deeper Microsoft Visual Studio Code integration, support for Microsoft Visual Studio 2022, and Microsoft WSL2 for Linux development on Windows.

Foundational and domain-specific toolkits are now available to download or use in the Intel DevCloud, free of charge.

The oneAPI cross-architecture programming model provides developers with tools to improve the productivity and velocity of code development when building cross-architecture applications.

An Evans Data survey reported that 40 per cent of developers target heterogeneous systems that use more than one type of processor, processor core or coprocessor. Developers can use oneAPI to choose the best hardware for a given solution without having to implement proprietary programming models, says Intel.

http://www.intel.com

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SoC can support the Bluetooth LE spectrum, says Infineon

High resolution radar sensor monitors vehicle’s blind spots

Real time clock modules cut current consumption by 30 per cent

Intel updates oneAPI tookits for cross-architecture capabilities

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