ICs & Semiconductors Archives - Page 107 of 246

NFC tags meet authentication security measures, says Infineon

Mon, Aug 08, 2022

Near field communication (NFC) tags released by Infineon Technologies meet high security requirements for proving authenticity. The NFC4TCxxx tags can protect consumer products to ensure they are not counterfeit to safeguard brand identity and revenue. In products such as pharmaceutical and food, the company pointed out, counterfeit products can pose a serious threat to consumer health and safety.

The NFC4TCxxx tag includes an open standard security architecture using AES-128 cryptography. It is also equipped with inherent resistance to physical attacks such as differential power analysis (DPA) and differential fault analysis (DFA).

The secured NFC tags have a range of memory options, from 304 bytes to 4kbytes, enabling brands to store data and create customised applications.

The tags can be programmed with brand-specific landing pages that provide additional information about the product and also show the customer a list of similar products. They can also offer two-way communication between the consumer and the brand, direct users to exclusive offers and invitations to special events while helping brands to use customer analytics to optimise products and marketing.

Infineon has also introduced the NFC 2Go starter kit which demonstrates consumer product authentication enabled by Infineon’s secured NFC tags with an NFC smartphone. The kit includes NFC stickers, iOS and Android mobile apps, back end cloud authentication software, tag personalisation tools and a user guide.

The NFC4TCxx tags and the NFC 2Go starter kit for brand protection can be ordered now.

http://www.infineon.com

> Read More

AMD and ECARX collaborate on immersive cockpit in-vehicle computing

Fri, Aug 05, 2022

AMD and mobility technology company, Ecarx, will work together on an in-vehicle computing platform for electric vehicles (EVs), expected to be in mass production in late 2023. The Ecarx digital cockpit in-vehicle platform will be offered with AMD Ryzen Embedded V2000 processors and AMD Radeon RX 6000 Series GPUs (graphic processor units) and Ecarx hardware and software.

The digital cockpit’s features will include driver information mode, heads-up display, rear seat entertainment, multiple-displays, multi-zone voice recognition, gaming and a 3D user experience.

Ecarx is AMD’s first strategic ecosystem partner in China for the digital cockpit.

“The global automotive industry is transforming towards an intelligent future at an unprecedented pace with demand for computing power and graphics capabilities rapidly increasing,” said Ziyu Shen, chairman and CEO of Ecarx. “With this collaboration, we will further enable OEMs and tier 1 suppliers to enhance their digital cockpit experiences as they seek to create greater consumer value through intelligent connected cars.”

“EV adoption is now a key underlying factor for growth in the automotive semiconductor market and the associated semiconductor demand is forecast to grow at a CAGR [compound annual growth rate] of 31 per cent over 2021 to 2026,” said Asif Anwar, executive director – PBCS and EVS, Strategy Analytics. He believes domain- and zonal-based architecture will drive adoption of the digital cockpit, ADAS (advanced driver assistance systems) and the connected vehicle.

The Ryzen Embedded V2000 Series processors are the second generation designed for automotive in-vehicle infotainment and instrumentation applications. They are also used in industrial edge, thin client and miniPC systems. The processors can power up to four independent displays simultaneously in 4K resolution; it is equipped with up to eight CPU cores and seven GPU compute units. A single AMD Ryzen Embedded V2000 Series processor provides up to two times the multi-threaded performance per Watt, up to 30 per cent better single-thread CPU performance and up to 40 per cent better graphics performance over the previous generation.

AMD Radeon RX 6000 Series GPUs are built upon the AMD RDNA 2 graphics architecture. This is, said AMD, the only graphics architecture that spans from next-generation desktop PCs, laptops and consoles to mobile devices and automotive infotainment systems. It offers up to two time higher performance) and up to 50 per cent more performance per Watt in select titles compared to the previous generation AMD RDNA architecture.

Ecarx’s current core products include infotainment head units (IHU), digital cockpits, vehicle chipsets, a core operating system and integrated software stack. It is also developing a full-stack automotive computing platform.

Its technology has been integrated into more than 3.2 million cars worldwide.

For more than 50 years, AMD has developed computing, graphics and visualisation technologies.

http://www.amd.com

> Read More

Jetson AGX Orin module supports AI and robotics development

Thu, Aug 04, 2022

To help developers bring new AI and robotics applications to market, or to support existing projects, Nvidia has released the Jetson AGX Orin 32Byte production module.

Companies in the Nvidia Partner Network are offering commercially available products powered by the new module, which provides up to a six-fold performance improvement compared with the previous generation.

Developers can build and deploy Orin-powered systems with cameras, sensors, software and connectivity for edge AI, robotics, AIoT and embedded applications, proposed Nvidia.

The company envisaged applications in manufacturing, retail and construction to agriculture, logistics, healthcare, smart cities and last-mile delivery vehicles. Production-ready systems have options for peripherals to encourage creativity.

According to Nvidia’s Jetson partner ecosystem manager, Thejas Boggaram Shivashankar, the Jetson AGX Orion allows developers and engineers to handle multiple concurrent data streams for complex application environments without strict latency requirements, energy-efficiency constraints or issues with high-bandwidth wireless connectivity.

The Jetson AGX Orin developer kit is capable of up to 275 trillion operations per second and supports multiple concurrent AI application pipelines with an Nvidia Ampere architecture GPU, together with deep learning and vision accelerators, high-speed I/O and fast memory bandwidth.

Using Jetson AGX Orin, he continued, customers can develop solutions using the largest and most complex AI models to solve problems such as natural language understanding, 3D perception and multi-sensor fusion.

The company announced four Jetson Orin-based production modules, with the Jetson AGX Orin 32Gbyte module available to purchase now, and the 64Gbyte version available in November, with two Orin NX production modules due later this year.

The production systems are supported by the Nvidia Jetson software stack to build and deploy fully accelerated AI.

The JetPack software development kit includes the Nvidia CUDA-X accelerated stack while Jetson Orin supports multiple Nvidia platforms and frameworks such as Isaac for robotics, DeepStream for computer vision, Riva for natural language understanding and TAO Toolkit to accelerate model development with pretrained models. There is also Metropolis, an application framework, set of developer tools and partner ecosystem that brings visual data and AI together to improve operational efficiency and safety across industries.

Carrier boards and full hardware systems options are available from Aaeon, Auvidea, Connect Tech, MiiVii, Plink-AI, Realtimes and TZTEK.

Over 350 camera and sensor options are available from Allied Vision, Appropho, Basler AG, e-Con Systems, Framos, Leopard Imaging, LIPS, Robosense, Shenzhen Sensing, Stereolabs, Thundersoft, Unicorecomm and Velodyne. These can support indoor/outdoor lighting conditions, as well as capabilities like lidars for mapping, localisation and navigation in robotics and autonomous machines.

Software support like device management, operating systems (Yocto and Realtime OS), AI software and toolkits, developers are available from Allxon, Cogniteam, Concurrent Realtime, Deci AI, DriveU, Novauto, RidgeRun, and Sequitur Labs.

Connectivity options, including WiFi 6/6E, LTE and 5G are offered by Telit, Quectel, Infineon and Silex.

http://www.nvidia.com

> Read More

750V SiC FETs in D2PAK extend Qorvo’s portfolio

Tue, Aug 02, 2022

Seven surface mount devices in the space saving D2PAK package have been added to Qorvo’s (formerly UnitedSiC) portfolio. The 750V SiC FETs are supplied in the surface mount D2PAK-7L package and are intended for onboard chargers, soft-switched DC/DC converters, battery charging (fast DC and industrial) and IT / server power supplies. According to Qorvo, they are suitable for high power applications that require maximum efficiency, low conduction losses and excellent cost effectiveness in a thermally enhanced package.

The Gen 4 UJ4/SC FETs are claimed to have the industry’s lowest RDS(on) of 9 mOhm at 650/750V. The 750V SiC FETs that make up the Gen 4 UJ4C/SC series are rated at 9.0, 11, 18, 23, 33, 44 and 60mOhm. According to Qorvo, this selection means that engineers have the flexibility to choose the device that can enable optimum cost/efficiency balance while maintaining generous design margins and circuit robustness.

The latest additions use the cascode SiC FET technology introduced by UnitedSiC whereby a normally-on SiC JFET is co-packaged with a Si MOSFET to produce a normally-off SiC FET for low conduction losses in a small die.

Anup Bhalla, chief engineer at Qorvo, said, “The D2PAK-7L package reduces inductance from compact internal connection loops which ─ along with the included Kelvin source connection ─ results in low switching loss, enabling higher frequency operation and improved system power density. These devices also feature silver-sinter die attach, resulting in very low thermal resistance for maximum heat extraction on standard PCBs as well as IMS [insulated metal substrates] with liquid cooling.”

The 750V Gen 4 SiC FETs are available now in the D2PAK-7L package.

Qorvo provides radio frequency (RF) products, combining technology, systems-level expertise and global manufacturing to address complex technical challenges. Qorvo serves diverse market segments, including advanced wireless devices, wired and wireless networks and defence radar and communications. It also operates in the 5G networks, cloud computing, the IoT space and other emerging applications.

http://www.qorvo.com

> Read More

NFC tags meet authentication security measures, says Infineon

AMD and ECARX collaborate on immersive cockpit in-vehicle computing

Jetson AGX Orin module supports AI and robotics development

750V SiC FETs in D2PAK extend Qorvo’s portfolio

About Smart Cities