Common source dual GaN FET is AEC-qualified for lidar systems

The latest addition to Efficient Power Conversion (EPC)’s family of automotive qualified transistors and ICs is small enough for time-of-flight (ToF) lidar applications including robotics, drones, 3D sensing and autonomous cars.

The EPC2221 is a common source dual GaN FET rated at 100V, 58 mOhm and 20A pulsed current. The FET can be also be used in surveillance systems and vacuum cleaners.

The low inductance and capacitance of the EPC2221 allows fast switching (100MHz) and narrow pulse widths (two nanoseconds) for high resolution and high efficiency.  Additionally, the small size (1.35 x 1.35mm) reduces PCB cost and total solution size, says EPC. 

This latest member of EPC’s family of GaN transistors and ICs designed to meet the performance and reliability standards of demanding automotive applications has completed AEC Q101 qualification testing including humidity testing with bias (H3TRB), high temperature reverse bias (HTRB), high temperature gate bias (HTGB), and temperature cycling (TC). 

In addition to lidar in automotive applications, the EPC2221 is suited to high-frequency DC/DC conversion, wireless power applications and synchronous rectification.

Alex Lidow, CEO and co-founder of EPC, believes this IC “improves the performance while reducing size and cost for time-of-flight lidar systems.”

The EPC2221 is available for immediate delivery from Digi-Key Electronics. 

Designers interested in replacing silicon MOSFETs with a GaN device can use the EPC GaN Power Bench’s cross reference tool to find a suggested replacement based on operating conditions.  

EPC specialises in enhancement mode GaN-based power management. The company says eGaN FETs and ICs provide performance many times greater than the best silicon power MOSFETs in applications such as DC/DC converters, remote sensing technology (lidar), motor drives for eMobility, robotics, and drones and low-cost satellites

EPC will be at PCIM Europe (10–12 May 2022) Hall 9 – Stand 113

http://www.epc-co.com

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Clock buffers and multiplexers meet PCIe Gen6 specifications

Believed to be the first clock buffers and multiplexers on the market to meet stringent PCIe Gen6 specifications, the RC190xx clock buffers and RC192xx multiplexers have been released by Renesas. 

The release comprises 11 clock buffers and four multiplexers. The devices, which also support and provide extra margin for PCIe Gen5 implementations, complement Renesas’ low-jitter 9SQ440, 9FGV1002 and 9FGV1006 clock generators for PCIe Gen6 timing for data centre / cloud computing, networking and high-speed industrial applications.

The PCIe Gen6 standard supports extremely high data rates of 64Gtransfers per second while requiring very low clock jitter performance of less than 100fs RMS. The RC190xx clock buffers and RC192xx multiplexers have PCIe Gen6 additive jitter specs of only 4fs RMS, making them virtually noiseless, says Renesas. The company claims this means they future-proof designs for the next generation of industry standards.

“PCIe Gen6 timing will be at the heart of new equipment in data centers, high-speed networking and other applications,” said Zaher Baidas, vice president of the Timing Products division at Renesas. 

“It will be interesting to see the innovative implementations that result from this new capability, especially when considering how solutions for the emerging Chiplet market are starting to evolve, with the need for increasing speed and bandwidth as an underlying constant,” comments Rich Wawrzyniak, principal analyst for Semico Research.

The PCIe Gen6 clock buffers and multiplexers offer 1.4ns in-out delay, 35ps out-out skew and -80dB PSRR (power supply rejection ratio) at 100kHz in addition to low 4fs PCIe Gen6 additive jitter. 

Selectable SMBus addresses facilitate the use of multiple devices while SMBus write-protect feature enhances system security. 

The devices represent 30 per cent space-saving compared to earlier devices, adds Renesas.

Other features are loss-of-signal (LOS) output supports system monitoring and redundancy, a four-wire side-band interface to support high speed serial output enable / disable and device daisy-chaining. In addition, power down tolerant (PDT) and flexible start-up sequencing (FSS) features ensure good behaviour under abnormal system conditions, the company claims.

The RC190xx buffers are offered in 4-, 8-, 13-, 16-, 20- and 24-output configurations. The RC192xx multiplexers include 2-, 4-, 8- and 16-output versions. They are offered in packages as small as 3.0 x 3.0mm. 

All of the new devices are available now, and Renesas also offers an evaluation board schematic. 

http://www.renesas.com

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Virtual development environment for accelerates automotive development

A virtual development environment announced by Renesas Electronics enables  development and operational evaluation of automotive application software to support the latest requirements of electrical/electronic architecture (E/E architecture). 

The environment includes a virtual turnkey platform, which allows engineers to develop application software before devices or evaluation boards are available. There is also a multi-core debug and trace tool, which enables users to analyse and evaluate software as if running on an actual chip. 

“With the evolution of E/E architecture, there is an increasing demand for software design that can maximise performance at a system level,” explains Hiroshi Kawaguchi, vice president, Automotive Software Development division at Renesas. At the same time, the increasing time and cost associated with software development have become a big challenge. “Our integrated software development environment that can be used across gateway systems, ADAS, and xEV development, enables customers to benefit from the scalability of Renesas products such as R-Car and the RH850 family for both software and hardware development.”

 The virtual turnkey platform application software development environment consists of the R-Car Virtual Platform (R-Car VPF) development environment and a software development kit (R-Car SDK) that includes pre-tested software libraries and sample code. R-Car VPF is based on Virtualizer Development Kits (VDKs) from Synopsys, and integrates virtual models of IP specific to R-Car to customise for R-Car devices. By overlaying the R-Car SDK engineers can immediately start development of application software virtually. The platform accurately recreates the behaviour of the chip and eliminates the need to build up a development environment with a physical evaluation board. Multiple users can also develop software simultaneously on separate PCs or servers.

The next step is to integrate the software and verify that it runs on a single chip. Software components share resources such as the multiple CPUs and IPs on R-Car SoCs. If operational problems are detected after the software components are integrated, it requires a tremendous amount of work to analyse and solve them, explains Renesas. The Multicore Debug and Trace tool analyses and identifies the causes of errors occurring from the interaction of the multiple hardware resources in R-Car SoCs. This enables synchronous and simultaneous debugging of the entire heterogeneous architecture of R-Car without using the actual device.

The development environment is available for the R-Car S4 SoC for automotive gateways. Renesas has plans to support the R-Car V4H as well as future versions of R-Car products and RH850 automotive MCUs.

https://www.renesas.com

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mmW 5G chipset addresses 5G NR FR2 spectrum 

Designers can reduce the complexity of 5G radio and reduce the number of components required, using a millimeter wave (mmW) 5G front-end chipset by Analog Devices. 

It comprises two single channel (1T1R) up / down converters (UDCs) and two dual polarisation 16-channel beamformer devices on a CMOS process. The power efficiency and linear output power provided by the beamformers enable size, weight, power, and cost reduction in mmW phased array designs compared to competing solutions, claims Analog Devices. The full-band UDCs with high drive level eliminate the need for frequency band variants and absorb driver stages for bill of materials savings. 

The mmW 5G front-end chipset includes four devices from Analog Devices, the ADMV4828, the ADMV4928, the ADMV1128 and ADMV1139. 

The ADMV4828 is a16-channel beamformer covering the 24 to 29.5GHz band in a single IC with more than 12.5dBm output power at three per cent error vector measurement (EVM) with a 400MHz 64QAM 5G NR (new radio) waveform while consuming only 310mW per channel.

The ADMV4928 is a 16-channel beamformer covering the 37 to 43.5GHz band in a single IC with above 11.5dBm output power at three per cent EVM with a 400MHz 64QAM 5G NR waveform while consuming only 340mW per channel.

The ADMV1128 is the company’s 24GHz to 29.5GHz wideband UDC with optional on-chip RF switch and hybrid, x2 /x4 local oscillator (LO) multiplier modes and baseband IQ support.

The fourth element is the ADMV1139, a 37 to 50GHz wideband UDC suitable for the upcoming 47GHz, as well as the 37 to 43.5GHz 5G NR bands. The single IC has optional on-chip RF switch and hybrid, with baseband IQ support.

The chipset enables seamless operation of phased array calibration functions online in the field in addition to factory non-volatile memory (NVM) through patented IP. This allows OEMs to move beyond the constraints of legacy NVM-only designs limited to one-time factory calibration of the beamformer, which does not address non-idealities external to the ICs and results in sub-optimal calibration results.

Analog Devices adds that mmW 5G deployment highlights the need for operators to expand their network footprint with more energy efficient, lightweight, and reliable radios. This requires highly linear, compact, and power efficient wideband products that allow design reuse over multiple bands without compromising on quality and performance. Analog Devices says that this mmW 5G front-end chipset allows OEMs to depart from the narrowband paradigm where competing solutions have traded-off design execution difficulty and RF performance for bandwidth, while also outsourcing critical pieces of IP such as packaging, test, and thermal modelling. 

The company also offers in-house quality management and package development, enabling engineers to create reliable, fully optimised, and customisable 5G radios quickly. 

http://www.analog.com

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