ICs & Semiconductors Archives - Page 107 of 227

JEDEC-compliant multimedia card saves space

Tue, Feb 01, 2022

Two industrial-grade, embedded multimedia cards (eMMC) have been announced by Alliance Memory. The 4Gbyte ASFC4G31M-51BIN and 8Gbyte ASFC8G31M-51BIN are designed for solid-state storage in consumer, industrial, and networking applications. Each 11.5 mm by 13 mm 153-ball FBGA package integrates NAND flash memory with an eMMC controller and flash transition layer (FTL) management software.

The devices comply with the JEDEC eMMC v5.1 industry standard, supporting boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write levelling, high-priority interrupt (HPI), secure trim / erase, and high speed HS200 and HS400 modes. The ASFC4G31M-51BIN and ASFC8G31M-51BIN are also backwards-compatible with eMMC v4.5 and v5.0.

The eMMCs will be used in products such as smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, infotainment, CCTV, surveillance, automation, point of sale (PoS) systems, and emerging embedded applications.

According to Alliance Memory, the eMMCs simplify designs for fast and easy system integration, speeding up product development and time to market. They also save space by eliminating the need for an external controller. The FTL software provides high reliability and stable performance with wear levelling and bad block management.

The ASFC4G31M-51BIN and ASFC8G31M-51BIN operate over an industrial temperature range of -40 to +85 degrees C and offer programmable bus widths of x1, x4, and x8. The devices’ NAND memory with internal LDO can be powered with a single 3.0V supply voltage, and the controller can be powered by 1.8V or 3.0V dual supply voltages.

Samples and production quantities of the eMMCs will be available in Q1 2022, with lead times of 12 weeks.

Alliance Memory provides critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes flash, DRAM, and SRAM memory ICs with commercial, industrial, and automotive operating temperature ranges and densities from 64kbit to 8Gbit.

http://www.alliancememory.com

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Zener diodes prolong battery time and save PCB space

Fri, Jan 28, 2022

Low current regulator diodes are available from Nexperia in three surface mount package options. The 50 microA Zener diodes are available in three surface mountable package options: SOT23 (BZX8450), SOD323 (BZX38450) and SOD523 packages (BZX58550) and leadless DFN1006BD-2 (BZX8850S) package.

They are also available as Q-portfolio parts, meeting the AEC-Q101 and ISO/TS16949 automotive quality standards. Nexperia explained that more non-automotive applications require additional quality-related services and extended longevity, and these needs will be met by these Q-portfolio parts.

Specified at a low test current (50 microA), the efficient diodes are ideal for low bias and portable battery-powered devices in mobile, wearable, automotive and industrial applications.

“The DFN1006BD-2 packaged parts with side-wettable flanks (SWF) address the concerns of various sectors, such as size, performance and ruggedness, and match many diverse applications,” says Paula Stümer, product manager at Nexperia.

There are 40 types per package option covering nominal working voltages from 1.8 to 75V. The Zener diodes feature a non-repetitive peak reverse power dissipation of up to or equal to 40W, total power dissipation up to or equal to 300mW and low dynamic resistance.

The DFN package dimensions are 1.0 x 0.6 x 0.47mm and are suitable for replacing bulky leaded packages on PCBs. The package can save up to 60 per cent of real estate. It features side-wettable flanks (SWF), which ensure the solder flows up the side of the chip when it is soldered onto the PCB. This technology facilitates automated optical inspection (AOI), satisfying the automotive industry’s high safety, reliability and quality requirements. The high P(tot) of the DFN-packaged Zener diodes also run cooler than leaded parts, therefore improving system reliability.

The 50 microA Zener diodes are available as samples and in volume production quantities.

Nexperia produces essential semiconductors, with an extensive portfolio which includes diodes, bipolar transistors, ESD protection devices, MOSFETs, GaN FETs and analogue and logic ICs.

Nexperia, a subsidiary of Wingtech Technology Co., Ltd. (600745.SS), has an extensive IP portfolio and is certified to IATF 16949, ISO 9001, ISO 14001 and ISO 45001. It operates in Asia, Europe and the USA.

http://www.nexperia.com

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Tasking SmartCode environment supports Aurix microcontrollers

Tue, Jan 25, 2022

Developers focusing on the Aurix TC4x microcontroller family by Infineon can use Tasking’s SmartCode software development environment.

The microcontroller family provides an upward migration path for the Aurix TC3x family. It features the next-generation TriCore 1.8 and scalable accelerators, including the parallel processing unit (PPU) as well as a single instruction, multiple data (SIMD) digital signal processor (DSP) to meet the requirements of various AI topologies, says Infineon.

The Aurix TC4x family supports developers in a range of automotive applications, including the future functional integration of domain- and zone-based E/E architectures. The microcontroller family can be used in electromobility and automated driving.

The Tasking SmartCode supports both the next-generation Aurix TriCore v1.8 instruction set and the PPU AI accelerator. According to Tasking, SmartCode is the only productive development environment with compiler that supports all architectures in the Aurix TC4x (TriCore compiler, SCR compiler, GTM compiler and PPU compiler).

Tasking SmartCode is also suitable for the development of software in safety-critical applications in accordance with ISO26262 up to ASIL D. It also meets the cybersecurity requirements of the new ISO/SAE 21434:2021 standard. Tasking offers users the associated safety/security manual so that no additional costs are incurred for tool qualification.

According to Infineon’s senior vice president, Automotive Microcontroller, Thomas Böhm: “With Tasking’s comprehensive software development tools, our customers can optimise system performance and qualify their systems quickly and cost-effectively for an ASIL-D safety concept”.

Tasking Germany provides embedded software development tools. It is headquartered in Munich, Germany.

Its development tools are used by automotive manufacturers and the world’s largest Tier 1 supplier to realise high-performance applications in safety-critical areas.

Volume production of the Aurix TC4x series is planned for the end of 2024. Samples of the TC49x were received by lead customers in 2022. The first productive version of Tasking SmartCode is available now.

http://www.tasking.com

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Ethernet PCIe bridge IC anticipates zoning in automotive networks

Thu, Jan 13, 2022

Anticipating the movement towards zonal architecture in automotive design, Toshiba Electronics Europe has developed the TC9563XBG Ethernet bridge IC.

It incorporates two 10Gbits per second Ethernet media access controllers (MACs) supporting USXGMII (universal serial 10 Gbit media independent interface), XFI (the 10Gbit serial interface), the SGMII (serial Gbit media independent interface) and the RGMII (reduced Gigabit media independent interface) Ethernet interface standards.

Both ports support Ethernet IEEE802.1 audio/video bridging (AVB) for real time processing and low latency IEEE802.1 time sensitive networking (TSN) for synchronous processing. The ports also support single root I/O virtualisation (SR-IOV) on PCIe devices.

The IC is intended for use in automotive zonal-architecture, infotainment, telematics or gateways as well as industrial equipment. Toshiba said automotive networks are evolving toward zonal architecture that requires real time transmission between the zones using multi-gigabit Ethernet communication. It developed the TC9563XBG with dual 10Gbits per second AVB and TSN-capable Ethernet interfaces for this networking technology.

The TC9563XBG includes a PCIe Gen 3 switch with three external ports for communications with the host controller SoC and additional devices equipped with PCIe interfaces like 5G-modem modules. The PCIe switch upstream port supports up to four lanes (32G transfers per second) for connection with the host SoC. Depending on the configuration, the downstream ports can connect with one and two lanes to PCIe-capable devices.

As automotive communication requirements increase in terms of the amount of data as well as the required speeds, the bridge IC will support various automotive applications including in-vehicle infotainment (IVI) and telematics. It can also replace Toshiba’s Ethernet-to-PCIe TC9560 and TC9562 bridges, to upgrade system throughput and performance.

The use of PCIe interfaces has proliferated for device-to-device communication such as Wi-Fi, which can occupy PCIe interfaces on the host SoC. Using the TC9563XBG’s three-port PCIe switch function for these connections addresses this conflict.

Housed in a 10mm x 10mm, 0.65mm pitch P-FBGA package, the TC9563XBG bridge IC will be compliant with AEC-Q100 (Grade 3).

Samples are shipping now and volume production ramp-up will be in April 2022.

http://www.toshiba.semicon-storage.com

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JEDEC-compliant multimedia card saves space

Zener diodes prolong battery time and save PCB space

Tasking SmartCode environment supports Aurix microcontrollers

Ethernet PCIe bridge IC anticipates zoning in automotive networks

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