Components & Connectors Archives - Page 40 of 80

Force rebalance MEMS accelerometer reduces weight in navigation systems

Fri, Oct 15, 2021

Designed for challenging environments, the Tronics AXO315 force-rebalance digital MEMS accelerometer withstands severe temperature and vibration conditions experience in industrial, land, rail, navy, oil and gas and construction applications, says TDK.

The one-axis, closed looped digital MEMS sensor has a ±14g range. The in-plane linear accelerometer achieves a one-year composite repeatability of 1mg, and a 600ppm composite scale factor repeatability over temperatures ranging from -55 to +105 degrees C and under 4g vibrations.

In addition to vibration rejection, it exhibits superior Allan variance characteristics, says TDK, with a basis instability of 4.0 microg, a velocity random walk of 0.006m per second per sq root h and a very low noise of 15 microg/ sq root Hz, for high resolution and low error.

Its performance is equivalent to the incumbent analogue quartz accelerometers and mechanical inclinometers, but at a fraction of their size, weight, and price, says TDK, resulting in a reduction in size, weight and cost of materials in servo inclinometers and dynamic inclinometers in industrial motion control units, as well as inertial measurement units (IMUs) and inertial navigation systems (INS) for GNSS-aided positioning, navigation of manned and unmanned ground vehicles and trains.

The AXO315 features a force-rebalance architecture, a 24-bit digital SPI in an SMD package. It is also claimed to outperform all commercially available MEMS sensors components and offers easier integration compared to analogue sensors.

It is supplied in lightweight 1.4g hermetic SMD J-lead ceramic package (12 x 12 x 5.0mm), enabling low-cost assembly and reliability on PCB, even in fast-changing temperature conditions.

The sensor can be evaluated with an Arduino-based evaluation kit that is specifically designed to provide developers with improved testing functionalities such as output reading and recording, recalibration and digital self-tests.

Both sensor and evaluation kit are available from Digi-Key, Mouser and Farnell and its affiliates Newark and Element 14.

https://www.tronics.tdk.com

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TDK offers miniaturised, highly sensitive MEMS pressure sensor element

Fri, Oct 08, 2021

Designed to measure a range of 0 to 100 mbar, TDK Corporation’s C35 type pressure sensor element combines high sensitivity with low dimensions of 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

The pressure sensor element with ordering code B58601E35 works according to the piezoresistive principle via a Wheatstone bridge and is certified for an operating voltage of up to 10 V.

Offering a high sensitivity of 110 mV/V/bar, C35 is suitable for applications with high demands of sensitivity, accuracy and long-term stability of 0.1% FSON.

Furthermore, C35 is designed for a wide temperature range from -40 degrees C to +150 degrees C and is suitable for pressure measurements of non-aggressive gases and liquids. The main uses are in applications that require high reliability and extremely precise pressure measurement, such as medical engineering and the industrial and automotive sectors.

TDK Corporation is a leader in electronic solutions for the smart society based in Tokyo, Japan. It was established in 1935 to market ferrite, a key material in electronic and magnetic products.

The company’s portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The range of products also includes sensors and sensor systems such as temperature and pressure, magnetic and MEMS sensors.

In addition, TDK provides power supplies and energy devices and magnetic heads. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda.

TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.

In fiscal 2021, TDK posted total sales of $13.3 billion and employed about 129,000 people worldwide.

For more information go to

https://www.tdk-electronics.tdk.com/en/pressure_sensor_elements

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ST and Rosenberger unite to develop high-speed contactless connector based on 60GHz wireless technology

Wed, Oct 06, 2021

STMicroelectronics and Rosenberger, a leading manufacturer of impedance-controlled and optical connectivity solutions, are to collaborate on a contactless connector for ultra-reliable, short-range, point-to-point full-duplex data exchanges in industrial and medical applications.

Rosenberger’s RoProxCon, leverages ST’s 60GHz RF transceiver, the ST60A2, to deliver high-speed data transmission while providing immunity to movement, vibration, rotation and contaminants such as moisture and dust, which can disrupt conventional pin-and-receptacle interconnects.

The STMicroelectronics ST60A2 offers reliable, point-to-point, high-data-rate transmission of up to 6.25 Gbps over distances of a few centimetres at low power. The new connector will suit applications in smart factories, medical technology, connected devices, office equipment, conveyer technology and renewable energies.

Operating over an extended temperature range of -40 to +105 degrees C, the chip ST60A2 is suited to industrial markets. With a 2.2 x 2.2 mm package footprint, the chip offers an ultra-low power consumption of 70mW for a reliable, completely contactless link.

“Pairing ST’s contactless connectivity technology with our interconnect expertise and antenna-design knowledge enabled us to create a first-of-its-kind module that transmits full duplex data at up to 6 Gbps with complete rotational freedom,” said Folke Michelmann, executive vice-president medical and industries at Rosenberger.

“In working with ST, we see limitless application possibilities for our connector, which provides high-reliability and high-throughput at low power.”

STMicroelectronics RF&Communications division general manager Laurent Malier said: “We developed the ST60A2 contactless transceiver to allow customers to create reliable, high data-rate, extremely power-efficient wireless links. Rosenberger’s expertise in interconnects combined with our RF chip is an outstanding example of the value of the technology.”

“Customers across the full range of electronics applications have expressed interest in this transceiver and several have shared their need for a module that includes the antenna.”

Rosenberger’s portfolio includes solutions in high-frequency, high-voltage, and fibre optic technology for mobile communication networks, data centres, test and measurement applications, automotive electronics as well as for high-voltage contact systems, medical electronics an aerospace engineering.

As independent device manufacturer, STMicroelectronics works with more than 100,000 customers and thousands of partners to design and build products, solutions and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world.

For more information go to http://www.rosenberger.com and http://www.st.com

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Reference design develops 3D spatial audio in headsets and earbuds

Fri, Oct 01, 2021

Three companies have collaborated to bring 3D spatial audio hardware and software together in a reference design for consumer electronics OEMs and ODMs.

Wireless connectivity and smart sensing specialist, Ceva, has partnered with wireless communications company, Beken and 3D spatial audio expert, VisiSonics to offer a 3D audio reference design to accelerate development and deployment of headsets and true wireless stereo (TWS) earbuds for use in gaming, multimedia and conferencing.

The reference design leverages Beken’s BK3288X Bluetooth Audio SoC series featuring the Ceva-X2 Audio DSP running VisiSonics’ RealSpace 3D audio software, together with Ceva’s MotionEngine Hear head tracking algorithms. OEMs and ODMs can use the ready-to-deploy SoC with any audio encoding format, to introduce 3D audio for VR, AR and the new generation of motion-aware earbuds. The single chip-based reference design provides a self-sufficient 3D audio solution, residing on the headset side, without the need for a 3D audio rendering engine on the host device. As well as being cost-efficient, this also enables a lower latency design, says Ceva.

Weifeng Wang, vice president of engineering at Beken, comments: “Spatial audio brings the wireless audio user experience to the next level and we’re pleased to partner with Ceva and VisiSonics to make it easy for our customers to leverage this exciting new technology in a cost-effective, power-efficient turnkey offering”.

“Spatial audio is an incredibly hot market right now as the Android and PC ecosystems look to build on the industry momentum behind its use in music and gaming to create immersive audio experiences,” adds Moshe Sheier, vice president of marketing at Ceva.

The 3D Audio Reference Design is available now directly from Ceva, and the associated software package combining VisiSonics’ RealSpace 3D audio with Ceva’s MotionEngine Hear is available now for licensing by Ceva and VisiSonics.

Ceva licenses wireless connectivity and smart sensing technologies. It provides DSPs, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence.

DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio / voice / speech and low-power always-on / sensing applications for multiple IoT markets.

https://www.ceva-dsp.com

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Force rebalance MEMS accelerometer reduces weight in navigation systems

TDK offers miniaturised, highly sensitive MEMS pressure sensor element

ST and Rosenberger unite to develop high-speed contactless connector based on 60GHz wireless technology

Reference design develops 3D spatial audio in headsets and earbuds

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