Nexperia extends DFN packaging to AEC-Q101-compliant discretes
Discrete components from Nexperia are now available in miniature DFN packaging with side-wettable flanks. The company has introduced the AEC-Q101-compliant components to save board space in automotive designs.
The components are intended for applications in smart and electric vehicles, explained the company, with AEC-Q101 devices available cuts across all Nexperia’s product groups.
The new releases are the BC817QBH-Q and BC807QBH-Q series 45V, 500mA NPN / PNP general purpose transistors in a DFN1110D-3 package. There is also the BAT32LS-Q and BAT42LS-Q general purpose Schottky diode in a DFN1006BD-2
package and the BAS21LS-Q high-speed switching diode in a DFN1006BD-2 package.
Nexperia has also introduced the PDTA143 / 114 / 124 / 144EQB-Q series 50V 100mA PNP resistor-equipped transistor (RET) family in the DFN1110D-3 package.
Finally, there are two trench MOSFETs, the 2N7002KQB 60V and the BSS84AKQB 50V, P-channel devices, both in the DFN1110D-3 package.
According to Nexperia, leadless DFN packages are up to 90 per cent smaller than SOT23 packages, contributing to a reduction in the amount of board space required for an increasing number of electronic components in vehicles. The side-wettable flank offers very reliable automated optical inspection (AOI) of solder joint quality, added the company. Nexperia’s DFN packages deliver thermal performance with high Ptot and are claimed to be the most rugged in the industry passing extended lifetime and reliability tests.
Nexperia claims to offer the widest range of AEC-Q101 qualified discrete components in these miniature leadless packages. According to Mark Roeloffzen, senior vice president and general manager of Nexperia’s Bipolar Discretes business group, more than 460 different high volume devices are available in the recently released DFN1412D-3, DFN1110D-3, and DFN1006BD-2 packages. “By offering even more devices in these miniature packages, Nexperia provides design engineers with greater opportunities to make their designs future-proof, having an impact on the mobility of the future,” he said.
The new technology already has design-in and commitment from major Tier 1 automotive suppliers, he added.
Samples and production quantities are available now.